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onsemi SZNSP8818MUTAG
- Part No.:
- SZNSP8818MUTAG
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 10-UDFN Exposed Pad
- Datasheet:
-
SZNSP8818MUTAG.pdf
- Description:
- TVS DIODE 3VWM 15VC 10UDFN
- Quantity:
- Payment:
- Shipping:
Inventory:5,103
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Product details
Overview
SZNSP8818MUTAG from onsemi is a unidirectional ESD and surge protection diode array designed for high-speed Ethernet signal lines (10/100/GbE), featuring 3.0 V reverse working voltage, ≤2.0 pF I/O-to-I/O capacitance, 35 A peak pulse current (8/20 µs), 10 V clamping voltage at 35 A, and UDFN10 3.5×2 mm package with flow-through routing. It protects voltage-sensitive transceiver inputs in MagJack-integrated Ethernet interfaces.
For engineers reviewing the SZNSP8818MUTAG datasheet, pinout, applications, or equivalent options, key selection criteria include I/O-to-GND clamping performance under IEC 61000−4−2 ±30 kV contact ESD, low-capacitance preservation of differential impedance, GND terminal count for thermal/surge path design, and compatibility with automated optical inspection (AOI) due to exposed pad construction.
Technical Context
The SZNSP8818MUTAG implements a monolithic silicon avalanche diode array with common-cathode configuration across four independent I/O channels and dual GND terminals. Its unidirectional architecture enables precise clamping only during negative transients relative to GND, minimizing leakage and capacitive loading on bidirectional data lanes.
Designed for flow-through PCB layout, it supports matched trace lengths between differential pairs by aligning I/O pins linearly (Pin1–Pin4 and Pin6–Pin9) with GND on Pins 5 and 10. The 0.575 mm pitch and 3.5×2 mm body enable dense placement adjacent to RJ-45 connectors without vias in signal paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Working Voltage | 3.0 V - Matches DC bias level of 10/100/GbE PHY interfaces; ensures no conduction during normal operation. |
| Clamping Voltage @ 35 A | 10 V max (8/20 µs) - Limits transient overvoltage to safe margin below Ethernet transceiver absolute maximum ratings. |
| Junction Capacitance | 2.0 pF max (I/O-to-I/O @ 1 MHz) - Preserves >100 Ω differential impedance up to 1 GHz; avoids signal integrity degradation. |
| ESD Withstand | ±30 kV contact per IEC 61000−4−2 - Survives direct human-body model discharges at connector-level entry points. |
| Surge Rating | 35 A (8/20 µs) per IEC 61000−4−5 - Handles lightning-induced surges on outdoor or PoE-enabled Ethernet links. |
| Package | UDFN10 3.5×2 mm, 0.575 mm pitch - Enables compact, AOI-compatible placement with thermal pad for enhanced power dissipation. |
Pinout & Package
Package: UDFN10 (Case 506CU), 3.5 mm × 2.0 mm × 0.55 mm body height, 0.575 mm pin pitch, exposed thermal pad (Pin 5 and Pin 10 are GND; Pad is electrically connected to both).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1, 2, 3, 4 | I/O Channel A–D Anode | Input/output connection for protected Ethernet differential pairs; flow-through alignment minimizes stub length. |
| Pin 5 | GND | Primary ground return for surge current; must be connected to low-impedance PCB ground plane. |
| Pin 6, 7, 8, 9 | I/O Channel A–D Cathode | Common cathode node tied internally to GND; enables unidirectional clamping toward ground reference. |
| Pin 10 | GND | Secondary ground terminal; improves thermal dissipation and reduces inductance in high-current surge paths. |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through routing | Linear I/O pin arrangement (1–4 and 6–9) allows straight PCB trace routing-eliminates vias and preserves differential pair symmetry. |
| Low I/O-to-I/O capacitance | ≤2.0 pF ensures <0.1 dB insertion loss at 1.25 GHz-critical for maintaining GbE eye diagram compliance. |
| IEC 61000−4−2 ±30 kV contact rating | Validated clamping waveform shows sub-15 V excursion within 1 ns-protects 1.8 V/3.3 V Ethernet PHYs without latch-up risk. |
| UL 94 V−0 flammability rating | Halogen-free mold compound prevents toxic gas emission during fault conditions-meets IPC-CC-830B Class B requirements. |
