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Texas Instruments TPD1E01B04DPYR
- Part No.:
- TPD1E01B04DPYR
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- 0402 (1006 Metric)
- Datasheet:
-
TPD1E01B04DPYR.pdf
- Description:
- TVS DIODE 3.6VWM 15VC 2X1SON
- Quantity:
- Payment:
- Shipping:
Inventory:26,485
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Product details
Overview
TPD1E01B04DPYR from Texas Instruments is a single-channel bidirectional TVS ESD protection diode designed for USB Type-C and Thunderbolt 3 high-speed differential pairs. It delivers ±15-kV IEC 61000-4-2 contact ESD protection, 0.20–0.23 pF typical line capacitance, 15 V clamping voltage at 16 A TLP, and supports data rates up to 20 Gbps in industrial temperature range (–40°C to +125°C). It protects SuperSpeed TX/RX lanes in compact USB-C docking stations.
For engineers reviewing the TPD1E01B04DPYR datasheet, TPD1E01B04DPYR pinout, TPD1E01B04DPYR application, or TPD1E01B04DPYR equivalent, key selection criteria include ultra-low capacitance for 10+ GHz signal integrity, IEC Level 4 ESD robustness, flow-through routing compatibility with USB-C layout constraints, and X1SON (DPY) package thermal performance (RθJB = 162.5°C/W).
Technical Context
The TPD1E01B04DPYR operates as a passive, bidirectional clamping diode triggered by voltage excursions beyond ±6.4 V DC breakdown. Its low dynamic resistance (0.57 Ω) ensures rapid transient energy diversion to ground during ESD, EFT (80 A), or surge (2.5 A, 8/20 µs) events without latch-up or degradation.
Designed specifically for USB Type-C's dual-lane SuperSpeed architecture, it integrates into flow-through PCB routing between connector and controller-minimizing stub length and impedance discontinuity. The DPY package's 1.00 mm × 0.60 mm body and exposed thermal pad enable efficient heat dissipation while maintaining <0.23 pF capacitance across –40°C to +125°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection | ±15-kV contact / ±17-kV air-gap per IEC 61000-4-2 Level 4 - ensures system-level immunity to human-hand ESD in end-user environments. |
| IO Capacitance | 0.20–0.23 pF (max) at 1 MHz - preserves signal integrity for USB 3.1 Gen 2 (10 Gbps) and Thunderbolt 3 (20 Gbps) eye diagrams. |
| Clamping Voltage | 15 V at 16 A TLP - limits voltage stress on downstream PHY ICs during worst-case ESD transients. |
| DC Breakdown Voltage | 6.4 V (typical) - provides safe margin above ±3.6 V signal swing of USB SuperSpeed differential pairs. |
| Leakage Current | ≤10 nA at ±2.5 V - avoids DC loading or bias shift in high-impedance receiver inputs. |
| Operating Temperature | –40°C to +125°C - supports deployment in thermally demanding laptop docks and industrial USB-C hubs. |
| Package Thermal Resistance | RθJB = 162.5°C/W - enables reliable power dissipation in dense PCB layouts with minimal copper area. |
Pinout & Package
X1SON (DPY) package: 2-pin, 1.00 mm × 0.60 mm body, 0.45 mm max height, exposed thermal pad, industry-standard 0402 footprint compatible with automated placement.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O | ESD-protected signal line input/output - connects directly to USB-C SuperSpeed lane (e.g., SSTX1P); requires direct trace to connector. |
| 2 | GND | Low-inductance ground return - must connect to solid ground plane via multiple vias under exposed pad to minimize clamping impedance. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Protects AC-coupled differential signals without polarity constraints - essential for USB-C reversible plug orientation. |
| Flow-through routing | Linear pin arrangement (1→2) allows in-line placement between connector and PHY - eliminates stubs and maintains 90-Ω differential impedance. |
| IEC 61000-4-4 EFT immunity | Withstands 80-A fast transients (5/50 ns) - prevents latch-up or false triggering in noisy industrial docking environments. |
| Ultra-low leakage | ≤10 nA at ±2.5 V - avoids signal distortion or DC offset in precision high-speed receivers. |
| High-frequency bandwidth | –3 dB insertion loss point at 26.9 GHz (DPL) - confirms negligible RF attenuation for 20-Gbps NRZ signaling. |
