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onsemi SZNZ8DH9V1MXWT5G
- Part No.:
- SZNZ8DH9V1MXWT5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 2-UDFN
- Datasheet:
-
SZNZ8DH9V1MXWT5G.pdf
- Description:
- DUAL DIODE ZENER PROTECTION 9.1V
- Quantity:
- Payment:
- Shipping:
Inventory:7,764
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Product details
Overview
SZNZ8DH9V1MXWT5G from onsemi is a bidirectional Zener protection diode in an XDFNW2 1.0 × 0.6 mm package, designed for ESD and transient overvoltage suppression on single I/O lines. It features a 9.1 V working peak reverse voltage (VRWM), 10.9 V typical clamping voltage at 1.0 A IPP, ≤0.5 µA reverse leakage at VRWM, 25 pF capacitance at 0 V, and ±30 kV IEC 61000-4-2 contact ESD rating - ideal for automotive ECU signal line protection.
For engineers reviewing the SZNZ8DH9V1MXWT5G datasheet, pinout, applications, or equivalent options, key selection criteria include clamping performance under 1.0 A transient current, ultra-low capacitance for high-speed data lines, AEC-Q101 qualification for automotive use, wettable flank package for AOI compatibility, and thermal capability up to 175 °C TJ(MAX).
Technical Context
The SZNZ8DH9V1MXWT5G implements a symmetric bidirectional Zener clamp structure, enabling protection of AC-coupled or differential signal paths without polarity constraints. Its breakdown voltage is specified as 9.30–10.70 V at 5 mA test current, with clamping validated per IEC 61000-4-2 and ISO 10605 waveforms.
It operates across −55 °C to +175 °C junction temperature range and delivers 4.5 A maximum peak pulse current (8/20 µs), supported by 300 mW DC power dissipation and 400 °C/W junction-to-ambient thermal resistance when mounted on FR-4 with minimum recommended pad size.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRWM | 9.1 V - Maximum continuous reverse operating voltage before clamping begins; sets safe signal swing margin for protected line. |
| VBR (min/max) | 9.30 / 10.70 V @ IT = 5 mA - Confirmed Zener breakdown window ensures predictable turn-on behavior across process and temperature. |
| VC @ IPP = 1.0 A | 10.9 V typ - Clamping voltage during 1 A transient defines worst-case voltage seen by downstream IC; critical for I/O rail margining. |
| C @ 0 V, 1 MHz | 25 pF - Low capacitance preserves signal integrity on USB 2.0, CAN FD, or LIN bus lines without added jitter or rise-time degradation. |
| ESD Rating | ±30 kV (IEC 61000-4-2 contact) - Meets highest industrial and automotive ESD immunity requirements without external circuitry. |
| TJ(MAX) | +175 °C - Enables placement near hot components (e.g., powertrain ECUs) without derating concerns or thermal shutdown risk. |
| Package | XDFNW2 (Case 521AE), 1.0 × 0.6 × 0.5 mm - Ultra-compact footprint with wettable flanks supports automated optical inspection and high-density PCB layouts. |
Pinout & Package
Package: XDFNW2 (Case 521AE), 2-terminal surface-mount device with exposed thermal pad. Dimensions: 1.0 mm × 0.6 mm × 0.5 mm, 0.65 mm pitch, wettable flank profile.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode/Cathode (bidirectional) | Shared terminal for symmetrical Zener conduction - no polarity assignment; connects to protected signal line. |
| Pin 2 | Anode/Cathode (bidirectional) | Shared terminal opposite Pin 1 - forms bidirectional clamp path between signal and ground or reference plane. |
| Exposed Pad | Thermal / Ground Reference | Internally connected to cathode side; must be soldered to PCB thermal pad for optimal power dissipation and ESD current shunting. |
Key Features
| Feature | Design Value |
|---|---|
| Precise clamping voltage | 10.9 V typical at 1.0 A pulse ensures consistent overvoltage limiting across production lots and temperature range. |
| AEC-Q101 qualified | Validated for automotive electronics including engine control, body control, and ADAS modules per stress test requirements. |
| Wettable flank package | Enables reliable automated optical inspection (AOI) of solder joint quality on both side walls - critical for zero-defect automotive manufacturing. |
