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Taiwan Semiconductor Corporation TESDH5V0U04P2Q1 RNG
- Part No.:
- TESDH5V0U04P2Q1 RNG
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- TVS Diodes
- Package:
- 3-UFDFN
- Datasheet:
-
TESDH5V0U04P2Q1 RNG.pdf
- Description:
- DFN1006-3L, 5V, 60W, 0.65PF, ESD
- Quantity:
- Payment:
- Shipping:
Inventory:28,956
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Product details
Overview
TESDH5V0U04P2Q1 from Taiwan Semiconductor is a unidirectional ultra-low-capacitance ESD protection diode in DFN1006-3L package, designed for dual-channel high-speed data line protection with 0.65 pF typical junction capacitance, ±20 kV IEC61000-4-2 ESD rating, and 4 A peak pulse current handling per IEC61000-4-5 - deployed in USB 3.0, HDMI 2.0, and PCI Express interfaces.
For engineers reviewing the TESDH5V0U04P2Q1 datasheet, TESDH5V0U04P2Q1 pinout, TESDH5V0U04P2Q1 application, or TESDH5V0U04P2Q1 equivalent, key selection criteria include clamping voltage (22.2 V at 16 A TLP), reverse working voltage (5 V), dynamic resistance (0.85 Ω), and channel-to-channel isolation capacitance (0.25–0.40 pF).
Technical Context
This device integrates two independent unidirectional clamping cells sharing a common anode (Pin 3), enabling simultaneous protection of two high-speed signal lines without cross-talk coupling. Its proprietary silicon structure delivers fast turn-on (<1 ns) and low dynamic resistance to minimize voltage overshoot during 100 ns TLP transients.
The DFN1006-3L footprint supports PCB-level ESD robustness with minimal parasitic inductance, while the 0.57–0.65 pF capacitance between each cathode (Pins 1/2) and anode (Pin 3) ensures signal integrity up to 10 Gbps in differential interfaces like USB 3.0 and HDMI 2.0.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Working Voltage | 5 V - defines maximum continuous DC bias before leakage rise; sets upper limit for protected interface voltage rails (e.g., USB 3.0 VBUS-supplied signaling) |
| Junction Capacitance (Pin1/2 to Pin3) | 0.57–0.65 pF @ 1 MHz, 0 V - enables <10 Gbps data rates with minimal signal distortion in HDMI 2.0 and PCIe Gen3 lanes |
| Clamping Voltage (ITLP = 16 A) | 22.2 V - peak transient voltage seen by downstream ICs during worst-case ESD event; critical for safeguarding 3.3 V or 5 V logic inputs |
| Peak Pulse Current (8/20 μs) | 4 A - withstands lightning-surge-level transients per IEC61000-4-5; determines survivability in industrial/portable equipment surge environments |
| Dynamic Resistance | 0.85 Ω - governs voltage overshoot slope during fast TLP events; lower value reduces clamping delay and improves protection margin |
| ESD Rating (IEC61000-4-2) | ±20 kV contact & air - meets Level 4 immunity for handheld and docking-station applications per EN 61000-6-2 |
Pinout & Package
Package: DFN1006-3L (1.0 mm × 0.6 mm × 0.35 mm, 3-terminal ultra-compact leadless package with exposed thermal pad not electrically connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Cathode 1 | ESD protection node for first high-speed data line (e.g., USB3 TX+ or HDMI TMDS+); connects to signal trace before connector |
| Pin 2 | Cathode 2 | ESD protection node for second high-speed data line (e.g., USB3 TX− or HDMI TMDS−); isolated from Pin 1 by 0.25–0.40 pF inter-pin capacitance |
| Pin 3 | Anode | Common reference terminal tied directly to system ground plane; shortest possible PCB trace required to minimize inductive voltage spike during ESD discharge |
Key Features
| Feature | Design Value |
|---|---|
| Dual-channel unidirectional clamping | Enables independent protection of two signal lines (e.g., differential pair) without shared cathode path or crosstalk-induced failure |
| 0.65 pF max junction capacitance | Preserves signal edge rate and eye diagram integrity in 5–10 Gbps serial links, avoiding jitter or attenuation beyond spec limits |
| 22.2 V clamping at 16 A TLP | Ensures downstream 3.3 V transceivers remain within absolute maximum ratings during worst-case ESD stress (Z0 = 50 Ω, 100 ns) |
| DFN1006-3L footprint | Reduces PCB real estate by >60% vs. SOT-23; eliminates bond wire inductance, improving high-frequency transient response |
| Moisture Sensitivity Level 1 | Allows unlimited floor life and standard reflow without baking; simplifies manufacturing for high-volume portable electronics assembly |
