Taiwan Semiconductor Corporation TESDU12V RGG
- Part No.:
- TESDU12V RGG
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- TVS Diodes
- Package:
- 0603 (1608 Metric)
- Datasheet:
-
TESDU12V RGG.pdf
- Description:
- 0603, 12V, 25W, 12PF, ESD PROTEC
- Quantity:
- Payment:

- Shipping:

Inventory:21,679
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Product details
Overview
TESDU12V RGG from Taiwan Semiconductor is a bi-directional ESD protection diode in 0603 package, rated for 12 V working voltage, ±15 kV air/±8 kV contact ESD immunity per IEC 61000-4-2, 33 V clamping voltage at 5 A peak pulse current, and 15 pF junction capacitance - deployed to safeguard USB 2.0 data lines in portable instrumentation.
For engineers reviewing the TESDU12V RGG datasheet, TESDU12V RGG pinout, TESDU12V RGG application, or TESDU12V RGG equivalent, key selection criteria include clamping voltage under 5 A surge, low capacitance for high-speed signal integrity, RoHS-compliant green compound packaging, and compatibility with reflow soldering at 260°C/10s.
Technical Context
This device implements a single-channel, bi-directional TVS structure optimized for transient suppression on I/O lines. It features gold-plated terminals compliant with MIL-STD-705 Method 2026 and operates across –55°C to +150°C junction temperature range.
The TESDU12V RGG delivers 25 W peak pulse power (8/20 µs waveform), reverse stand-off voltage of 12 V, breakdown voltage ≥13 V at 1 mA, and reverse leakage ≤25 µA at VR = 12 V - enabling robust protection without signal distortion in space-constrained layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Voltage | 12 V - defines maximum continuous DC operating voltage before leakage increases significantly |
| Clamping Voltage (IPP = 5 A) | 33 V - limits transient voltage seen by downstream IC during 5 A ESD event, protecting 3.3 V/5 V logic |
| Junction Capacitance | 15 pF at 0 V, 1 MHz - low enough to avoid signal degradation on USB 2.0 (480 Mbps) lines |
| ESD Rating (IEC 61000-4-2) | ±15 kV air, ±8 kV contact - exceeds industrial immunity requirements for handheld interfaces |
| Package | 0603 (1.6 × 0.8 mm) - enables placement adjacent to connectors with minimal PCB area |
| Moisture Sensitivity Level | MSL 1 - allows unlimited floor life and standard reflow without baking |
Pinout & Package
0603 small-outline plastic package with two terminals: anode and cathode arranged in a bi-directional configuration. Gold-plated terminations ensure solderability per MIL-STD-705 Method 2026.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Transient current entry point (positive polarity) | Conducts surge current toward ground when positive ESD event occurs on protected line |
| Cathode | Transient current entry point (negative polarity) | Conducts surge current toward ground when negative ESD event occurs - enables bi-directional clamping |
Key Features
| Feature | Design Value |
|---|---|
| Bi-directional ESD protection | Single-device solution for ± polarity transients on one I/O line, eliminating need for dual-diode arrays |
| Low clamping voltage | 33 V at 5 A ensures downstream 12 V-rated ICs remain within safe operating area during surge |
| Halogen-free construction | Complies with IEC 61249-2-21, supporting environmentally regulated end markets |
| High-temp reflow tolerance | Rated for 260°C/10s soldering - compatible with lead-free assembly processes without delamination |
Applications
| USB 2.0 Interface Protection | Touch Panel I/O Lines |
|---|---|
Use Scenario: Protecting D+ and D– differential pair in portable medical monitors against user-hand ESD events. IC Role / Device Role / Timing Role: Bi-directional transient voltage suppressor placed directly at USB micro-B connector. Use Value: 15 pF capacitance preserves signal rise/fall time; 33 V clamping prevents latch-up in USB PHY ICs. | Use Scenario: Shielding capacitive touch controller inputs from ESD during finger swipe on glass overlay. IC Role / Device Role / Timing Role: Standalone ESD clamp on each X/Y electrode line, mounted within 2 mm of connector. Use Value: MSL 1 rating eliminates pre-bake step; 0603 footprint fits tight bezel spacing. |
| Keypad Side Keys | Portable Instrumentation Power Rails |
Use Scenario: Guarding mechanical keypad scan lines in ruggedized handheld test equipment. IC Role / Device Role / Timing Role: Single-line protector on each key row/column, located at PCB edge near membrane switch flex tail. Use Value: ±15 kV air discharge rating withstands repeated pocket insertion/removal events. | Use Scenario: Decoupling ESD from 12 V bias rail feeding analog front-end sensors in field-deployed data loggers. IC Role / Device Role / Timing Role: Rail-to-rail clamp between 12 V supply and ground plane, placed upstream of LDO regulator. Use Value: 25 W peak pulse power handles multiple fast transients without thermal runaway. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bi-directional ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMAJ12A | Unidirectional, higher clamping (36.6 V @ 5 A), larger SMA package (4.5 × 2.7 mm) | Requires external series resistor for bi-directional use; unsuitable for high-density USB routing | Prefer TESDU12V RGG where board space and bidirectionality are critical |
| ESD9B12VD | Bi-directional, same 0603 size, but 36 V clamping @ 5 A and 20 pF capacitance | Higher capacitance may degrade USB 2.0 eye diagram; lower surge rating (12 W) | Choose TESDU12V RGG for tighter clamping and higher pulse power in portable designs |
Compared with SMAJ12A and ESD9B12VD, the TESDU12V RGG provides superior combination of bi-directional operation, 33 V clamping, 15 pF capacitance, and 25 W surge capability in 0603 - making it optimal for space-limited, high-speed I/O protection where signal fidelity and compact layout are mandatory.
