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onsemi SZESD8551N2T5G

Part No.:
SZESD8551N2T5G
Manufacturer:
onsemi
Category:
TVS Diodes
Package:
2-XDFN
Datasheet:
AetrixSZESD8551N2T5G.pdf
Description:
LOW CAP SNAPBACK ESD PROTECTION
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,282

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Product details

Overview

SZESD8551N2T5G from onsemi is an automotive-grade, AEC-Q101-qualified ESD protection diode in X2DFN2 package, designed for high-speed data lines including USB 3.0 and DisplayPort. It delivers ultra-low 0.30 pF max junction capacitance (at 1 MHz), 3.3 V reverse working voltage, and clamps ±8 kV IEC 61000−4−2 contact ESD transients to ≤16.0 V at 16 A peak pulse current.

For engineers reviewing the SZESD8551N2T5G datasheet, pinout, applications, or equivalent options, key selection criteria include low-capacitance signal integrity preservation, latch-up-free operation on USB 3.0 SS and DisplayPort lanes, and compliance with IEC 61000−4−2 Level 4 and ISO 10605 standards.

Technical Context

The SZESD8551N2T5G employs a snap-back SCR-based structure optimized for high-speed interfaces, with verified latch-up immunity on USB 3.0 SuperSpeed and DisplayPort channels per load-line analysis. Its dynamic resistance of 0.84 Ω ensures tight clamping control during fast ESD events.

It operates across −55 °C to +125 °C junction temperature range and supports automated optical inspection via standard X2DFN2 footprint. The device meets AEC-Q101 stress testing requirements and is Pb-free, halogen-free, and RoHS compliant.

Key Specifications

Parameter Value and Actual Design Meaning
Reverse Working Voltage 3.3 V - Matches nominal USB 3.0 and DisplayPort supply rails without leakage-induced signal distortion.
Junction Capacitance (1 MHz) 0.20–0.30 pF - Preserves >5 Gbps signal integrity with minimal insertion loss on high-speed differential pairs.
Clamping Voltage (IEC 61000−4−2) ≤16.0 V @ ±8 kV contact - Limits transient overvoltage below IC I/O absolute maximum ratings during real-world ESD events.
Breakdown Voltage 5.5–8.3 V @ 1 mA - Ensures reliable turn-on only during ESD surges, not during normal 3.3 V operation.
ESD Rating ±20 kV air / ±20 kV contact (IEC 61000−4−2 Level 4) - Exceeds industrial and automotive system-level ESD immunity requirements.
Dynamic Resistance 0.84 Ω - Enables predictable clamping behavior and stable voltage suppression across 8–16 A TLP test currents.

Pinout & Package

Package: X2DFN2 (Case 714AB), 1.00 mm × 0.60 mm × 0.37 mm, 0.65 mm pitch, wettable flank not present (SZESD8551MXWT5G variant has wettable flank; this part does not).

Pin/Terminal Circuit Role Design Meaning
Pin 1 I/O Line Anode Connected to protected high-speed data line (e.g., USB 3.0 TX+/RX+); conducts ESD current to ground during positive transients.
Pin 2 GND Cathode Common ground return path for bidirectional ESD current; must be low-inductance connection to system ground plane.

Key Features

Feature Design Value
AEC-Q101 qualified & PPAP capable Validated for automotive infotainment and ADAS data links requiring zero-defect reliability and production traceability.
0.30 pF max capacitance (1 MHz) Minimizes signal rise-time degradation and crosstalk on 5+ Gbps serial interfaces without requiring layout compensation.
Latch-up free on USB 3.0 SS Guaranteed stable operation under USB 3.0 SuperSpeed load-line conditions-no risk of sustained conduction after ESD event.
±20 kV IEC 61000−4−2 air/contact Meets or exceeds stringent system-level ESD immunity targets for consumer, industrial, and automotive end equipment.

Applications

USB 3.0 SuperSpeed Interface DisplayPort 1.2/1.4

Use Scenario: Protecting differential TX/RX pairs in laptop docking stations and external SSD enclosures against user-handling ESD.

IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector entry point, shunting ESD energy to chassis ground.

Use Value: Maintains <1% signal attenuation at 5 GHz while clamping ±8 kV contact discharges to <16 V-preserving link training and bit error rate performance.

Use Scenario: Safeguarding DisplayPort source (GPU) and sink (monitor) side lanes in thin-client workstations and digital signage.

IC Role / Device Role / Timing Role: Low-capacitance rail-to-rail clamp on each DP++ lane, enabling hot-plug robustness without degrading 8.1 Gbps eye diagram.

Use Value: Enables full compliance with DP v1.4a ESD immunity requirements (IEC 61000−4−2 Level 4) without sacrificing bandwidth or adding series impedance.

eSATA Gen II MHL 2.0 Link

Use Scenario: Shielding eSATA host controller and drive-side connectors in ruggedized storage subsystems used in factory automation.

IC Role / Device Role / Timing Role: Point-of-entry ESD clamp on differential SATA data lines, operating within 3.3 V supply domain.

Use Value: Prevents latch-up and permanent damage during field ESD events while maintaining <0.3 dB insertion loss up to 3 GHz-critical for 3 Gbps link stability.

Use Scenario: Securing MHL 2.0 video/audio interface between smartphones and HDMI displays in mobile docking solutions.

IC Role / Device Role / Timing Role: Dual-directional protection element on MHL's single-lane high-speed channel, compatible with 3.3 V logic levels.