Applications
| USB 3.0 Interface Protection | HDMI 2.0 TMDS Line Protection |
|---|---|
Use Scenario: Protecting SuperSpeed differential pairs (TX+/TX−, RX+/RX−) on laptop motherboard USB 3.0 ports against user-handling ESD. IC Role / Device Role / Timing Role: Unidirectional clamping diode placed inline between connector and controller PHY, with common-anode grounding. Use Value: 0.65 pF capacitance prevents >1 dB insertion loss at 5 GHz, preserving USB 3.0 eye opening; ±20 kV rating covers IEC61000-4-2 Level 4 compliance. | Use Scenario: Safeguarding HDMI 2.0 TMDS clock and data channels on set-top box PCBs exposed to frequent cable insertion/removal. IC Role / Device Role / Timing Role: Dual-channel ESD suppressor mounted adjacent to HDMI receptacle, with Pins 1/2 on TMDS+ and TMDS−, Pin 3 to chassis ground. Use Value: 22.2 V clamping voltage ensures HDMI receiver inputs (rated to 3.6 V abs max) survive 16 A TLP pulses without latch-up or parametric shift. |
| PCI Express Gen3 Lane Protection | Portable Electronics I/O Port Hardening |
Use Scenario: Adding board-level ESD resilience to PCIe Gen3 x4 slots in industrial embedded computers where hot-plug events induce transients. IC Role / Device Role / Timing Role: One TESDH5V0U04P2Q1 per differential lane pair (e.g., PERST# + CLKREQ#), leveraging low dynamic resistance for sub-ns response. Use Value: 0.85 Ω dynamic resistance limits voltage overshoot to <1.5 V above rail during 100 ns ESD events, preventing false resets or timing violations. | Use Scenario: Hardening micro-USB or USB-C receptacles on smartphones and tablets against repeated human-body-model discharges. IC Role / Device Role / Timing Role: Primary ESD front-end device on VBUS and CC lines, operating at 5 V reverse working voltage with MSL1 reflow compatibility. Use Value: RoHS- and halogen-free construction meets global environmental mandates; 0.35 mm profile avoids interference with stacked PCB assemblies in slim form factors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NUP4202MR6T1G | Bi-directional configuration; higher 12 pF capacitance; 12 V clamping at 1 A | Suitable for lower-speed interfaces (USB 2.0, RS-485); not recommended for HDMI 2.0 or PCIe Gen3 due to bandwidth limitation | Select when bi-directional protection is required and data rate ≤ 480 Mbps; avoid for >1 Gbps links |
| Vishay ESDBLE5.0D1W | Unidirectional; 0.5 pF typical capacitance; 13.5 V clamping at 4 A; DFN1006-2L (2-pin) | Single-channel only; requires two devices for dual-line protection; slightly lower clamping but no shared-anode layout advantage | Choose for ultra-low-capacitance priority in space-constrained single-line designs; adds routing complexity for dual-channel use |
Compared with NUP4202MR6T1G and ESDBLE5.0D1W, the TESDH5V0U04P2Q1 uniquely combines dual unidirectional channels, 0.65 pF capacitance, and common-anode architecture - delivering optimal PCB layout efficiency and signal fidelity for multi-gigabit differential interfaces without sacrificing ESD margin.
Availability
TESDH5V0U04P2Q1 is available at Aetrix Electronics and suitable for USB 3.0 interface protection, HDMI 2.0 TMDS line hardening, and PCIe Gen3 lane surge suppression requiring stable component supply across consumer, industrial, and computing OEM programs.
Supply support for TESDH5V0U04P2Q1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in ESD protection, TVS diodes, MOSFETs, and rectifiers since 1979.
The TESDH series targets high-speed interface protection with ultra-low capacitance and fast transient response, specifically engineered for next-generation serial data standards including USB 3.x, HDMI, and PCI Express.
FAQ
What is the maximum operating temperature range for the TESDH5V0U04P2Q1?
The TESDH5V0U04P2Q1 has an operating junction temperature range of −55 °C to +125 °C, verified per its Absolute Maximum Ratings table. This allows reliable deployment in automotive infotainment modules and industrial gateways where ambient temperatures exceed 85 °C. The device's thermal performance is optimized for the DFN1006-3L package, and derating curves for peak pulse power versus temperature are provided in Figure 1 of the datasheet. TESDH5V0U04P2Q1 maintains full IEC61000-4-2 ±20 kV ESD capability across this entire range.
How does the TESDH5V0U04P2Q1 achieve 0.65 pF capacitance while maintaining ±20 kV ESD robustness?
