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onsemi SZESD8551MXWT5G
- Part No.:
- SZESD8551MXWT5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 2-XDFN
- Datasheet:
-
SZESD8551MXWT5G.pdf
- Description:
- TVS DIODE 3.3VWM 16VC 2X2DFNW
- Quantity:
- Payment:
- Shipping:
Inventory:5,771
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Product details
Overview
SZESD8551MXWT5G from onsemi is an automotive-grade, AEC-Q101-qualified ESD protection diode in a wettable flank X2DFNW2 package, designed for high-speed data lines with 3.3 V working voltage, 0.30 pF max capacitance at 1 MHz, and ±20 kV IEC 61000-4-2 contact ESD immunity. It protects USB 3.0, MHL 2.0, and eSATA interfaces against electrostatic discharge.
For engineers reviewing the SZESD8551MXWT5G datasheet, pinout, applications, or equivalent options, key selection criteria include ultra-low capacitance (<0.3 pF), low clamping voltage (9.0 V @ 8 A TLP), wettable flank package for AOI compatibility, AEC-Q101 qualification, and latch-up-free operation in USB 3.0 SuperSpeed channels.
Technical Context
The SZESD8551MXWT5G employs a snap-back SCR structure optimized for high-speed serial interfaces, delivering fast turn-on response and stable clamping without latch-up in USB 3.0 SS, DisplayPort, and USB 2.0 HS/FS applications. Its dynamic resistance is 0.84 Ω, enabling tight voltage control under transient current.
It meets IEC 61000-4-2 Level 4 (±20 kV contact) and ISO 10605 (±30 kV, 150 pF/2 kΩ), with clamping voltage specified at 9.0 V for 8 A TLP pulses and 16.0 V for 16 A - matching IEC Level 4 surge conditions. Junction capacitance remains below 0.25 pF up to 2.5 GHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Voltage | 3.3 V - matches standard USB 3.0 and eSATA I/O rail voltage, ensuring no DC loading or signal distortion. |
| Capacitance (1 MHz) | 0.20–0.30 pF - preserves signal integrity on >5 Gbps differential links by minimizing insertion loss and crosstalk. |
| Clamping Voltage | 9.0 V @ 8 A TLP - limits transient overvoltage to safe levels for 3.3 V transceivers during ESD events. |
| ESD Rating | ±20 kV IEC 61000-4-2 contact - exceeds industrial and automotive system-level ESD immunity requirements. |
| Operating Temp | −55 °C to +125 °C - supports under-hood and industrial ambient environments per AEC-Q101 stress testing. |
| Package | X2DFNW2 (1.00 × 0.60 × 0.37 mm, 0.65 mm pitch) - wettable flank design enables automated optical inspection of solder joints. |
Pinout & Package
X2DFNW2 is a 2-terminal, dual-anode/dual-cathode symmetric SOD-923F variant with wettable flank side walls. The package has no polarity marking; terminals are bidirectional and interchangeable for I/O-to-GND protection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode / I/O Node | Connects to protected high-speed data line (e.g., USB 3.0 TX+/RX+); bidirectional conduction path. |
| Pin 2 | Cathode / GND Reference | Low-inductance connection to system ground plane; critical for effective ESD current shunting. |
Key Features
| Feature | Design Value |
|---|---|
| Wettable Flank Package | Enables 100% AOI verification of solder fillet formation on both side walls - essential for automotive process control. |
| AEC-Q101 Qualification | Validated across temperature cycling, HTRB, AC-H3TRB, and ESD stress - required for automotive infotainment and ADAS modules. |
| Latch-Up Free Operation | Guaranteed for USB 3.0 SuperSpeed (5 Gbps) lanes per load-line analysis - eliminates risk of sustained short-circuit failure. |
| Ultra-Low Capacitance | 0.19–0.25 pF at 2.5 GHz - maintains return loss >15 dB and insertion loss <−1 dB up to 10 GHz per S21 measurements. |
Applications
| USB 3.0 Interface Protection | MHL 2.0 Video Link Protection |
|---|---|
|
