My Inquiry
My Account
Taiwan Semiconductor Corporation TESD5V0V4UCU6 RFG
- Part No.:
- TESD5V0V4UCU6 RFG
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- TVS Diodes
- Package:
- 6-TSSOP, SC-88, SOT-363
- Datasheet:
-
TESD5V0V4UCU6 RFG.pdf
- Description:
- TVS DIODE 5VWM 25VC SOT363
- Quantity:
- Payment:
- Shipping:
Inventory:14,573
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TESD5V0V4UCU6 from Taiwan Semiconductor is a 5V-rated, 3pF ESD protection array in SOT-363 package, featuring ±15kV air/±8kV contact ESD immunity, 6A peak pulse current, and 25V clamping voltage at 6A - deployed for high-speed data line protection in DVI and Ethernet interfaces.
For engineers reviewing the TESD5V0V4UCU6 datasheet, TESD5V0V4UCU6 pinout, TESD5V0V4UCU6 application, or TESD5V0V4UCU6 equivalent, key selection criteria include working voltage (5V), junction capacitance (3pF I/O-to-GND), clamping performance (25V @ 6A), RoHS/halogen-free compliance, and SOT-363 footprint compatibility with space-constrained digital interface layouts.
Technical Context
This monolithic ESD protection device integrates four bidirectional TVS diodes in a single die within a 6-pin SOT-363 package, configured to protect four independent I/O lines against transient overvoltage events. It operates with a 5V working standoff voltage and delivers sub-25V clamping under 6A 8/20μs surge conditions.
The device meets IEC 61000-4-2 Level 4 ESD immunity and exhibits low 3pF capacitance between any I/O pin and GND - critical for preserving signal integrity on high-speed digital buses such as DVI and Gigabit Ethernet without introducing timing skew or attenuation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VWM | 5 V - Maximum continuous operating voltage before conduction; ensures no leakage or interference during normal 5V logic operation. |
| CJ (I/O to GND) | 3 pF - Low capacitance preserves signal rise/fall times on high-speed interfaces like DVI and 1000BASE-T Ethernet. |
| VC @ IPP = 6A | 25 V - Clamping voltage limits downstream IC stress during 8/20μs surges, protecting 3.3V/5V interface receivers. |
| IPP | 6 A - Peak surge current handling capability per channel, aligned with IEC 61000-4-5 surge test requirements. |
| ESD Rating | ±15 kV (air), ±8 kV (contact) - Full compliance with IEC 61000-4-2 Level 4, enabling robust system-level ESD certification. |
| V(BR) @ IR = 1mA | 6 V - Breakdown threshold ensures reliable turn-on only during transients, minimizing standby power loss and false triggering. |
Pinout & Package
SOT-363 (SC-70-6) surface-mount package with 6 terminals, matte tin-plated leads, moisture sensitivity level 1, and UL 94 V-0 molding compound.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O Channel 1 Anode | Bidirectional ESD path for first protected line; connects internally to common cathode structure. |
| 2 | GND | Common reference node for all four channels; must be low-inductance connection to system ground plane. |
| 3 | I/O Channel 1 Cathode | Completes bidirectional clamp path for Channel 1; tied internally to Pin 2 via TVS junction. |
| 4 | I/O Channel 2 Anode | Second independent ESD protection path; electrically isolated from other I/O pins except through shared GND. |
| 5 | I/O Channel 2 Cathode | Paired with Pin 4 to form second bidirectional TVS; identical clamping behavior to Pin 1/3 pair. |
| 6 | NC / Not Connected | No internal connection; left unconnected per datasheet - not used for signal or biasing. |
Key Features
| Feature | Design Value |
|---|---|
| IEC 61000-4-2 Level 4 ESD Protection | Enables pass-fail compliance for end-equipment without additional external circuitry or layout derating. |
| 3pF I/O-to-GND Junction Capacitance | Minimizes insertion loss and reflection on >100MHz digital links, supporting DVI and Gigabit Ethernet signal fidelity. |