The TESDH5V0U04P2Q1 achieves ultra-low capacitance through proprietary silicon process optimization and minimized junction area in its dual-clamp cell design, while sustaining ±20 kV ESD robustness via controlled avalanche breakdown characteristics and low dynamic resistance (0.85 Ω). Its 0.57–0.65 pF capacitance is measured at 1 MHz and 0 V bias between each cathode and the common anode - a value validated under production test conditions. TESDH5V0U04P2Q1 balances these parameters without trade-offs in clamping voltage (22.2 V at 16 A TLP), ensuring both signal integrity and protection margin.
Can the TESDH5V0U04P2Q1 be used for bidirectional signal lines such as USB 2.0 D+ and D−?
No - the TESDH5V0U04P2Q1 is strictly unidirectional, with separate cathodes (Pins 1 and 2) and a shared anode (Pin 3), making it unsuitable for bidirectional data lines without external biasing. For USB 2.0 D+/D− protection, a bi-directional device like the NUP4202MR6T1G is required. TESDH5V0U04P2Q1 is intended for unidirectional high-speed interfaces such as HDMI TMDS, PCIe transmit/receive lanes, or USB 3.0 SuperSpeed differential pairs where polarity is fixed. Using TESDH5V0U04P2Q1 on bidirectional lines risks forward conduction during normal operation.
What is the recommended PCB layout practice for minimizing inductance with the TESDH5V0U04P2Q1?
Per the Application Information section, the anode (Pin 3) must connect directly to the system ground plane using the shortest possible trace - ideally a dedicated thermal via stack beneath the pad - to minimize parasitic inductance that could elevate clamping voltage during ESD events. Signal traces to Pins 1 and 2 should be impedance-controlled and routed symmetrically. The datasheet's Suggested Pad Layout (Page 6) specifies 0.35 mm solder mask defined pads with 0.25 mm stencil aperture. TESDH5V0U04P2Q1 performance degrades measurably if anode trace length exceeds 2 mm or if ground vias are omitted.
Is the TESDH5V0U04P2Q1 compliant with automotive AEC-Q200 requirements?
No - the TESDH5V0U04P2Q1 is not AEC-Q200 qualified. Its qualification scope covers commercial and industrial temperature grades (−55 °C to +125 °C junction), RoHS, and halogen-free compliance per IEC 61249-2-21, but it lacks the extended reliability testing (temperature cycling, vibration, humidity bias) required for automotive applications. For AEC-Q200 Grade 2 (−40 °C to +105 °C) ESD protection, consider TSC's automotive-qualified TESDx series. TESDH5V0U04P2Q1 remains appropriate for consumer notebooks, docking stations, and industrial HMIs where AEC-Q200 is not mandated.
TESDH5V0U04P2Q1 RNG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Package/Case:
- 3-UFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5V (Max)
- Voltage - Breakdown (Min):
- 7V
- Voltage - Clamping (Max) @ Ipp:
- 15V
- Current - Peak Pulse (10/1000µs):
- 4A (8/20µs)
- Power - Peak Pulse:
- 60W
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.65pF @ 1MHz
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1006-3L
TESDH5V0U04P2Q1 RNG FAQ
1.How can I place an order for TESDH5V0U04P2Q1 RNG through Aetrix?
Please submit a Request for Quotation (RFQ) for TESDH5V0U04P2Q1 RNG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TESDH5V0U04P2Q1 RNG reliable?
The price and inventory of TESDH5V0U04P2Q1 RNG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TESDH5V0U04P2Q1 RNG is usually 5 days.
3.What payment methods are accepted for TESDH5V0U04P2Q1 RNG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TESDH5V0U04P2Q1 RNG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TESDH5V0U04P2Q1 RNG?
TESDH5V0U04P2Q1 RNG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TESDH5V0U04P2Q1 RNG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TESDH5V0U04P2Q1 RNG?
For technical support, including TESDH5V0U04P2Q1 RNG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TESDH5V0U04P2Q1 RNG requirements.
6.How does Aetrix verify that TESDH5V0U04P2Q1 RNG is sourced from the original manufacturer or authorized distributors?
All TESDH5V0U04P2Q1 RNG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TESDH5V0U04P2Q1 RNG meets industry standards.
7.What is the process for return or replacement of TESDH5V0U04P2Q1 RNG?
All TESDH5V0U04P2Q1 RNG units undergo pre-shipment inspection (PSI). If there is an issue with TESDH5V0U04P2Q1 RNG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TESDH5V0U04P2Q1 RNG part is unused and in its original packaging.
Return procedure for TESDH5V0U04P2Q1 RNG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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