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onsemi SZNUP3112UPMUTAG
- Part No.:
- SZNUP3112UPMUTAG
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 6-UFDFN Exposed Pad
- Datasheet:
-
SZNUP3112UPMUTAG.pdf
- Description:
- TVS DIODE 4VWM 6UDFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,345
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Product details
Overview
SZNUP3112UPMUTAG from onsemi is an ultra-low-capacitance ESD protection diode array in a 6-pin UDFN package, designed to protect three high-speed data lines (D1–D3) and a VCC power line against IEC61000-4-2 Level 4 ESD events (±14 kV contact). It delivers 0.7 pF typical capacitance per data line, 5.2 V minimum breakdown voltage for signal pins, and 15 V clamping for VCC - making it suitable for USB 2.0 high-speed interfaces in space-constrained mobile designs.
For engineers reviewing the SZNUP3112UPMUTAG datasheet, pinout, applications, or equivalent options, key selection criteria include sub-1 pF line-to-GND capacitance, common-anode quad-channel architecture, AEC-Q101 qualification, 1.6 × 1.6 mm UDFN footprint, and verified IEC61000-4-2 Level 4 ESD robustness.
Technical Context
The SZNUP3112UPMUTAG implements a common-anode quad-diode array with three unidirectional signal-line diodes (D1–D3) and one VCC-supply diode, all sharing a single GND connection. Its low-leakage design maintains ≤1.0 µA reverse current at rated VRWM, enabling compatibility with battery-powered systems.
Clamping behavior is characterized under IEC61000-4-2 8 kV contact discharge, with documented oscilloscope waveforms showing voltage suppression across the full pulse duration. The device operates from −40°C to +125°C and supports reflow soldering up to 260°C for 10 seconds.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacitance (D1–D3) | 0.7 pF typical - preserves signal integrity in USB 2.0 high-speed (480 Mbps) data paths |
| Breakdown Voltage (D1–D3) | 5.2 V min @ 1 mA - ensures reliable turn-on before damage to 3.3 V/5 V logic interfaces |
| VCC Protection Voltage | 15 V typ @ 5 mA - safeguards 12 V supply rails against transient overvoltage |
| ESD Rating | IEC61000-4-2 Level 4 (±14 kV contact) - meets industrial and automotive system-level immunity requirements |
| Package | UDFN6, 1.6 × 1.6 × 0.5 mm - enables placement in ultra-slim handheld PCBs with minimal board area |
| Operating Temp | −40°C to +125°C - supports automotive cabin and industrial edge-node deployment |
Pinout & Package
Package: UDFN6 (Case 517AP), 1.6 mm × 1.6 mm, 0.5 mm profile, Pb-free, with exposed thermal pad. Pin 1 marked by microdot or "1" indicator.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | D1 Cathode | Protected high-speed data line (e.g., USB D+) |
| 2 | D2 Cathode | Protected high-speed data line (e.g., USB D−) |
| 3 | VCC Anode | Power rail clamp node - connects to 12 V supply for overvoltage suppression |
| 4 | D3 Cathode | Third protected signal line (e.g., SIM card CLK or DATA) |
| 5 | NC | No internal connection - must be left floating or grounded per layout guidelines |
| 6 | NC | No internal connection - must be left floating or grounded per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.7 pF typical per data line - avoids signal distortion in >480 Mbps differential interfaces |
| Quad-channel integration | Three signal lines + VCC protection in one 1.6×1.6 mm package - reduces component count vs. discrete diodes |
| AEC-Q101 qualification | Validated for automotive applications including infotainment and telematics modules |
| Common-anode topology | Single GND return path simplifies PCB routing and minimizes ground bounce during multi-line ESD events |
Applications
| USB 2.0 High-Speed Interface | Cell Phone Front-End Protection |
|---|---|
Use Scenario: Protecting D+/D− differential pair and VBUS line in smartphone USB ports against repeated plug/unplug ESD events. IC Role / Device Role / Timing Role: Signal-line transient suppressor with <1 pF loading, placed within 5 mm of connector to minimize inductance. Use Value: Prevents latch-up and gate oxide damage in USB PHY ICs while maintaining eye diagram compliance at 480 Mbps. | Use Scenario: Shielding baseband processor I/Os (e.g., SDIO, UART) from user-hand ESD during daily handling. IC Role / Device Role / Timing Role: Low-leakage (≤1 µA) ESD clamp that avoids DC bias shift on sensitive analog inputs. Use Value: Enables direct placement on high-density RF front-end boards without degrading RF performance or battery leakage. |
| SIM Card Socket Protection | MP3 Player Audio Interface |
Use Scenario: Guarding SIM card interface lines (CLK, I/O, RST) against insertion/removal transients in compact wearables. IC Role / Device Role / Timing Role: Quad-channel protector with dedicated VCC clamp - isolates SIM supply from shared system rail noise. Use Value: Eliminates SIM detection failures caused by ESD-induced reset glitches, validated per ISO 10605. | Use Scenario: Securing stereo DAC output lines and headphone detect signals in portable audio players. IC Role / Device Role / Timing Role: Sub-1 pF capacitance ensures no audible high-frequency roll-off or crosstalk between L/R channels. Use Value: Maintains THD+N <0.005% at 20 kHz while surviving >10,000 hot-plug cycles per IEC61000-4-2. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NUP3112UPMUTAG | 0.7 pF, 5.2 V D1–D3 BR, 15 V VCC clamp, UDFN6 | Optimized for USB 2.0 + VCC rail protection in space-limited layouts | Preferred for new designs requiring AEC-Q101 and IEC61000-4-2 Level 4 compliance |
| TPD2E001DRYR | 1.0 pF, 5.5 V BR, no VCC clamp, SOT-5X3 | Lacks integrated VCC protection - requires external TVS for power rail | Acceptable where board area allows separate VCC protection and 1 pF loading is tolerable |
Compared with TPD2E001DRYR and NUP4202MR6T1G, the SZNUP3112UPMUTAG uniquely integrates VCC clamping in the same ultra-low-capacitance package, reducing BOM count and PCB real estate while meeting automotive-grade reliability standards.
