My Inquiry
My Account
Taiwan Semiconductor Corporation TESDL24VB17P1Q1 RNG
- Part No.:
- TESDL24VB17P1Q1 RNG
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- TVS Diodes
- Package:
- 0402 (1006 Metric)
- Datasheet:
-
TESDL24VB17P1Q1 RNG.pdf
- Description:
- DFN1006-2L, 24V, 150W, 17.5PF, E
- Quantity:
- Payment:
- Shipping:
Inventory:19,990
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TESDL24VB17P1Q1 from Taiwan Semiconductor is a bidirectional ESD protection diode in DFN1006-2L package, rated for ±30 kV IEC61000-4-2 (air/contact), 3 A peak pulse current (8/20 µs), 24 V reverse working voltage, and 50 V clamping voltage at 3 A - deployed on power and control lines in portable instrumentation and PCB-level 24 V system protection.
For engineers reviewing the TESDL24VB17P1Q1 datasheet, TESDL24VB17P1Q1 pinout, TESDL24VB17P1Q1 application, or TESDL24VB17P1Q1 equivalent, key selection factors include clamping voltage under 3 A surge, junction capacitance below 17.5 pF at 0 V, dynamic resistance ≤0.45 Ω, compliance with IEC61000-4-4 (4 kV EFT), and moisture sensitivity level 1 handling.
Technical Context
This device implements a proprietary bidirectional clamping cell architecture optimized for transient suppression on low-speed I/O and power rails. It delivers symmetrical breakdown behavior (VBR = 25.2–32.6 V) and low dynamic resistance (0.45 Ω typical) to minimize voltage overshoot during fast transients like ESD and lightning surges.
Designed for 24 V systems, it operates across –55 °C to +125 °C, supports 100 ns TLP testing (VCL = 31 V at 2 A, 33.7 V at 8 A), and maintains <50 nA leakage at 24 V - enabling robust protection without signal integrity degradation in space-constrained layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse working voltage | 24 V - maximum continuous DC or RMS operating voltage before leakage rises significantly |
| Clamping voltage @ 3 A (8/20 µs) | 50 V - peak line voltage seen by downstream ICs during IEC61000-4-5 surge events |
| Junction capacitance @ 1 MHz, 0 V | 13.9–17.5 pF - minimal loading on low-speed data/control lines (e.g., UART, GPIO, power enable) |
| Dynamic resistance | 0.45 Ω typical - ensures rapid voltage collapse during ESD transients, reducing energy dissipation in protected circuitry |
| ESD rating (IEC61000-4-2) | ±30 kV contact & air - meets highest industrial immunity requirement for handheld and field-deployed equipment |
| Peak pulse current (8/20 µs) | 3 A - withstands lightning-induced surges per IEC61000-4-5 Level 3 |
| Moisture sensitivity level | Level 1 (J-STD-020) - no bake required prior to reflow, simplifying SMT assembly |
Pinout & Package
DFN1006-2L package: 1.075 × 0.675 mm, 0.3 mm height, cathode-indicated via notch/chamfer on terminal II; RoHS-compliant, halogen-free, and MSL-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Terminal I | Anode (bidirectional) | One side of symmetrical clamping path; connects to protected line (e.g., VIN, GPIO) |
| Terminal II | Cathode (marked) | Reference node (typically GND or common rail); defines polarity marking for orientation during placement |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Enables single-device protection on unidirectional or AC-coupled lines without polarity constraints |
| Low clamping voltage (50 V @ 3 A) | Keeps protected ICs within safe absolute maximum ratings during 8/20 µs surges |
| 13.9–17.5 pF junction capacitance | Preserves signal rise/fall times on lines up to ~10 MHz (e.g., SMBus, I²C, push-button inputs) |
| 0.45 Ω dynamic resistance | Reduces clamping voltage overshoot and improves energy diversion efficiency vs. higher-RDYN alternatives |
| IEC61000-4-4 EFT immunity (4 kV) | Supports reliable operation in electrically noisy industrial environments with repetitive fast transients |
Applications
| Portable Instrumentation | 24 V Power Rail Protection |
|---|---|
Use Scenario: Handheld multimeters, data loggers, and battery-powered test equipment exposed to user-handling ESD. IC Role / Device Role / Timing Role: Bidirectional ESD clamp on analog front-end inputs and power switch control lines. Use Value: Prevents latch-up or gate oxide damage in precision ADCs and microcontrollers during ±30 kV contact discharge events. | Use Scenario: 24 V input stage of industrial sensors, PLC I/O modules, or motor drivers on PCBs. IC Role / Device Role / Timing Role: Primary overvoltage suppressor on VIN rail upstream of DC-DC converters and LDOs. Use Value: Limits transient voltage to ≤50 V during 3 A lightning surges, protecting downstream regulators from overvoltage shutdown or failure. |
| General Purpose I/O Protection | PCB-Level Control Line Shielding |
Use Scenario: Front-panel buttons, LED indicators, and configuration jumpers on embedded control panels. IC Role / Device Role / Timing Role: Point-of-use ESD shunt on each I/O trace routed to MCU GPIO pins. Use Value: Maintains <50 nA leakage at 24 V while delivering sub-50 V clamping - avoids false triggering or bias shift in high-impedance inputs. | Use Scenario: Isolation of communication enable lines (e.g., RS-485 DE/RE, CAN standby) from board-edge connectors. IC Role / Device Role / Timing Role: Low-capacitance transient suppressor placed adjacent to connector footprint. Use Value: 17.5 pF max capacitance prevents signal distortion on 100 kbps–1 Mbps control signals while meeting ±30 kV ESD immunity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Semtech RCLAMP0524P.TCT | Higher VRWM (5 V), lower clamping (24 V @ 3 A), 12 pF typical capacitance | Optimized for 3.3–5 V logic lines; unsuitable for 24 V rails due to premature conduction | Select only for low-voltage I/O; not interchangeable with TESDL24VB17P1Q1 in 24 V systems |
| Littelfuse SP3205-01UTG | Same VRWM (24 V), higher clamping (60 V @ 3 A), 18 pF max capacitance, MSL-3 | Acceptable for 24 V power lines but requires baking before reflow; slightly higher voltage stress on protected ICs | Use where MSL-1 is not mandatory and 10 V higher clamping is tolerable |
Compared with RCLAMP0524P.TCT and SP3205-01UTG, the TESDL24VB17P1Q1 uniquely balances 24 V operation, 50 V clamping, MSL-1 handling, and 17.5 pF capacitance - making it optimal for space-constrained 24 V industrial I/O where process simplicity and voltage margin are critical.
