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Taiwan Semiconductor Corporation TESDH3V3B03P1Q0 M3G
- Part No.:
- TESDH3V3B03P1Q0 M3G
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
TESDH3V3B03P1Q0 M3G.pdf
- Description:
- DFN0603-2L, 3.3V, 40W, 0.2PF, ES
- Quantity:
- Payment:
- Shipping:
Inventory:7,699
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Product details
Overview
TESDH3V3B03P1Q0 from Taiwan Semiconductor is a bidirectional ultra-low capacitance ESD protection diode designed to safeguard single I/O, control, or power lines in high-speed digital interfaces. It delivers ±20 kV IEC61000-4-2 contact/air discharge protection, clamps transients to ≤10.5 V at 4 A (8/20 µs), and features 0.35 pF max junction capacitance for minimal signal distortion-ideal for USB3.1, DisplayPort, and PCIe applications.
For engineers reviewing the TESDH3V3B03P1Q0 datasheet, TESDH3V3B03P1Q0 pinout, TESDH3V3B03P1Q0 application, or TESDH3V3B03P1Q0 equivalent, key selection criteria include its DFN0603-2L footprint, 3.3 V working voltage rating, bidirectional clamping behavior, low dynamic resistance (0.75 Ω), and compliance with IEC61000-4-5 lightning surge (4 A, 8/20 µs).
Technical Context
The TESDH3V3B03P1Q0 employs proprietary clamping cells optimized for fast turn-on and low clamping voltage under ESD and lightning transients. Its bidirectional architecture enables symmetric protection without polarity constraints on data or power lines.
It operates within –55 °C to +125 °C junction temperature range and supports transient suppression up to 40 W peak pulse power (8/20 µs). The device's 0.20–0.35 pF capacitance at 1 MHz and 0 V bias ensures integrity of high-frequency signals in 3.3 V and lower systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Voltage | 3.3 V max - compatible with 3.3 V logic and interface rails without derating |
| ESD Rating | ±20 kV per IEC61000-4-2 (contact & air) - meets industrial and consumer immunity requirements |
| Clamping Voltage | ≤10.5 V at 4 A (8/20 µs) - limits downstream IC stress during lightning surges |
| Junction Capacitance | 0.20–0.35 pF at 1 MHz, 0 V - preserves signal integrity in USB3.x and DisplayPort |
| Dynamic Resistance | 0.75 Ω typical - enables rapid voltage clamping with minimal overshoot |
| Peak Pulse Current | 4 A (8/20 µs), 16 A (TLP, 100 ns) - handles multi-strike and fast-rising transients |
Pinout & Package
Package: DFN0603-2L (0.6 mm × 0.3 mm, 0.2 mm height), moisture sensitivity level 1 per J-STD-020, RoHS and halogen-free compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode | Bidirectional conduction path - connects to protected line (e.g., USB D+) |
| Pin 2 | Cathode | Reference terminal - tied to system ground or common return path |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Enables single-device protection of AC-coupled or floating lines without polarity concerns |
| Ultra-low 0.35 pF capacitance | Minimizes insertion loss and timing skew in >5 Gbps serial links (e.g., USB3.1 Gen1) |
| Fast turn-on response | Sub-nanosecond activation suppresses ESD before sensitive ICs experience overvoltage |
| Low 10.5 V clamping at 4 A | Keeps protected ICs within safe operating area during IEC61000-4-5 surge events |
| DFN0603-2L footprint | Reduces PCB area by >50% vs. SOD-323; compatible with fine-pitch automated assembly |
Applications
| USB3.1 Interface Protection | PCI Express Lane Protection |
|---|---|
Use Scenario: Protecting differential USB3.1 SuperSpeed lanes against ESD during hot-plug events at external ports. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector, shunting ESD energy to ground before reaching controller PHY. Use Value: 0.35 pF capacitance avoids signal integrity degradation at 5 Gbps; ±20 kV rating exceeds USB-IF compliance thresholds. | Use Scenario: Safeguarding PCIe Gen3 x1 or x4 lanes in embedded computing modules exposed to handling ESD. IC Role / Device Role / Timing Role: Low-capacitance clamp on each lane pair, mounted adjacent to edge connector to minimize trace inductance. Use Value: Clamping voltage ≤10.5 V prevents PHY latch-up or damage while maintaining PCIe jitter budgets. |
| DisplayPort Source Port | Notebook Power Rail Clamp |
Use Scenario: ESD protection on DisplayPort main link channels (CH0–CH3) in laptop GPU output circuits. IC Role / Device Role / Timing Role: One TESDH3V3B03P1Q0 per differential pair, placed between source driver and receptacle. Use Value: Sub-0.4 pF capacitance ensures <0.1 UI eye closure at 8.1 Gbps; bidirectional operation matches AC-coupled signaling. | Use Scenario: Clamping 3.3 V always-on power rail (e.g., RTC, SMBus) against board-level ESD coupling. IC Role / Device Role / Timing Role: Standoff protector between power input and load, referenced to system ground plane. Use Value: 3.3 V VRWM aligns with rail voltage; 50 nA leakage avoids battery drain in sleep states. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD321DPYR (Texas Instruments) | 0.3 pF typ, 3.6 V VRWM, ±20 kV ESD, DFN1006-2L (1.0 × 0.6 mm) | Larger footprint; higher VRWM may reduce margin on 3.3 V rails | Prefer TESDH3V3B03P1Q0 where board space is constrained and exact 3.3 V matching is required. |
| SP1001-01UTG (Littelfuse) | 0.35 pF max, 3.3 V VRWM, ±20 kV ESD, SOD-323 (1.7 × 1.3 mm) | 3× larger package; higher parasitic inductance degrades high-frequency clamping | TESDH3V3B03P1Q0 offers superior RF performance and layout density for compact high-speed designs. |
Compared with ESD321DPYR and SP1001-01UTG, the TESDH3V3B03P1Q0 provides identical ESD robustness and voltage rating in a 60% smaller footprint than SOD-323 and 40% smaller than DFN1006-2L-enabling tighter placement near connectors and preserving signal integrity in dense routing environments.
