Taiwan Semiconductor Corporation TESDL5V0B45P1M3 RWG
- Part No.:
- TESDL5V0B45P1M3 RWG
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- TVS Diodes
- Package:
- SC-76, SOD-323
- Datasheet:
-
TESDL5V0B45P1M3 RWG.pdf
- Description:
- SOD-323, 5V, 130W, 45PF, ESD PRO
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TESDL5V0B45P1M3 from Taiwan Semiconductor is a bidirectional ESD and transient voltage suppressor designed to protect a single I/O, control, or low-speed data line in 5 V and below systems. It delivers ±30 kV IEC 61000-4-2 (contact/air) ESD immunity, 12 A (8/20 µs) IEC 61000-4-5 lightning surge capability, 5 V working voltage, 14 V clamping at 12 A, and 36–45 pF junction capacitance - deployed in portable audio devices, notebook power rails, and peripheral USB interfaces.
For engineers reviewing the TESDL5V0B45P1M3 datasheet, TESDL5V0B45P1M3 pinout, TESDL5V0B45P1M3 application, or TESDL5V0B45P1M3 equivalent, key selection criteria include bidirectional clamping behavior, sub-14 V clamping at full 12 A surge, SOD-323 footprint compatibility, low leakage (<100 nA), and suitability for space-constrained 5 V signal-line protection without compromising signal integrity.
Technical Context
The TESDL5V0B45P1M3 employs solid-state silicon-avalanche and active circuit triggering technology to achieve fast turn-on during transients. Its proprietary clamping cell architecture enables symmetrical bidirectional conduction with reverse breakdown between 5.5 V and 9.5 V at 1 mA, ensuring robust protection for both positive and negative polarity surges.
It operates across –55 °C to +150 °C junction temperature, supports ≤100 nA leakage at 5 V, and maintains 36–45 pF capacitance at 0 V bias - making it suitable for low-speed digital, analog audio, and DC power line protection where minimal capacitive loading and thermal resilience are required.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Voltage (VRWM) | 5 V - Maximum continuous DC voltage the device blocks without clamping; defines compatibility with 5 V logic and supply rails. |
| Breakdown Voltage (VBR) | 5.5–9.5 V @ 1 mA - Threshold at which avalanche conduction initiates; ensures reliable triggering before downstream IC damage. |
| Clamping Voltage (VC) | ≤14 V @ 12 A (8/20 µs) - Peak voltage seen by protected line during worst-case lightning surge; limits stress on connected ICs. |
| ESD Rating | ±30 kV contact & air (IEC 61000-4-2) - Validates immunity to human-body-model and system-level ESD events in handheld and desktop environments. |
| Junction Capacitance | 36–45 pF @ 1 MHz, 0 V - Low enough to avoid signal distortion on USB 1.1, I²C, SMBus, or analog audio lines. |
| Peak Pulse Current | 12 A (8/20 µs, IEC 61000-4-5) - Sustains high-energy lightning-induced transients without failure or parameter shift. |
| Leakage Current | ≤100 nA @ 5 V - Negligible standby power loss and no measurable impact on high-impedance sensor or reference circuits. |
Pinout & Package
SOD-323 surface-mount package: 2-pin, ultra-compact (1.7 × 1.25 × 0.9 mm), moisture sensitivity level 1 (J-STD-020), RoHS and halogen-free compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode 1 | One terminal of the bidirectional clamping diode pair; connects to protected line (e.g., USB D+, I²C SDA). |
| Pin 2 | Anode 2 | Second terminal of the symmetric clamping structure; connects to system ground or common reference plane. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional ESD protection | Enables single-device protection of AC-coupled or floating lines (e.g., audio jacks, RS-232) without polarity constraints. |
| Low clamping voltage (≤14 V @ 12 A) | Keeps transient overvoltage below absolute maximum ratings of 3.3 V/5 V interface ICs such as USB transceivers or microcontroller GPIOs. |
| 36–45 pF junction capacitance | Preserves signal rise/fall times on low-speed buses (≤1 Mbps) while minimizing crosstalk and insertion loss. |
| Solid-state avalanche + active triggering | Ensures sub-nanosecond response time and stable clamping performance across temperature and lifetime, unlike passive polymer-based TVS. |
| SOD-323 footprint | Reduces PCB area by >50% vs. SOD-123 or DO-214AC packages, enabling placement directly at board edge connectors. |
