onsemi SZESD9B3.3ST5G
- Part No.:
- SZESD9B3.3ST5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- SOD-923
- Datasheet:
-
SZESD9B3.3ST5G.pdf
- Description:
- TVS DIODE 3.3VWM 11.5VC SOD923
- Quantity:
- Payment:

- Shipping:

Inventory:25,064
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SZESD9B3.3ST5G from onsemi is a bi-directional ESD protection diode designed to safeguard I/O lines in portable electronics against IEC 61000−4−2 Level 4 ESD events (±18 kV contact). It features a 3.3 V working peak reverse voltage, 15 pF capacitance, <1 ns response time, and clamps to 10.5 V at 1 A IPP - enabling robust signal integrity in high-speed USB, HDMI, and audio interfaces.
For engineers reviewing the SZESD9B3.3ST5G datasheet, pinout, applications, or equivalent options, key selection criteria include low clamping voltage under 1 A/2 A surge, sub-1 ns transient response, IEC61000−4−2 Level 4 compliance, AEC−Q101 qualification for automotive use, and SOD−923 package compatibility with space-constrained PCB layouts.
Technical Context
This device operates as a bi-directional TVS diode with symmetrical clamping behavior for both positive and negative ESD transients. Its silicon avalanche structure enables precise 3.3 V stand-off voltage and fast junction response without triggering parasitic conduction in adjacent circuitry.
The SOD−923 package integrates a low-inductance, dual-terminal configuration optimized for high-frequency signal paths. With 15 pF capacitance at 0 V and <1 ns response, it avoids signal distortion in 480 Mbps USB 2.0 and 1.5 Gbps HDMI 1.4a data lanes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Peak Reverse Voltage | 3.3 V - defines maximum continuous DC bias before leakage rises above 100 nA; sets safe operating margin for 3.3 V logic rails. |
| Clamping Voltage @ 1 A IPP | 10.5 V - maximum voltage seen by protected IC during 8 kV contact ESD event; ensures downstream ICs remain below absolute max ratings. |
| Capacitance @ 0 V, 1 MHz | 15 pF - low enough to avoid signal rise-time degradation in USB 2.0 full-speed (480 Mbps) and audio codec interfaces. |
| Response Time | <1 ns - enables suppression before ESD energy couples into sensitive analog/digital inputs; critical for RF front-end and touch controller protection. |
| ESD Rating (IEC 61000−4−2) | ±18 kV contact - meets Level 4 immunity requirement for handheld consumer and automotive infotainment ports. |
| AEC−Q101 Qualified | Yes - validated for automotive temperature range (−40°C to +125°C junction), vibration, and humidity testing per stress test standard. |
Pinout & Package
SOD−923 surface-mount package: 0.80 mm × 0.60 mm × 0.37 mm body, 100% matte tin lead finish, MSL 1, compatible with standard reflow profiles up to 260°C.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Cathode Band) | Bi-directional Anode/Cathode Node | Terminal shared between both PN junctions; connects to protected I/O line; polarity band indicates cathode orientation for unidirectional interpretation. |
| 2 | Bi-directional Anode/Cathode Node | Second terminal of symmetrical structure; completes bidirectional clamping path; no fixed anode/cathode assignment required in layout. |
Key Features
| Feature | Design Value |
|---|---|
| Low Capacitance (15 pF) | Preserves signal integrity in high-speed interfaces like USB 2.0 and I²S audio without requiring trace length compensation. |
| Bi-directional Clamping | Protects AC-coupled or differential lines (e.g., USB D+/D−, HDMI TMDS) without polarity-sensitive placement constraints. |
| AEC−Q101 Qualification | Validates reliability for automotive infotainment, ADAS camera links, and telematics modules operating across −40°C to +125°C. |
| Small Outline (0.80 × 0.60 mm) | Enables placement directly at connector entry points on ultra-thin mobile PCBs where board area is limited to <0.5 mm² per protection device. |
Applications
| USB 2.0 Interface Protection | HDMI 1.4a TMDS Line Protection |
|---|---|
Use Scenario: Protecting D+ and D− lines of smartphone USB OTG ports exposed to repeated plug/unplug ESD events. IC Role / Device Role: Bi-directional transient voltage suppressor placed within 2 mm of USB connector to minimize inductance. Use Value: 10.5 V clamping at 1 A prevents damage to USB PHY transceivers rated for 12 V absolute max, while 15 pF avoids eye diagram closure. | Use Scenario: Shielding TMDS clock and data pairs in automotive head-unit HDMI outputs from ESD coupling via display cables. IC Role / Device Role: Low-capacitance ESD clamp mounted at HDMI receptacle to suppress ±18 kV contact discharge before reaching SerDes block. Use Value: Sub-1 ns response ensures clamping occurs prior to first 100 ps of IEC61000−4−2 waveform, preserving 1.5 Gbps signal fidelity. |
| Automotive Camera Link Protection | Smartphone Audio Codec I/O Protection |
Use Scenario: Guarding MIPI CSI-2 differential pairs in rear-view camera modules subjected to ESD during vehicle service or moisture exposure. IC Role / Device Role: AEC−Q101-qualified bi-directional ESD diode placed at FPC connector interface between camera sensor and SoC. Use Value: 3.3 V VRWM aligns with MIPI receiver common-mode voltage; 15 pF avoids jitter accumulation in 1 Gbps serial lanes. | Use Scenario: Securing headset jack microphone and ground return paths in smartphones against user-hand ESD during insertion/removal. IC Role / Device Role: Low-leakage (100 nA @ 3.3 V) bi-directional clamp preventing pop-noise and ADC saturation in audio codecs. Use Value: 10.5 V clamping limits transient overshoot below audio DAC's 13.2 V absolute max rating, eliminating post-ESD mute conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD9B3.3ST5G | Same electrical specs, non-automotive grade; lacks AEC−Q101 certification and SZ prefix traceability. | Approved for consumer portable devices only; not qualified for automotive production or PPAP submission. | Select when cost sensitivity outweighs automotive compliance requirements and supply chain traceability is not mandated. |
| TPD2E001DRYR | 2-channel array in SOT-553; 12 pF typical capacitance; 12 V clamping @ 1 A; no AEC−Q101 rating. | Offers dual-line protection in single package but requires separate routing for each channel; unsuitable for space-limited single-line placements. | Choose when protecting two adjacent I/Os (e.g., USB D+/D−) with shared footprint and lower total BOM count is prioritized over automotive qualification. |
Compared with ESD9B3.3ST5G and TPD2E001DRYR, SZESD9B3.3ST5G uniquely combines AEC−Q101 qualification, bi-directional single-line capability, and 15 pF/10.5 V performance in the smallest SOD−923 footprint - making it optimal for automotive and premium portable designs where traceability, size, and immunity level are jointly constrained.