Availability
SZNUP3112UPMUTAG is available at Aetrix Electronics and suitable for USB 2.0 interface protection, SIM card socket hardening, and MP3 player audio line safeguarding requiring stable component supply across production lifecycles.
Supply support for SZNUP3112UPMUTAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier focused on energy-efficient electronics, delivering silicon solutions for automotive, industrial, cloud, and consumer markets.
The NUP/SZNUP series targets high-frequency ESD protection for portable and automotive interfaces, emphasizing ultra-low capacitance, AEC-Q101 qualification, and compact packaging for next-generation mobile and telematics systems.
FAQ
What is the maximum operating temperature range for the SZNUP3112UPMUTAG?
The SZNUP3112UPMUTAG is rated for operation from −40°C to +125°C junction temperature, supporting deployment in automotive cabin environments and industrial edge nodes where ambient temperatures exceed 85°C. This rating is confirmed in the Absolute Maximum Ratings table of the official datasheet (Rev. 2, October 2017), and the device maintains specified clamping performance across this full range.
Does the SZNUP3112UPMUTAG provide bidirectional or unidirectional ESD protection?
The SZNUP3112UPMUTAG provides unidirectional protection for its D1–D3 signal lines (cathode-to-line configuration) and unidirectional clamping for the VCC pin (anode-to-rail). This architecture is optimized for DC-biased interfaces like USB 2.0 and SIM card lines, where transients occur relative to GND. Bidirectional capability is not supported - reverse polarity events require external design considerations.
How does the SZNUP3112UPMUTAG differ from the standard NUP3112UPMU variant?
The SZNUP3112UPMUTAG includes the "SZ" prefix indicating automotive-grade qualification per AEC-Q101, PPAP capability, and unique site/control change tracking - whereas the NUP3112UPMU is intended for commercial applications. Both share identical electrical specs and package, but only the SZNUP3112UPMUTAG is approved for automotive use cases such as infotainment and telematics modules.
Can the NC pins (pins 5 and 6) on the SZNUP3112UPMUTAG be connected to ground?
Pins 5 and 6 are internally unconnected (NC) and may be left floating or tied to GND per PCB layout best practices - grounding them improves thermal dissipation and reduces parasitic antenna effects without affecting device function. The official datasheet (Figure "PIN CONNECTIONS") confirms no internal bond wire exists for these terminals, and onsemi's mounting guidelines recommend GND connection for mechanical stability.
Is the SZNUP3112UPMUTAG compatible with lead-free reflow processes?
Yes, the SZNUP3112UPMUTAG is Pb-free and qualified for standard lead-free reflow profiles, with a maximum lead solder temperature of 260°C for 10 seconds. Its UDFN6 package (Case 517AP) complies with IPC/JEDEC J-STD-020 moisture sensitivity level 1, eliminating bake requirements prior to assembly. Full process details are in onsemi's Soldering and Mounting Techniques Reference Manual (SOLDERRM/D).
SZNUP3112UPMUTAG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 6-UFDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 3
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 4V
- Voltage - Breakdown (Min):
- 5.2V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- -
- Capacitance @ Frequency:
- 0.7pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-UDFN (1.6x1.6)
SZNUP3112UPMUTAG FAQ
1.How can I place an order for SZNUP3112UPMUTAG through Aetrix?
Please submit a Request for Quotation (RFQ) for SZNUP3112UPMUTAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SZNUP3112UPMUTAG reliable?
The price and inventory of SZNUP3112UPMUTAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SZNUP3112UPMUTAG is usually 5 days.
3.What payment methods are accepted for SZNUP3112UPMUTAG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SZNUP3112UPMUTAG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SZNUP3112UPMUTAG?
SZNUP3112UPMUTAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SZNUP3112UPMUTAG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SZNUP3112UPMUTAG?
For technical support, including SZNUP3112UPMUTAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SZNUP3112UPMUTAG requirements.
6.How does Aetrix verify that SZNUP3112UPMUTAG is sourced from the original manufacturer or authorized distributors?
All SZNUP3112UPMUTAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SZNUP3112UPMUTAG meets industry standards.
7.What is the process for return or replacement of SZNUP3112UPMUTAG?
All SZNUP3112UPMUTAG units undergo pre-shipment inspection (PSI). If there is an issue with SZNUP3112UPMUTAG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SZNUP3112UPMUTAG part is unused and in its original packaging.
Return procedure for SZNUP3112UPMUTAG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SZNUP3112UPMUTAG Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
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