Applications
| USB 2.0 Peripheral Ports | Audio Jack ESD Protection |
|---|---|
Use Scenario: Protecting USB D+ and D− lines on external keyboards, mice, or flash drives against user-hand ESD events during hot-plug insertion. IC Role / Device Role / Timing Role: Bidirectional clamping diode placed in series with each data line, referenced to chassis ground. Use Value: Prevents latch-up or gate oxide rupture in USB PHY ICs by limiting transient voltage to ≤14 V during ±30 kV contact discharge. | Use Scenario: Shielding 3.5 mm stereo headphone/mic jack pins from ESD when users insert/remove cables in portable speakers or laptops. IC Role / Device Role / Timing Role: Two-channel protection using one TESDL5V0B45P1M3 per signal path (left/right/mic), mounted adjacent to jack footprint. Use Value: Maintains <45 pF loading to preserve audio frequency response up to 20 kHz while surviving repeated ±30 kV air discharges. |
| 5 V Power Rail Clamping | I²C Bus Line Protection |
Use Scenario: Safeguarding 5 V input rails on embedded modules (e.g., Wi-Fi SoM) exposed to ESD via external power adapters or docking stations. IC Role / Device Role / Timing Role: Placed between connector and LDO input, shunting surge current to ground before regulator input capacitor. Use Value: Limits rail overshoot to ≤14 V during 12 A lightning pulses, preventing LDO internal overvoltage shutdown or pass-FET damage. | Use Scenario: Protecting SCL/SDA lines in industrial sensors or display controllers operating at 100–400 kHz clock rates. IC Role / Device Role / Timing Role: One TESDL5V0B45P1M3 per line, installed within 5 mm of MCU I²C pins to minimize trace inductance. Use Value: Adds <45 pF load without violating I²C bus capacitance budget (≤400 pF), ensuring reliable multi-drop communication under ESD stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESD9B5.0ST5G | Same SOD-323 package; 5.0 V VRWM; 12.5 V VC @ 12 A; 30 pF typical capacitance. | Slightly lower clamping and capacitance - better for margin-sensitive 5 V logic but less robust at high-temp leakage. | Prefer when tighter clamping tolerance and lower CJ are prioritized over absolute peak pulse rating. |
| Vishay VEML509001 | SOD-323; 5.0 V VRWM; 13.5 V VC @ 12 A; 40 pF max; ±30 kV ESD rated. | Near-identical electrical envelope but higher MSL level (MSL3); requires bake prior to reflow if stored >12 months. | Choose when sourcing flexibility across multiple authorized distributors is critical and MSL handling is controlled. |
Compared with ESD9B5.0ST5G and VEML509001, the TESDL5V0B45P1M3 offers the highest peak pulse power (130 W), widest VBR range (5.5–9.5 V), and MSL1 handling - simplifying manufacturing flow and enhancing reliability in thermally aggressive environments like automotive infotainment power supplies.
Availability
TESDL5V0B45P1M3 is available at Aetrix Electronics and suitable for USB peripheral protection, audio jack hardening, 5 V power rail clamping, and I²C bus safeguarding requiring stable component supply across high-mix consumer electronics production.
Supply support for TESDL5V0B45P1M3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and protection device manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.
The TESDL series targets compact, high-reliability ESD protection for space-constrained interfaces - engineered specifically for single-line bidirectional clamping in 3.3 V/5 V systems where low capacitance, fast response, and MSL1 manufacturability are mandatory.
FAQ
What is the maximum clamping voltage of the TESDL5V0B45P1M3 under full-rated surge current?
The TESDL5V0B45P1M3 clamps to ≤14 V when subjected to a 12 A (8/20 µs) peak pulse current per IEC 61000-4-5. This value is measured non-repetitively and represents the upper limit of voltage imposed on the protected line during worst-case lightning transients. The clamping behavior remains stable across its –55 °C to +150 °C operating junction temperature range, and the TESDL5V0B45P1M3 maintains this performance without degradation after multiple surge events within datasheet limits.
Is the TESDL5V0B45P1M3 suitable for protecting high-speed data lines like USB 3.0 or HDMI?