Availability
TESDH3V3B03P1Q0 is available at Aetrix Electronics and suitable for USB3.1 interface protection, PCIe lane hardening, and DisplayPort source port safeguarding requiring stable component supply across production lifecycles.
Supply support for TESDH3V3B03P1Q0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and protection device manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.
The TESD series targets high-speed interface protection, emphasizing ultra-low capacitance, precise voltage matching, and miniature packaging for next-generation connectivity standards including USB Type-C and PCIe 5.0.
FAQ
What is the maximum working voltage supported by the TESDH3V3B03P1Q0?
The TESDH3V3B03P1Q0 has a reverse working voltage (VRWM) of 3.3 V, meaning it is rated for continuous operation on 3.3 V power or signal lines. Exceeding this voltage risks premature conduction and increased leakage. This rating makes the TESDH3V3B03P1Q0 ideal for protecting 3.3 V I/O rails in USB3.1, PCIe, and DisplayPort applications without derating.
Does the TESDH3V3B03P1Q0 support bidirectional ESD protection?
Yes, the TESDH3V3B03P1Q0 is explicitly designed as a bidirectional ESD protection diode. Its symmetrical clamping behavior protects both positive and negative transients equally, making it suitable for AC-coupled differential lines like USB3.x, PCIe, and DisplayPort without polarity constraints. This eliminates the need for orientation-aware placement during assembly.
What is the junction capacitance of the TESDH3V3B03P1Q0, and why does it matter?
The TESDH3V3B03P1Q0 exhibits 0.20–0.35 pF junction capacitance at 1 MHz and 0 V bias. This ultra-low value minimizes signal loading and phase distortion on high-speed serial links-critical for maintaining eye diagram integrity in 5 Gbps+ interfaces such as USB3.1 Gen1 and DisplayPort 1.4. Lower capacitance directly correlates with reduced insertion loss and jitter.
Can the TESDH3V3B03P1Q0 withstand lightning surge per IEC61000-4-5?
Yes, the TESDH3V3B03P1Q0 is rated for 4 A peak pulse current (8/20 µs waveform) per IEC61000-4-5, corresponding to Level 3 lightning surge immunity. Its clamping voltage remains ≤10.5 V under this stress, ensuring downstream components stay within safe operating limits. This capability is validated in the device's absolute maximum ratings and electrical specifications tables.
What package type does the TESDH3V3B03P1Q0 use, and what are its key mechanical attributes?
The TESDH3V3B03P1Q0 uses the DFN0603-2L package: 0.6 mm × 0.3 mm body size, 0.2 mm profile, with two terminals (anode and cathode) and a cathode indicator notch. It complies with J-STD-020 moisture sensitivity level 1, enabling unlimited floor life and standard reflow processing-ideal for high-volume automated assembly of compact portable electronics.
TESDH3V3B03P1Q0 M3G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 6.5V
- Voltage - Clamping (Max) @ Ipp:
- 10.5V
- Current - Peak Pulse (10/1000µs):
- 4A (8/20µs)
- Power - Peak Pulse:
- 40W
- Power Line Protection:
- No
- Applications:
- USB
- Capacitance @ Frequency:
- 0.2pF @ 1MHz
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN0603-2L
TESDH3V3B03P1Q0 M3G FAQ
1.How can I place an order for TESDH3V3B03P1Q0 M3G through Aetrix?
Please submit a Request for Quotation (RFQ) for TESDH3V3B03P1Q0 M3G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TESDH3V3B03P1Q0 M3G reliable?
The price and inventory of TESDH3V3B03P1Q0 M3G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TESDH3V3B03P1Q0 M3G is usually 5 days.
3.What payment methods are accepted for TESDH3V3B03P1Q0 M3G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TESDH3V3B03P1Q0 M3G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TESDH3V3B03P1Q0 M3G?
TESDH3V3B03P1Q0 M3G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TESDH3V3B03P1Q0 M3G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TESDH3V3B03P1Q0 M3G?
For technical support, including TESDH3V3B03P1Q0 M3G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TESDH3V3B03P1Q0 M3G requirements.
6.How does Aetrix verify that TESDH3V3B03P1Q0 M3G is sourced from the original manufacturer or authorized distributors?
All TESDH3V3B03P1Q0 M3G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TESDH3V3B03P1Q0 M3G meets industry standards.
7.What is the process for return or replacement of TESDH3V3B03P1Q0 M3G?
All TESDH3V3B03P1Q0 M3G units undergo pre-shipment inspection (PSI). If there is an issue with TESDH3V3B03P1Q0 M3G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TESDH3V3B03P1Q0 M3G part is unused and in its original packaging.
Return procedure for TESDH3V3B03P1Q0 M3G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TESDH3V3B03P1Q0 M3G Tags
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