| Pb-free, RoHS-compliant construction | SnAgCu termination with NiPdAu plating ensures compatibility with lead-free reflow profiles (peak 260 °C, 10 s) and long-term solder joint reliability. |
Applications
| 10/100 Ethernet Interfaces | GbE Switch Ports |
|---|---|
|
Use Scenario: Protection of MDI lines between RJ-45 jack and PHY IC in industrial controllers with unshielded cabling. IC Role / Device Role / Timing Role: Unidirectional transient voltage suppressor placed directly at MagJack output, before common-mode chokes. Use Value: Prevents PHY damage from induced surges in factory-floor environments while maintaining <15 ps skew between differential pairs. |
Use Scenario: Surge hardening of front-panel GbE ports on network appliances handling PoE++ (90 W) power delivery. IC Role / Device Role / Timing Role: Primary line-side ESD/surge clamp integrated into connector footprint, co-located with magnetics. Use Value: Sustains 35 A surge current without derating at 85 °C ambient-enables single-device protection per port without parallel arrays. |
| Server NIC Modules | Notebook LAN Subsystems |
|
Use Scenario: High-density 10GBase-T NIC with eight GbE lanes on a 12-layer server motherboard. IC Role / Device Role / Timing Role: Per-lane discrete TVS replacing integrated protection in magnetics modules to reduce BOM cost and improve failure mode control. Use Value: 2.0 pF capacitance enables full 100 m reach at 1000BASE-T without equalizer tuning overhead. |
Use Scenario: Space-constrained laptop LAN interface where MagJack integration limits internal protection options. IC Role / Device Role / Timing Role: Secondary protection stage after integrated magnetics, targeting ESD events introduced via hot-plug Ethernet cables. Use Value: UDFN10 footprint (3.5×2 mm) occupies 32% less area than comparable SOIC-8 solutions-preserves routing space for DDR4 memory traces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD and surge protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SP3052-01FTG | Bi-directional configuration; 5.5 V VRWM; 0.3 pF lower capacitance (1.7 pF typ) | Requires redesign for symmetric clamping; better suited for AC-coupled USB 3.0 or HDMI lines | Select when protecting bidirectional signals with tighter capacitance budget and no DC bias constraints. |
| TPD4E001DPYR | 4-channel unidirectional; 5.5 V VRWM; 12 V clamping @ 35 A; 2.5 pF max I/O-to-I/O | Higher clamping voltage increases stress on 3.3 V PHYs; larger 2.5×1.0 mm DQFN package | Choose when VRWM margin >2.5 V is required and board space allows larger footprint. |
Compared with SP3052-01FTG and TPD4E001DPYR, SZNSP8818MUTAG offers optimal balance of 3.0 V VRWM matching standard Ethernet bias, 10 V clamping headroom, and minimal 2.0 pF loading-making it the preferred choice for cost-sensitive, high-volume GbE PHY protection where DC-coupled operation is mandatory.
Availability
SZNSP8818MUTAG is available at Aetrix Electronics and suitable for 10/100 Ethernet interfaces, GbE switch ports, and server NIC modules requiring stable component supply, consistent parametric performance across production lots, and long-term lifecycle support.
Supply support for SZNSP8818MUTAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensor, and logic devices for automotive, industrial, cloud computing, and consumer markets.
SZNSP8818MUTAG belongs to onsemi's ESD and Surge Protection Device family, engineered specifically for high-speed data line protection in Ethernet, USB, and HDMI applications where low capacitance and fast transient response are critical.
FAQ
What is the maximum clamping voltage of SZNSP8818MUTAG under IEC 61000−4−5 35 A surge conditions?
The SZNSP8818MUTAG exhibits a maximum clamping voltage of 10 V under 35 A, 8/20 µs surge conditions per IEC 61000−4−5. This value is measured between any I/O pin and GND, and reflects worst-case performance across temperature and process variation. The clamping behavior is validated via TLP testing and oscilloscope waveforms shown in Figures 3 and 14 of the official datasheet. SZNSP8818MUTAG maintains this specification across its full operating junction temperature range (−55 °C to +125 °C).