Availability
SZESD9B3.3ST5G is available at Aetrix Electronics and suitable for automotive infotainment systems, smartphone I/O protection, and industrial camera interfaces requiring stable component supply, long-term lifecycle support, and AEC−Q101-compliant sourcing.
Supply support for SZESD9B3.3ST5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Semiconductor Components Industries, LLC) is a global supplier of energy-efficient semiconductor solutions, specializing in automotive, industrial, cloud, and IoT applications.
SZESD9B3.3ST5G belongs to the ESD9B series - engineered specifically for board-level ESD protection in high-density portable and automotive electronics where minimal capacitance, fast response, and AEC−Q101 reliability are mandatory.
FAQ
What is the clamping voltage of SZESD9B3.3ST5G at 2 A peak pulse current?
The clamping voltage of SZESD9B3.3ST5G is 11.5 V maximum at 2 A IPP under IEC 61000−4−2 8/20 µs surge conditions. This value ensures protected ICs remain within safe operating voltage limits during higher-energy ESD events, such as those occurring near metal enclosures or connectors. The 11.5 V specification is measured per onsemi's standardized oscilloscope waveform analysis method documented in AND8307/D.
Is SZESD9B3.3ST5G suitable for protecting USB 3.0 SuperSpeed lines?
No, SZESD9B3.3ST5G is not recommended for USB 3.0 SuperSpeed (5 Gbps) differential pairs due to its 15 pF capacitance, which exceeds the typical ≤0.5 pF limit required to maintain signal integrity at 2.5 GHz fundamental frequency. It is validated for USB 2.0 (480 Mbps) and lower-speed interfaces. For USB 3.0, onsemi offers lower-capacitance alternatives such as ESD7L5.0DT5G (0.55 pF).
Does SZESD9B3.3ST5G require orientation-specific placement on the PCB?
SZESD9B3.3ST5G is bi-directional and does not require polarity-aware placement. Its SOD−923 package uses a single polarity band (pin 1) that identifies the cathode side, but both terminals function identically under positive or negative ESD transients. Layout guidelines recommend placing SZESD9B3.3ST5G symmetrically across the protected line with equal trace lengths to both pins to preserve balanced clamping behavior.
What is the maximum junction temperature rating for SZESD9B3.3ST5G?
The junction and storage temperature range for SZESD9B3.3ST5G is −55°C to +150°C. This wide range supports operation in under-hood automotive environments and sealed portable enclosures. The device's thermal resistance (RJA = 400°C/W on FR-5 board) means power dissipation must remain below 300 mW at 25°C ambient to avoid exceeding 150°C junction temperature during sustained surge conditions.
How does the AEC−Q101 qualification of SZESD9B3.3ST5G impact supply chain requirements?
The AEC−Q101 qualification of SZESD9B3.3ST5G mandates PPAP-capable manufacturing, lot-level traceability, and controlled change notifications - all enforced by the "SZ" prefix. This means Aetrix Electronics supplies only units from onsemi's qualified automotive production lines, with full documentation including test reports, process flow records, and failure analysis protocols, satisfying Tier-1 automotive OEM sourcing mandates.
SZESD9B3.3ST5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- SOD-923
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 5V
- Voltage - Clamping (Max) @ Ipp:
- 11.5V
- Current - Peak Pulse (10/1000µs):
- 2A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- 15pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-923
SZESD9B3.3ST5G FAQ
1.How can I place an order for SZESD9B3.3ST5G through Aetrix?
Please submit a Request for Quotation (RFQ) for SZESD9B3.3ST5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SZESD9B3.3ST5G reliable?
The price and inventory of SZESD9B3.3ST5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SZESD9B3.3ST5G is usually 5 days.
3.What payment methods are accepted for SZESD9B3.3ST5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SZESD9B3.3ST5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SZESD9B3.3ST5G?
SZESD9B3.3ST5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SZESD9B3.3ST5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SZESD9B3.3ST5G?
For technical support, including SZESD9B3.3ST5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SZESD9B3.3ST5G requirements.
6.How does Aetrix verify that SZESD9B3.3ST5G is sourced from the original manufacturer or authorized distributors?
All SZESD9B3.3ST5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SZESD9B3.3ST5G meets industry standards.
7.What is the process for return or replacement of SZESD9B3.3ST5G?
All SZESD9B3.3ST5G units undergo pre-shipment inspection (PSI). If there is an issue with SZESD9B3.3ST5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SZESD9B3.3ST5G part is unused and in its original packaging.
Return procedure for SZESD9B3.3ST5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SZESD9B3.3ST5G Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