Use Value: Delivers <0.25 pF typical capacitance at 2.5 GHz-ensuring MHL 2.0's 2.25 Gbps data rate remains unaffected by parasitic loading.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
ESD8551N2T5G Non-automotive grade; same electrical specs but lacks AEC-Q101 qualification and PPAP support. Approved for commercial USB 3.0/DisplayPort designs; not certified for automotive production. Select when automotive qualification is unnecessary and cost sensitivity is higher.
ESD8006MUTAG 0.25 pF max capacitance; 3.6 V VRWM; rated for DisplayPort and USB 3.0 but not AEC-Q101 qualified. Optimized for lower-voltage systems; slightly tighter capacitance spec but no automotive validation. Prefer for non-automotive DisplayPort applications where sub-0.25 pF is critical and AEC-Q101 is not required.

Compared with ESD8551N2T5G and ESD8006MUTAG, SZESD8551N2T5G uniquely combines automotive qualification, latch-up immunity on USB 3.0 SS, and guaranteed 0.30 pF max capacitance-making it the only choice for Tier-1 automotive infotainment data line protection where both reliability and signal fidelity are mandatory.

Availability

SZESD8551N2T5G is available at Aetrix Electronics and suitable for USB 3.0 SuperSpeed interfaces, DisplayPort 1.2/1.4 links, and eSATA Gen II applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade traceability.

Supply support for SZESD8551N2T5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.

SZESD8551N2T5G belongs to the ESD8000 series of ultra-low-capacitance SCR-based ESD protection devices, engineered specifically for latch-up-free safeguarding of multi-gigabit serial data interfaces in harsh environments.

FAQ

What is the primary circuit role of the SZESD8551N2T5G in a USB 3.0 design?

The SZESD8551N2T5G serves as a bidirectional transient voltage suppressor on USB 3.0 SuperSpeed differential lanes, placed immediately adjacent to the connector to shunt ESD energy to ground before it reaches the PHY. Its 0.30 pF capacitance and latch-up-free operation ensure signal integrity is preserved while meeting IEC 61000−4−2 Level 4 immunity-making SZESD8551N2T5G essential for robust, high-yield USB 3.0 implementations.

Does the SZESD8551N2T5G meet AEC-Q101 requirements for automotive use?

Yes, the SZESD8551N2T5G is explicitly AEC-Q101 qualified and PPAP capable, as confirmed in the official onsemi datasheet (Rev. 6, February 2024). This certification covers temperature cycling, HTRB, AC/DC life tests, and ESD robustness-validating SZESD8551N2T5G for deployment in automotive infotainment, telematics, and ADAS data interfaces where zero-defect reliability is mandated.

Can the SZESD8551N2T5G be used to protect HDMI TMDS lines?

No, the SZESD8551N2T5G is not recommended for HDMI TMDS applications due to latch-up risk, as stated in the onsemi datasheet (page 4). Load-line analysis shows potential dual-stable operating points on HDMI 1.4/1.3a channels. For HDMI, onsemi recommends ESD8104 or ESD8040-so SZESD8551N2T5G must be avoided in HDMI designs despite its high-speed capability.

What is the maximum clamping voltage of the SZESD8551N2T5G under IEC 61000−4−2 Level 4 stress?

Under ±8 kV IEC 61000−4−2 contact discharge (Level 4), the SZESD8551N2T5G clamps to ≤16.0 V at 16 A peak pulse current, as specified in the Electrical Characteristics table. This value is derived from VC = VHOLD + (IPP × RDYN), using VHOLD = 2.05 V and RDYN = 0.84 Ω-ensuring protected ICs remain within safe voltage margins during worst-case ESD events.

Is the SZESD8551N2T5G compatible with automated optical inspection (AOI)?

The SZESD8551N2T5G uses the X2DFN2 package (Case 714AB), which lacks wettable flanks and is not optimized for AOI. In contrast, the SZESD8551MXWT5G variant uses X2DFNW2 (Case 711BG) with wettable flanks for enhanced solder-joint inspection. Therefore, SZESD8551N2T5G requires alternative process verification methods-not AOI-during SMT assembly.

SZESD8551N2T5G Specifications

Product attributes
Attribute value
Manufacturer:
onsemi
Package/Case:
2-XDFN
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
-
Bidirectional Channels:
1
Voltage - Reverse Standoff (Typ):
3.3V (Max)
Voltage - Breakdown (Min):
5.5V
Voltage - Clamping (Max) @ Ipp:
16V (Typ)
Current - Peak Pulse (10/1000µs):
16A
Power - Peak Pulse:
-
Power Line Protection:
No
Applications:
USB 3.0
Capacitance @ Frequency:
0.3pF @ 1MHz (Max)
Operating Temperature:
-55°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
2-X2DFN (1x0.6)

SZESD8551N2T5G FAQ

1.How can I place an order for SZESD8551N2T5G through Aetrix?

Please submit a Request for Quotation (RFQ) for SZESD8551N2T5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SZESD8551N2T5G reliable?

The price and inventory of SZESD8551N2T5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SZESD8551N2T5G is usually 5 days.

3.What payment methods are accepted for SZESD8551N2T5G?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SZESD8551N2T5G transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SZESD8551N2T5G?

SZESD8551N2T5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SZESD8551N2T5G order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SZESD8551N2T5G?

For technical support, including SZESD8551N2T5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SZESD8551N2T5G requirements.

6.How does Aetrix verify that SZESD8551N2T5G is sourced from the original manufacturer or authorized distributors?

All SZESD8551N2T5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SZESD8551N2T5G meets industry standards.

7.What is the process for return or replacement of SZESD8551N2T5G?

All SZESD8551N2T5G units undergo pre-shipment inspection (PSI). If there is an issue with SZESD8551N2T5G, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SZESD8551N2T5G part is unused and in its original packaging.

Return procedure for SZESD8551N2T5G:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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