| 25V Clamping Voltage at 6A | Keeps protected ICs (e.g., HDMI/DVI transceivers) below absolute maximum ratings during worst-case surge events. |
| SOT-363 Footprint Compatibility | Matches industry-standard 6-pin SC-70 layout, enabling drop-in replacement in existing designs using similar ESD arrays. |
| RoHS & Halogen-Free Compliance | Fulfills environmental regulatory requirements for consumer, industrial, and display equipment sold globally. |
Applications
| Digital Visual Interface (DVI) | 10/100/1000 Ethernet |
|---|---|
Use Scenario: Protecting TMDS differential pairs and DDC bus lines in flat-panel display controllers and graphics cards against ESD events during cable hot-plug or handling. IC Role / Device Role: Bidirectional transient voltage suppressor placed directly at connector interface, shunting ESD energy to GND before reaching PHY ICs. Use Value: Maintains <3pF loading on each TMDS lane to preserve eye diagram integrity while delivering ±15kV air-gap ESD immunity per IEC 61000-4-2. | Use Scenario: Safeguarding PHY-side MDI lines (pairs 1–4) and management interfaces (MDIO/MDC) in Gigabit Ethernet switches and NICs. IC Role / Device Role: Per-lane ESD clamp on transformer-coupled or direct-coupled Ethernet physical layer signals. Use Value: Enables full IEC 61000-4-2 Level 4 compliance without degrading 1000BASE-T signal quality or requiring larger-footprint alternatives. |
| Projection TV Monitors | Flat Panel Displays |
Use Scenario: Shielding LVDS or RSDS video interface lines between mainboard and projection engine control boards from user-accessible port ESD. IC Role / Device Role: Point-of-entry protection on high-speed video data lanes carrying clock and pixel data. Use Value: Delivers 25V clamping at 6A while adding only 3pF per I/O-to-GND path - preventing jitter accumulation and pixel corruption. | Use Scenario: Protecting embedded DisplayPort or eDP lanes in LCD/LED monitor assemblies where space constraints limit discrete TVS options. IC Role / Device Role: Compact 4-channel ESD array covering panel interface, touch controller, and backlight control lines. Use Value: Integrates four protection paths in one SOT-363 footprint, reducing PCB area by >60% versus discrete 0402 TVS diodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD5V3U4U-2/TR | Higher VWM (5.3V), slightly higher CJ (4.5pF I/O-to-GND), same SOT-363 package and 6A IPP. | Marginally less suitable for strict 5V rail systems due to elevated standoff; may affect leakage in low-power standby modes. | Select when system tolerates 5.3V VWM and requires alternate supply-chain availability. |
| TPD4E001DRYR | Lower CJ (0.7pF I/O-to-GND), same 5V VWM, but lower IPP (4A) and different pinout (no NC pin). | Better for >3GHz RF-adjacent digital lines; unsuitable where 6A surge margin is required per IEC 61000-4-5. | Prefer for ultra-high-speed interfaces where capacitance dominates design priority over peak current rating. |
Compared with ESD5V3U4U-2/TR and TPD4E001DRYR, the TESD5V0V4UCU6 offers optimal balance of 5V precision standoff, 3pF capacitance, and 6A surge capability in a standard SOT-363 layout - making it especially suited for cost-sensitive, high-volume DVI and Ethernet endpoint designs requiring proven Level 4 ESD robustness.
Availability
TESD5V0V4UCU6 is available at Aetrix Electronics and suitable for DVI interface protection, Gigabit Ethernet PHY safeguarding, and flat-panel display video lane ESD suppression requiring stable component supply across production lifecycles.
Supply support for TESD5V0V4UCU6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and protection device manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.
The TESD series is designed specifically for high-density, low-capacitance ESD protection of high-speed digital interfaces - emphasizing compact packaging, precise voltage thresholds, and repeatable clamping performance across temperature and lifetime.