Availability
TESDU12V RGG is available at Aetrix Electronics and suitable for USB 2.0 interface protection, touch panel I/O shielding, and keypad side-key ESD hardening requiring stable component supply and consistent green-compound manufacturing.
Supply support for TESDU12V RGG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated semiconductor manufacturer specializing in discrete devices, analog ICs, and power management solutions since 1979.
The TESDU series belongs to TSC's Small Signal Product line, engineered specifically for ultra-compact, high-reliability ESD protection in portable consumer and industrial electronics with stringent size and performance constraints.
FAQ
What is the maximum clamping voltage of the TESDU12V RGG at 5 A peak pulse current?
The TESDU12V RGG has a maximum clamping voltage of 33 V at 5 A peak pulse current (8/20 µs waveform). This value is measured under standardized surge conditions and ensures downstream 12 V-rated components remain within safe operating limits during ESD events. The clamping performance is guaranteed across the full operating temperature range of –55°C to +150°C.
Is the TESDU12V RGG bi-directional or unidirectional?
The TESDU12V RGG is a bi-directional ESD protection diode, designed to suppress both positive and negative polarity transients on a single I/O line without requiring external biasing. Its symmetrical IV characteristic enables direct placement across data lines like USB D+/D– or touch panel electrodes, distinguishing it from unidirectional alternatives such as SMAJ12A.
What is the junction capacitance of the TESDU12V RGG and why does it matter?
The TESDU12V RGG exhibits 15 pF junction capacitance at 0 V and 1 MHz. This low value minimizes signal distortion and preserves edge integrity on high-speed interfaces such as USB 2.0 (480 Mbps), ensuring compliance with eye diagram and jitter specifications. Higher capacitance would attenuate high-frequency components and increase bit error rates.
Does the TESDU12V RGG comply with RoHS and halogen-free standards?
Yes, the TESDU12V RGG complies with RoHS Directive 2011/65/EU and is halogen-free per IEC 61249-2-21. Its green compound packaging and gold-plated terminals meet environmental and reliability requirements for consumer, industrial, and medical-grade portable electronics.
What is the recommended PCB layout practice for the TESDU12V RGG?
Place the TESDU12V RGG within 2 mm of the protected connector or I/O pad, with minimal trace length to ground. Use a solid ground plane beneath the device, avoid vias in the protection path, and keep the return path short to reduce inductance. These practices ensure effective transient energy shunting and prevent coupling into adjacent signal lines.
TESDU12V RGG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Package/Case:
- 0603 (1608 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 12V
- Voltage - Breakdown (Min):
- 13V
- Voltage - Clamping (Max) @ Ipp:
- 33V
- Current - Peak Pulse (10/1000µs):
- 5A
- Power - Peak Pulse:
- 25W
- Power Line Protection:
- No
- Applications:
- USB
- Capacitance @ Frequency:
- 12pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 0603
TESDU12V RGG FAQ
1.How can I place an order for TESDU12V RGG through Aetrix?
Please submit a Request for Quotation (RFQ) for TESDU12V RGG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TESDU12V RGG reliable?
The price and inventory of TESDU12V RGG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TESDU12V RGG is usually 5 days.
3.What payment methods are accepted for TESDU12V RGG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TESDU12V RGG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TESDU12V RGG?
TESDU12V RGG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TESDU12V RGG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TESDU12V RGG?
For technical support, including TESDU12V RGG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TESDU12V RGG requirements.
6.How does Aetrix verify that TESDU12V RGG is sourced from the original manufacturer or authorized distributors?
All TESDU12V RGG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TESDU12V RGG meets industry standards.
7.What is the process for return or replacement of TESDU12V RGG?
All TESDU12V RGG units undergo pre-shipment inspection (PSI). If there is an issue with TESDU12V RGG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TESDU12V RGG part is unused and in its original packaging.
Return procedure for TESDU12V RGG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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