Availability
TESDL24VB17P1Q1 is available at Aetrix Electronics and suitable for portable instrumentation, 24 V power rail protection, and general-purpose I/O requiring stable component supply and full traceability.
Supply support for TESDL24VB17P1Q1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in ESD protection, TVS diodes, rectifiers, and MOSFETs since 1979.
The TESDL series targets compact, high-reliability ESD solutions for industrial and portable electronics, emphasizing low clamping voltage, tight parameter distribution, and MSL-1 manufacturability in ultra-small DFN packages.
FAQ
What is the maximum continuous operating voltage for the TESDL24VB17P1Q1?
The TESDL24VB17P1Q1 has a reverse working voltage (VRWM) of 24 V, meaning it can safely block up to 24 V DC or RMS in normal operation without significant leakage. This rating ensures compatibility with standard 24 V industrial power rails and control circuits while maintaining <50 nA leakage at rated voltage - critical for preserving signal integrity and power efficiency in always-on systems.
Does the TESDL24VB17P1Q1 meet IEC61000-4-2 Level 4 ESD requirements?
Yes, the TESDL24VB17P1Q1 exceeds IEC61000-4-2 Level 4, delivering ±30 kV ESD protection for both contact and air discharge - the highest defined test level in the standard. This performance is achieved through its proprietary bidirectional clamping cell design and verified in third-party lab testing per the specification, making the TESDL24VB17P1Q1 suitable for demanding end-equipment certifications in industrial and medical-adjacent applications.
What is the clamping voltage of the TESDL24VB17P1Q1 under a 3 A 8/20 µs surge?
The clamping voltage of the TESDL24VB17P1Q1 is specified as ≤50 V when subjected to a 3 A, 8/20 µs current waveform per IEC61000-4-5. This value represents the maximum voltage that appears across the device terminals during the surge event and directly determines the stress imposed on downstream components - ensuring ICs with 55 V absolute maximum ratings remain fully protected.
Is the TESDL24VB17P1Q1 compatible with lead-free reflow processes?
Yes, the TESDL24VB17P1Q1 is qualified for standard lead-free reflow profiles (JEDEC J-STD-020), with a moisture sensitivity level (MSL) of 1 - meaning it may be stored indefinitely at ambient conditions and placed directly into reflow without pre-baking. Its DFN1006-2L package uses matte tin terminations and passes thermal cycling and solderability tests per industry standards.
How does the dynamic resistance of the TESDL24VB17P1Q1 affect its ESD performance?
The TESDL24VB17P1Q1 exhibits a typical dynamic resistance (RDYN) of 0.45 Ω, measured between 2 A and 8 A TLP pulses. This low value enables faster voltage collapse during ESD events, reducing both clamping voltage overshoot and total energy dissipated in the protected circuit - directly improving reliability of sensitive downstream components such as microcontrollers and analog front-ends in the TESDL24VB17P1Q1-protected system.
TESDL24VB17P1Q1 RNG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Package/Case:
- 0402 (1006 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 24V (Max)
- Voltage - Breakdown (Min):
- 25.2V
- Voltage - Clamping (Max) @ Ipp:
- 50V
- Current - Peak Pulse (10/1000µs):
- 3A (8/20µs)
- Power - Peak Pulse:
- 150W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 13.9pF @ 1MHz
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1006-2L
TESDL24VB17P1Q1 RNG FAQ
1.How can I place an order for TESDL24VB17P1Q1 RNG through Aetrix?
Please submit a Request for Quotation (RFQ) for TESDL24VB17P1Q1 RNG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TESDL24VB17P1Q1 RNG reliable?
The price and inventory of TESDL24VB17P1Q1 RNG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TESDL24VB17P1Q1 RNG is usually 5 days.
3.What payment methods are accepted for TESDL24VB17P1Q1 RNG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TESDL24VB17P1Q1 RNG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TESDL24VB17P1Q1 RNG?
TESDL24VB17P1Q1 RNG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TESDL24VB17P1Q1 RNG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TESDL24VB17P1Q1 RNG?
For technical support, including TESDL24VB17P1Q1 RNG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TESDL24VB17P1Q1 RNG requirements.
6.How does Aetrix verify that TESDL24VB17P1Q1 RNG is sourced from the original manufacturer or authorized distributors?
All TESDL24VB17P1Q1 RNG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TESDL24VB17P1Q1 RNG meets industry standards.
7.What is the process for return or replacement of TESDL24VB17P1Q1 RNG?
All TESDL24VB17P1Q1 RNG units undergo pre-shipment inspection (PSI). If there is an issue with TESDL24VB17P1Q1 RNG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TESDL24VB17P1Q1 RNG part is unused and in its original packaging.
Return procedure for TESDL24VB17P1Q1 RNG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TESDL24VB17P1Q1 RNG Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