Use Scenario: Protecting differential SuperSpeed TX/RX pairs in laptop docking stations and external storage enclosures exposed to user-handling ESD. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector entry point, before serializer IC. Use Value: Prevents damage to USB 3.0 PHY transceivers while maintaining eye diagram compliance at 5 Gbps due to sub-0.25 pF capacitance. |
Use Scenario: Shielding MHL 2.0 high-definition video signals routed between smartphones and displays in automotive head units. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp on each differential MHL lane (CLK, D0+, D0−, etc.), referenced to chassis ground. Use Value: Ensures signal integrity up to 3 Gbps with <−12 dB return loss at 1.5 GHz and passes CISPR 25 Class 5 radiated emissions testing. |
| eSATA Data Line Protection | Industrial Embedded SATA Interface |
|
Use Scenario: Safeguarding hot-pluggable eSATA ports on NAS devices and industrial PCs subjected to frequent cable insertion/removal. IC Role / Device Role / Timing Role: I/O-to-GND ESD diode placed within 3 mm of connector, minimizing trace inductance for optimal clamping. Use Value: Delivers 16.0 V clamping at 16 A TLP - sufficient to absorb full IEC Level 4 surges without degrading SATA III 6 Gbps signal rise time. |
Use Scenario: Protecting SATA interfaces in ruggedized medical imaging systems operating in −40 °C to +85 °C extended temperature range. IC Role / Device Role / Timing Role: AEC-Q101-qualified ESD device used in non-automotive industrial designs requiring long-term supply stability and PPAP documentation. Use Value: Provides guaranteed −55 °C to +125 °C operation and RoHS/halogen-free compliance for global medical regulatory submissions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD8551N2T5G | Same die, X2DFN2 package (non-wettable flank); identical electrical specs and AEC-Q101 qualification. | Lacks AOI-compatible side walls; unsuitable for automotive production lines requiring 100% solder-joint inspection. | Select when cost sensitivity outweighs AOI requirement and board-level rework is acceptable. |
| ESD8006MUTAG | 0.25 pF max capacitance, 3.3 V VRWM, but uses X2DFN2 package and lacks wettable flank; rated for USB 3.0 and DisplayPort only. | Not AEC-Q101 qualified; limited to commercial/industrial use; lower ESD rating (±15 kV contact). | Choose for non-automotive USB 3.0 designs where AEC-Q101 and AOI are not mandated. |
Compared with ESD8551N2T5G and ESD8006MUTAG, the SZESD8551MXWT5G uniquely combines automotive qualification, wettable flank geometry, and full IEC Level 4 immunity - making it the only option for zero-defect automotive USB 3.0 module production.
Availability
SZESD8551MXWT5G is available at Aetrix Electronics and suitable for USB 3.0 interface protection, automotive infotainment systems, and industrial embedded SATA applications requiring stable component supply, long-term lifecycle support, and AEC-Q101-compliant sourcing.
Supply support for SZESD8551MXWT5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi is a global semiconductor supplier specializing in energy-efficient power, analog, sensing, and connectivity solutions for automotive, industrial, cloud, and consumer markets.
The SZESD8551MXWT5G belongs to onsemi's ESD8000 series of snap-back SCR-based protection devices, engineered specifically for latch-up-free, ultra-low-capacitance ESD shielding of multi-gigabit serial interfaces.
FAQ
What is the primary circuit role of the SZESD8551MXWT5G?
The SZESD8551MXWT5G functions as a bidirectional, low-capacitance ESD protection diode placed between a high-speed data line (e.g., USB 3.0 TX+) and ground. Its role is to clamp transient voltages during electrostatic discharge events while introducing negligible signal distortion - confirmed by its 0.20–0.30 pF capacitance and 9.0 V clamping voltage at 8 A TLP. The SZESD8551MXWT5G achieves this using a snap-back SCR structure that avoids latch-up in USB 3.0 SuperSpeed applications.