| High-temperature operation | Rated to +175 °C TJ(MAX) supports placement in under-hood environments without thermal derating or reliability loss. |
| Low dynamic capacitance | 25 pF at 0 V enables use on 480 Mbps USB 2.0, 5 Mbps CAN FD, and 20 kbps LIN interfaces without signal distortion. |
Applications
| Automotive Engine Control Unit (ECU) | In-Vehicle Networking (IVN) |
|---|---|
Use Scenario: Protecting LIN bus transceiver pins against load dump and ESD events in under-hood ECUs. IC Role / Device Role: Bidirectional transient voltage suppressor placed directly at connector interface before transceiver input. Use Value: Maintains signal fidelity with only 25 pF loading while surviving ±30 kV contact ESD and 4.5 A surge pulses per ISO 10605. | Use Scenario: Shielding CAN FD physical layer inputs from coupling-induced transients in gateway modules. IC Role / Device Role: Line-side ESD clamp on differential CANH/CANL pairs, leveraging symmetric Zener architecture. Use Value: Prevents latch-up in CAN transceivers by clamping to ≤10.9 V during 1 A transients, with no polarity sensitivity. |
| Voltage-Sensitive Sensor Interface | Infotainment System USB Port |
Use Scenario: Safeguarding analog outputs of pressure or temperature sensors connected to ADC inputs. IC Role / Device Role: Low-leakage (≤0.5 µA) clamp on sensor output line to prevent ADC saturation during ESD events. Use Value: Ensures measurement accuracy remains unaffected during normal operation due to sub-microamp reverse current at 9.1 V. | Use Scenario: ESD protection on USB 2.0 D+ and D− lines in head unit front-panel connectors. IC Role / Device Role: Single-channel bidirectional suppressor per line, minimizing board space versus dual-SOT23 solutions. Use Value: Delivers 25 pF capacitance and <11 V clamping to meet USB 2.0 eye diagram and jitter specifications post-ESD. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transient voltage suppression applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD9B9.2ST5G | Lower VRWM (9.2 V), higher C (35 pF), same XDFN package, non-automotive grade. | Not AEC-Q101 qualified; suitable for consumer-grade USB or audio ports but not automotive ECUs. | Select when cost sensitivity outweighs automotive qualification and lower capacitance is not required. |
| SZ1.5SMC9.0A | Higher power (1500 W), larger DO-214AB package, unidirectional, 9.0 V VBR. | Requires external series resistor for bidirectional use; unsuitable for space-constrained high-speed lines. | Choose only for high-energy surge scenarios (>10 A) where board area and capacitance are secondary concerns. |
Compared with ESD9B9.2ST5G and SZ1.5SMC9.0A, the SZNZ8DH9V1MXWT5G uniquely combines AEC-Q101 qualification, 25 pF capacitance, and XDFNW2 footprint - making it the only option meeting automotive IVN signal integrity and reliability requirements in minimal area.
Availability
SZNZ8DH9V1MXWT5G is available at Aetrix Electronics and suitable for automotive ECU design, in-vehicle networking (IVN), and voltage-sensitive sensor interface applications requiring stable component supply, full traceability, and long-term lifecycle support.
Supply support for SZNZ8DH9V1MXWT5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Semiconductor Components Industries, LLC) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The NZ8DH Series is part of onsemi's transient voltage suppression portfolio, engineered specifically for high-reliability, low-capacitance ESD protection in automotive and mission-critical systems - emphasizing AEC-Q101 compliance, thermal robustness, and AOI-compatible packaging.
FAQ
What is the clamping voltage of SZNZ8DH9V1MXWT5G at 1.0 A peak pulse current?
The SZNZ8DH9V1MXWT5G has a typical clamping voltage (VC) of 10.9 V at 1.0 A peak pulse current (8/20 µs waveform). This value is measured under standardized transient conditions and defines the maximum voltage imposed on the protected line during an ESD event. The actual clamping may vary slightly across temperature and production lot, but remains within specification limits confirmed in the onsemi datasheet for SZNZ8DH9V1MXWT5G.
