Taiwan Semiconductor Corporation TESDH3V3B02P4Q2 RIG

Overview

TESDH3V3B02P4Q2 from Taiwan Semiconductor is a 4-line bidirectional ESD protection array designed for high-speed data interfaces including USB 3.1, HDMI 2.0, and DisplayPort. It delivers ±10 kV contact/±15 kV air IEC61000-4-2 ESD protection, 5.5 A IEC61000-4-5 surge capability, ultra-low 0.21 pF typical junction capacitance, 9 V clamping voltage at 16 A TLP, and operates up to 3.3 V DC.

For engineers reviewing the TESDH3V3B02P4Q2 datasheet, TESDH3V3B02P4Q2 pinout, TESDH3V3B02P4Q2 application, or TESDH3V3B02P4Q2 equivalent, key selection criteria include bidirectional 4-channel protection, sub-0.25 pF capacitance for signal integrity, low 9 V clamping under 16 A TLP stress, DFN2510-10L package compatibility with high-density layouts, and compliance with IEC61000-4-2/4-5 standards.

Technical Context

The TESDH3V3B02P4Q2 integrates four independent bidirectional steering diode pairs in a single DFN2510-10L package, each channel configured to clamp transients to GND via internal clamping cells. Its architecture enables simultaneous protection of four high-speed I/O lines without signal degradation.

It uses ultra-low-capacitance PN junctions (C_J = 0.21 pF typ.) and low dynamic resistance (R_DYN = 0.40 Ω typ.) to minimize insertion loss and maintain signal fidelity on interfaces up to 10 Gbps. Clamping behavior is characterized under both 8/20 μs surge (6.0 V max at 5.5 A) and 100 ns TLP (9 V typ. at 16 A).

Key Specifications

Pinout & Package

Package: DFN2510-10L - 2.5 mm × 1.0 mm, 0.55 mm height, exposed thermal pad, RoHS-compliant, halogen-free, MSL Level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with SP1006-04UTG and ESD56081D05, the TESDH3V3B02P4Q2 uniquely combines 4-channel bidirectional protection, 0.21 pF capacitance, dual-GND terminals, and IEC61000-4-2 Level 4 compliance in a 10-pin DFN - making it optimal for next-gen USB 3.1 and HDMI 2.0 designs requiring minimal signal impact and maximum layout flexibility.

Availability

TESDH3V3B02P4Q2 is available at Aetrix Electronics and suitable for USB 3.1 host ports, HDMI 2.0 display interfaces, and DisplayPort 1.4 embedded graphics applications requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production lots.

Supply support for TESDH3V3B02P4Q2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and protection IC manufacturer headquartered in Hsinchu, Taiwan, specializing in ESD, TVS, and surge protection solutions for consumer, computing, and industrial markets.

The TESDH series is engineered specifically for high-speed digital interface protection, emphasizing ultra-low capacitance, precise clamping, and compact packaging to meet stringent SI and EMC requirements of modern serial data standards.

FAQ

What is the maximum operating voltage supported by the TESDH3V3B02P4Q2?

The TESDH3V3B02P4Q2 has a reverse working voltage (V_RWM) of 3.3 V, meaning it is rated for continuous operation up to 3.3 V DC on protected I/O lines. This makes it suitable for 3.3 V, 2.5 V, and 1.8 V logic families without risk of leakage or premature conduction. The device maintains ≤100 nA reverse leakage at 3.3 V and 25°C, ensuring minimal power impact on low-voltage receivers. Always verify system rail tolerances and transient margins before final integration of the TESDH3V3B02P4Q2.

Does the TESDH3V3B02P4Q2 support bidirectional ESD protection on all four channels?

Yes, the TESDH3V3B02P4Q2 provides true bidirectional ESD protection across all four I/O pins (Pins 1, 2, 4, and 5). Each channel contains a symmetrical steering diode pair that clamps positive and negative transients to GND regardless of signal polarity. This eliminates the need for external biasing or orientation-specific placement, enabling direct use on differential high-speed buses like USB 3.1 and HDMI. The TESDH3V3B02P4Q2 datasheet confirms ±10 kV contact/±15 kV air rating per channel under IEC61000-4-2.

How does the clamping performance of TESDH3V3B02P4Q2 compare at different current levels?

The TESDH3V3B02P4Q2 exhibits graded clamping: 3.5 V max at 1 A (8/20 μs), 6.0 V max at 5.5 A (8/20 μs), and 9 V typ. at 16 A (100 ns TLP). This progressive response ensures low-voltage protection during minor ESD events while maintaining safe limits under severe surges. The 9 V TLP clamping value is measured with Z₀ = 50 Ω, 2 ns rise time, and 60–80 ns averaging window - reflecting real-world nanosecond-scale ESD stress. These values are confirmed in the official TSC datasheet Rev. A2203.

Can unused I/O pins on the TESDH3V3B02P4Q2 be left floating?

No - unused I/O pins (e.g., Pins 1, 2, 4, or 5 if fewer than four lines require protection) must not be left floating. Per the TESDH3V3B02P4Q2 application note, unused I/O pins should be connected to GND or left as NC only if explicitly designated as no-connect in the pinout table. In this device, Pins 6, 7, 9, and 10 are NC and may remain unconnected; however, I/O pins are active and floating them risks instability or unintended conduction. Always tie unused I/O pins to GND or route them to a valid signal path when integrating the TESDH3V3B02P4Q2.

What is the recommended PCB layout practice for optimal ESD performance with TESDH3V3B02P4Q2?

For optimal ESD performance, the TESDH3V3B02P4Q2 requires short, direct traces from I/O pins to protected lines and from GND pins (Pins 3 and 8) to a solid PCB ground plane. Trace lengths should be ≤3 mm, and GND connections must avoid vias or narrow necks to minimize inductance. The recommended land pattern (DFN2510-10L) includes an exposed thermal pad tied to GND. Avoid placing capacitors or resistors between the TESDH3V3B02P4Q2 and connector - the device must be the first component encountered by incoming transients.