Is the SZESD8551MXWT5G qualified for automotive applications?
Yes, the SZESD8551MXWT5G is AEC-Q101 qualified and PPAP capable, with full stress test reporting including temperature cycling, HTRB, and ESD robustness validation. The "SZ" prefix explicitly denotes automotive-grade manufacturing controls and site-specific change management. Its −55 °C to +125 °C operating junction temperature range and wettable flank X2DFNW2 package further support automotive production requirements such as AOI and under-hood thermal reliability.
Does the SZESD8551MXWT5G support HDMI or DisplayPort interfaces?
The SZESD8551MXWT5G is latch-up free for DisplayPort but explicitly excluded for HDMI 1.3a/1.4 TMDS applications per onsemi's load-line analysis in the datasheet. While it meets electrical specs for DisplayPort (3.6 V VBR min, 25 mA IH min), HDMI requires higher holding current and different SCR characteristics - hence onsemi recommends ESD8104 or ESD8040 instead. The SZESD8551MXWT5G remains valid for USB 3.0, MHL 2.0, and eSATA.
What does "wettable flank" mean for the SZESD8551MXWT5G package?
"Wettable flank" refers to the vertical sidewall plating on the X2DFNW2 package of the SZESD8551MXWT5G, which allows molten solder to wick up the side during reflow, forming a visible fillet. This enables automated optical inspection (AOI) systems to verify solder joint quality - a mandatory requirement in automotive electronics manufacturing. Unlike standard X2DFN2 packages, the wettable flank geometry provides process traceability and zero-defect assembly assurance for the SZESD8551MXWT5G.
How does the clamping performance of SZESD8551MXWT5G compare across test methods?
The SZESD8551MXWT5G specifies 9.0 V clamping voltage at 8 A TLP (equivalent to IEC Level 2) and 16.0 V at 16 A TLP (equivalent to IEC Level 4). These values are measured under standardized transmission line pulse conditions (100 ns pulse, 4 ns rise time) and correlate directly to real-world IEC 61000-4-2 contact discharge events. The clamping voltage is calculated as VC = VHOLD + (IPP × RDYN), where VHOLD = 2.05 V and RDYN = 0.84 Ω - confirming predictable, repeatable suppression behavior for the SZESD8551MXWT5G.
SZESD8551MXWT5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 2-XDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 5.5V
- Voltage - Clamping (Max) @ Ipp:
- 16V (Typ)
- Current - Peak Pulse (10/1000µs):
- 16A
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- USB 3.0
- Capacitance @ Frequency:
- 0.3pF @ 1MHz (Max)
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 2-X2DFNW (1x0.6)
SZESD8551MXWT5G FAQ
1.How can I place an order for SZESD8551MXWT5G through Aetrix?
Please submit a Request for Quotation (RFQ) for SZESD8551MXWT5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SZESD8551MXWT5G reliable?
The price and inventory of SZESD8551MXWT5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SZESD8551MXWT5G is usually 5 days.
3.What payment methods are accepted for SZESD8551MXWT5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SZESD8551MXWT5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SZESD8551MXWT5G?
SZESD8551MXWT5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SZESD8551MXWT5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SZESD8551MXWT5G?
For technical support, including SZESD8551MXWT5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SZESD8551MXWT5G requirements.
6.How does Aetrix verify that SZESD8551MXWT5G is sourced from the original manufacturer or authorized distributors?
All SZESD8551MXWT5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SZESD8551MXWT5G meets industry standards.
7.What is the process for return or replacement of SZESD8551MXWT5G?
All SZESD8551MXWT5G units undergo pre-shipment inspection (PSI). If there is an issue with SZESD8551MXWT5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SZESD8551MXWT5G part is unused and in its original packaging.
Return procedure for SZESD8551MXWT5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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