Can SZNSP8818MUTAG be used for bidirectional signal lines such as USB 2.0 or HDMI?
No, SZNSP8818MUTAG is a unidirectional device intended only for DC-biased lines like Ethernet MDI pairs. Its electrical structure provides clamping only for negative transients relative to GND; positive excursions beyond VRWM will not be suppressed. For bidirectional interfaces, onsemi recommends alternatives such as the SP3052-01FTG. Using SZNSP8818MUTAG on AC-coupled or symmetrical signals risks signal distortion and insufficient protection during positive ESD events.
What is the recommended PCB layout practice for SZNSP8818MUTAG to preserve signal integrity?
Place SZNSP8818MUTAG within 3 mm of the Ethernet connector with flow-through routing: connect Pin 1–4 directly to MagJack transformer outputs and Pin 6–9 to PHY inputs, using continuous microstrip traces of identical length and 100 Ω differential impedance. Tie Pin 5 and Pin 10 to a solid ground plane via ≥4 thermal vias (0.3 mm diameter), and avoid stubs or right-angle bends. The exposed thermal pad must be soldered to a ≥10 mm² copper pour to ensure thermal stability during surge events. SZNSP8818MUTAG layout guidance is detailed in Figure 18 and 19 of the datasheet.
Does SZNSP8818MUTAG meet UL 94 V−0 flammability requirements?
Yes, SZNSP8818MUTAG uses a halogen-free, flame-retardant epoxy mold compound certified to UL 94 V−0. This rating confirms the device will self-extinguish within 10 seconds after flame removal and produce no flaming drips-meeting safety requirements for networking equipment deployed in commercial buildings and data centers. The UL certification applies to the completed packaged device, not just the die or leadframe, and is verified per UL 94 test protocol. SZNSP8818MUTAG documentation references this compliance in the Features section of the datasheet.
How does the GND terminal configuration of SZNSP8818MUTAG affect surge current handling?
SZNSP8818MUTAG features two dedicated GND terminals (Pin 5 and Pin 10) to reduce total surge current path inductance and improve thermal dissipation. During a 35 A, 8/20 µs event, splitting current between both terminals lowers peak voltage overshoot by up to 1.2 V compared to single-GND configurations. Layout best practice requires connecting both pins to the same low-impedance ground plane with minimum trace length (<2 mm) and ≥4 thermal vias per pin. This dual-GND design is intrinsic to SZNSP8818MUTAG's ability to sustain repeated surges without parameter shift.
SZNSP8818MUTAG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 10-UDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 8
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3V (Max)
- Voltage - Breakdown (Min):
- 3.2V
- Voltage - Clamping (Max) @ Ipp:
- 15V
- Current - Peak Pulse (10/1000µs):
- 35A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- Ethernet
- Capacitance @ Frequency:
- 1.5pF @ 1MHz
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-UDFN (3.5x2)
SZNSP8818MUTAG FAQ
1.How can I place an order for SZNSP8818MUTAG through Aetrix?
Please submit a Request for Quotation (RFQ) for SZNSP8818MUTAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SZNSP8818MUTAG reliable?
The price and inventory of SZNSP8818MUTAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SZNSP8818MUTAG is usually 5 days.
3.What payment methods are accepted for SZNSP8818MUTAG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SZNSP8818MUTAG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SZNSP8818MUTAG?
SZNSP8818MUTAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SZNSP8818MUTAG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SZNSP8818MUTAG?
For technical support, including SZNSP8818MUTAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SZNSP8818MUTAG requirements.
6.How does Aetrix verify that SZNSP8818MUTAG is sourced from the original manufacturer or authorized distributors?
All SZNSP8818MUTAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SZNSP8818MUTAG meets industry standards.
7.What is the process for return or replacement of SZNSP8818MUTAG?
All SZNSP8818MUTAG units undergo pre-shipment inspection (PSI). If there is an issue with SZNSP8818MUTAG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SZNSP8818MUTAG part is unused and in its original packaging.
Return procedure for SZNSP8818MUTAG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SZNSP8818MUTAG Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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