FAQ
What is the clamping voltage of TESD5V0V4UCU6 at 6A surge current?
The TESD5V0V4UCU6 exhibits a maximum clamping voltage of 25 V when subjected to a 6 A, 8/20 μs impulse current waveform. This value is measured between any I/O pin and GND under standardized test conditions and ensures downstream 3.3V/5V interface ICs remain within safe operating limits during surge events. The TESD5V0V4UCU6 maintains this performance across its full operating temperature range.
Does TESD5V0V4UCU6 support IEC 61000-4-2 Level 4 ESD immunity?
Yes, the TESD5V0V4UCU6 fully complies with IEC 61000-4-2 Level 4, delivering ±15 kV air discharge and ±8 kV contact discharge protection. This rating is verified per the standard's test methodology and enables system-level ESD certification without supplemental protection components. The TESD5V0V4UCU6 achieves this while maintaining only 3 pF capacitance to GND.
What is the junction capacitance specification for TESD5V0V4UCU6?
The TESD5V0V4UCU6 has a typical junction capacitance of 3 pF measured between any I/O pin and GND at 1 MHz and 0 V reverse bias. This low value is critical for preserving signal integrity on high-speed digital interfaces such as DVI and 1000BASE-T Ethernet. The device also specifies 1.5 pF between I/O pins, further minimizing crosstalk.
What package type does TESD5V0V4UCU6 use, and what are its key mechanical attributes?
The TESD5V0V4UCU6 uses the SOT-363 (SC-70-6) surface-mount package with matte tin-plated leads, UL 94 V-0 flammability rating, and moisture sensitivity level 1 per J-STD-020. Its marking code is F54, and it weighs approximately 6.99 mg. The package supports reflow soldering per J-STD-002 and passes JESD 201 Class 1A whisker testing.
Is TESD5V0V4UCU6 RoHS and halogen-free compliant?
Yes, the TESD5V0V4UCU6 is RoHS compliant and halogen-free in accordance with IEC 61249-2-21. These compliance statements are confirmed in the official Taiwan Semiconductor datasheet revision D2109 and apply to all units shipped under the TESD5V0V4UCU6 RFG ordering code. No lead, cadmium, mercury, hexavalent chromium, PBB, or PBDE substances exceed EU RoHS thresholds.
TESD5V0V4UCU6 RFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Package/Case:
- 6-TSSOP, SC-88, SOT-363
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 25V
- Current - Peak Pulse (10/1000µs):
- 6A (8/20µs)
- Power - Peak Pulse:
- 150W
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 3pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-363
TESD5V0V4UCU6 RFG FAQ
1.How can I place an order for TESD5V0V4UCU6 RFG through Aetrix?
Please submit a Request for Quotation (RFQ) for TESD5V0V4UCU6 RFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TESD5V0V4UCU6 RFG reliable?
The price and inventory of TESD5V0V4UCU6 RFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TESD5V0V4UCU6 RFG is usually 5 days.
3.What payment methods are accepted for TESD5V0V4UCU6 RFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TESD5V0V4UCU6 RFG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TESD5V0V4UCU6 RFG?
TESD5V0V4UCU6 RFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TESD5V0V4UCU6 RFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TESD5V0V4UCU6 RFG?
For technical support, including TESD5V0V4UCU6 RFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TESD5V0V4UCU6 RFG requirements.
6.How does Aetrix verify that TESD5V0V4UCU6 RFG is sourced from the original manufacturer or authorized distributors?
All TESD5V0V4UCU6 RFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TESD5V0V4UCU6 RFG meets industry standards.
7.What is the process for return or replacement of TESD5V0V4UCU6 RFG?
All TESD5V0V4UCU6 RFG units undergo pre-shipment inspection (PSI). If there is an issue with TESD5V0V4UCU6 RFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TESD5V0V4UCU6 RFG part is unused and in its original packaging.
Return procedure for TESD5V0V4UCU6 RFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TESD5V0V4UCU6 RFG Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