Is SZNZ8DH9V1MXWT5G qualified for automotive applications?
Yes, SZNZ8DH9V1MXWT5G is AEC-Q101 qualified and PPAP capable, with the "SZ" prefix indicating compliance for automotive and other applications requiring unique site and control change requirements. It is rated for operation from −55 °C to +175 °C junction temperature and tested per automotive ESD standards including ISO 10605. These qualifications make SZNZ8DH9V1MXWT5G suitable for engine control units, body electronics, and ADAS modules.
What package type does SZNZ8DH9V1MXWT5G use, and why is it important?
SZNZ8DH9V1MXWT5G uses the XDFNW2 (Case 521AE) package: a 2-terminal, 1.0 × 0.6 mm ultra-compact leadless package with wettable flanks. This package enables high-density PCB layouts, supports automated optical inspection (AOI) of solder joints, and provides efficient thermal conduction via the exposed pad. Its small size replaces bulkier SOT-23 dual-diode solutions while maintaining bidirectional protection - a key advantage in space-constrained automotive modules.
How does the capacitance of SZNZ8DH9V1MXWT5G affect high-speed signal lines?
SZNZ8DH9V1MXWT5G exhibits 25 pF typical capacitance at 0 V bias and 1 MHz, which minimizes signal distortion on high-speed interfaces such as USB 2.0 (480 Mbps), CAN FD (5 Mbps), and LIN (20 kbps). This low value prevents excessive rise-time degradation or jitter accumulation, ensuring signal integrity is preserved even when placed directly at connector-level I/O pins - a critical requirement confirmed in SZNZ8DH9V1MXWT5G application validation.
What is the maximum peak pulse current rating for SZNZ8DH9V1MXWT5G?
The SZNZ8DH9V1MXWT5G is rated for a maximum peak pulse current (IPP) of 4.5 A under the 8/20 µs transient waveform, as defined in IEC 61000-4-5. This rating reflects its ability to safely divert high-energy transients without failure, supporting robust protection in harsh electrical environments like automotive power distribution networks or industrial fieldbus connections. The rating assumes proper PCB layout with thermal pad connection, as specified in the SZNZ8DH9V1MXWT5G datasheet.
SZNZ8DH9V1MXWT5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 2-UDFN
- Series:
- NZ8DH
- Packaging:
- Bulk
- Product Status:
- Discontinued at Digi-Key
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 6V (Max)
- Voltage - Breakdown (Min):
- 9.3V
- Voltage - Clamping (Max) @ Ipp:
- 10.9V
- Current - Peak Pulse (10/1000µs):
- 1A
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- Automotive
- Capacitance @ Frequency:
- 25pF @ 1MHz
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 2-X2DFNW (1x0.6)
SZNZ8DH9V1MXWT5G FAQ
1.How can I place an order for SZNZ8DH9V1MXWT5G through Aetrix?
Please submit a Request for Quotation (RFQ) for SZNZ8DH9V1MXWT5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SZNZ8DH9V1MXWT5G reliable?
The price and inventory of SZNZ8DH9V1MXWT5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SZNZ8DH9V1MXWT5G is usually 5 days.
3.What payment methods are accepted for SZNZ8DH9V1MXWT5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SZNZ8DH9V1MXWT5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SZNZ8DH9V1MXWT5G?
SZNZ8DH9V1MXWT5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SZNZ8DH9V1MXWT5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SZNZ8DH9V1MXWT5G?
For technical support, including SZNZ8DH9V1MXWT5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SZNZ8DH9V1MXWT5G requirements.
6.How does Aetrix verify that SZNZ8DH9V1MXWT5G is sourced from the original manufacturer or authorized distributors?
All SZNZ8DH9V1MXWT5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SZNZ8DH9V1MXWT5G meets industry standards.
7.What is the process for return or replacement of SZNZ8DH9V1MXWT5G?
All SZNZ8DH9V1MXWT5G units undergo pre-shipment inspection (PSI). If there is an issue with SZNZ8DH9V1MXWT5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SZNZ8DH9V1MXWT5G part is unused and in its original packaging.
Return procedure for SZNZ8DH9V1MXWT5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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