No, the TESDL5V0B45P1M3 is not recommended for USB 3.0, HDMI, or other >1 Gbps interfaces due to its 36–45 pF junction capacitance, which would cause excessive signal attenuation and jitter. It is explicitly characterized and validated for low-speed applications including USB 2.0 (480 Mbps), I²C, UART, audio lines, and 5 V power rails. For high-speed protection, dedicated low-capacitance TVS arrays such as the TESDL5V0D45P1M3 (dual-channel, 0.8 pF) are specified instead of the TESDL5V0B45P1M3.
Does the TESDL5V0B45P1M3 require external components like series resistors or RC filters to function properly?
No, the TESDL5V0B45P1M3 operates as a standalone bidirectional clamping device and does not require external series resistors, capacitors, or filters to meet its rated ESD and surge specifications. However, layout best practices - including short trace lengths (<5 mm) from protected line to device pins, placement adjacent to connectors, and a low-inductance ground return path - are essential to achieve full ±30 kV ESD and 12 A surge performance. These guidelines ensure the TESDL5V0B45P1M3 activates before transient energy couples into downstream circuitry.
What is the meaning of "bidirectional" in the context of the TESDL5V0B45P1M3?
"Bidirectional" means the TESDL5V0B45P1M3 provides symmetrical clamping for both positive and negative voltage transients - it conducts equally when either pin is driven positive relative to the other. This allows protection of AC-coupled or floating signal lines (e.g., audio jacks, RS-232) without regard to polarity, unlike unidirectional TVS diodes that require correct anode/cathode orientation. The TESDL5V0B45P1M3 achieves this via an internal back-to-back diode configuration, and its pinout (Anode 1 / Anode 2) reflects this dual-anode topology rather than conventional cathode/anode assignment.
How does the TESDL5V0B45P1M3 compare to standard Zener-based TVS diodes in terms of response time and reliability?
The TESDL5V0B45P1M3 uses proprietary silicon-avalanche and active circuit triggering technology, achieving sub-nanosecond response - significantly faster than conventional Zener-based TVS diodes, which rely solely on avalanche breakdown and exhibit greater statistical variation in turn-on delay. This results in more consistent clamping onset and lower let-through energy during ESD events. Additionally, the TESDL5V0B45P1M3's monolithic construction and MSL1 rating enhance long-term reliability in automated assembly and high-temperature operation, whereas many Zener TVS parts degrade faster under thermal cycling. The TESDL5V0B45P1M3 is thus preferred where repeatable, low-jitter protection is critical.
TESDL5V0B45P1M3 RWG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Package/Case:
- SC-76, SOD-323
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5V (Max)
- Voltage - Breakdown (Min):
- 5.5V
- Voltage - Clamping (Max) @ Ipp:
- 14V
- Current - Peak Pulse (10/1000µs):
- 12A (8/20µs)
- Power - Peak Pulse:
- 130W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 36pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-323
TESDL5V0B45P1M3 RWG FAQ
1.How can I place an order for TESDL5V0B45P1M3 RWG through Aetrix?
Please submit a Request for Quotation (RFQ) for TESDL5V0B45P1M3 RWG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TESDL5V0B45P1M3 RWG reliable?
The price and inventory of TESDL5V0B45P1M3 RWG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TESDL5V0B45P1M3 RWG is usually 5 days.
3.What payment methods are accepted for TESDL5V0B45P1M3 RWG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TESDL5V0B45P1M3 RWG transactions.
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4.How is shipping managed for TESDL5V0B45P1M3 RWG?
TESDL5V0B45P1M3 RWG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TESDL5V0B45P1M3 RWG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TESDL5V0B45P1M3 RWG?
For technical support, including TESDL5V0B45P1M3 RWG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TESDL5V0B45P1M3 RWG requirements.
6.How does Aetrix verify that TESDL5V0B45P1M3 RWG is sourced from the original manufacturer or authorized distributors?
All TESDL5V0B45P1M3 RWG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TESDL5V0B45P1M3 RWG meets industry standards.
7.What is the process for return or replacement of TESDL5V0B45P1M3 RWG?
All TESDL5V0B45P1M3 RWG units undergo pre-shipment inspection (PSI). If there is an issue with TESDL5V0B45P1M3 RWG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TESDL5V0B45P1M3 RWG part is unused and in its original packaging.
Return procedure for TESDL5V0B45P1M3 RWG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TESDL5V0B45P1M3 RWG Tags

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