Applications
| USB-C Laptop Docking Station | Thunderbolt 3 Add-in Card |
|---|---|
Use Scenario: Protects bidirectional SuperSpeed TX/RX lanes (SSTX1P/N, SSRX1P/N) on a compact, thermally constrained docking station PCB interfacing with host laptop. IC Role / Device Role / Timing Role: ESD transient suppressor placed immediately adjacent to USB-C receptacle - clamps ESD energy before reaching USB 3.1 Gen 2 PHY. Use Value: Maintains 10-Gbps eye opening (>60% UI) with ≤0.23 pF capacitance, enabling full backward compatibility with USB 3.0/3.1 while meeting IEC 61000-4-2 Level 4. |
Use Scenario: Shields PCIe 3.0 x4 and DisplayPort 1.3 lanes routed through a Thunderbolt 3 add-in card's edge connector. IC Role / Device Role / Timing Role: Single-channel ESD guard for each high-speed differential pair - deployed in parallel (x8 devices) to cover all eight SuperSpeed lanes. Use Value: Enables >20-Gbps aggregate bandwidth with sub-15-V clamping, preventing PHY damage during hot-plug events without degrading jitter or rise/fall times. |
| USB-C Mobile Tablet Hub | Industrial USB-C Monitor Interface |
Use Scenario: Integrated into a portable tablet-to-HDMI/USB3 hub with space-limited 4-layer PCB and no dedicated ground plane layer. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp on SBU1/CC1 lines and SuperSpeed pairs - leverages DPY package's RθJB = 162.5°C/W for passive thermal management. Use Value: Achieves certified ESD immunity without thermal derating or forced airflow - critical for fanless mobile accessories operating up to +125°C junction. |
Use Scenario: Protects DisplayPort Alt Mode lanes in an industrial-grade USB-C monitor supporting 4K@60Hz over a 1.2-m cable assembly. IC Role / Device Role / Timing Role: Signal-line protector on SSTX2P/N and SSRX2P/N pairs - placed within 3 mm of connector per TI layout guidelines to suppress EMI coupling. Use Value: Prevents display flicker or link training failure caused by ESD-induced common-mode noise, verified via USB 3.1 Gen 2 eye diagram testing (Figure 16). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD1E01B04DPLR | Same silicon, X2SON (DPL) package: 0.60 mm × 0.30 mm, 0.18–0.20 pF capacitance, RθJB = 394.4°C/W. | Better high-frequency performance (26.9 GHz –3 dB point) but higher thermal resistance - suited for space-constrained, low-power USB-C ports. | Select DPLR when PCB real estate is premium and thermal load is light; DPYR preferred for higher-power or thermally dense layouts. |
| TPD1E05U06DPYR | Higher capacitance (0.5 pF typ), ±5.5-V standoff, lower clamping (9 V @ 5 A), same DPY package. | Optimized for CC/SBU/USB2 lines (≤480 MHz), not SuperSpeed - unsuitable for 10+ Gbps interfaces due to bandwidth limitation. | Use only for non-high-speed USB-C auxiliary lines; never substitute for TPD1E01B04DPYR on SSTX/SSRX lanes. |
Compared with TPD1E01B04DPLR, TPD1E01B04DPYR trades marginal RF bandwidth for significantly better thermal performance (RθJB 162.5 vs. 394.4°C/W) and mechanical robustness in automated assembly; versus TPD1E05U06DPYR, it delivers 2.8× lower capacitance essential for 20-Gbps compliance - making DPYR the sole validated choice for USB-C SuperSpeed lane protection.
Availability
TPD1E01B04DPYR is available at Aetrix Electronics and suitable for USB-C docking stations, Thunderbolt 3 add-in cards, and industrial monitor interfaces requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for TPD1E01B04DPYR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and high-reliability power management solutions, with decades of leadership in ESD protection and interface IC design.
The TPD1E01B04 product line targets high-speed serial interface protection - engineered specifically for USB Type-C, Thunderbolt 3, and PCIe 3.0 applications where ultra-low capacitance and IEC Level 4 immunity are mandatory.
FAQ
What is the maximum data rate supported by TPD1E01B04DPYR?
TPD1E01B04DPYR supports data rates up to 20 Gbps, validated for USB 3.1 Gen 2 (10 Gbps) and Thunderbolt 3 (20 Gbps) applications. Its 0.20–0.23 pF capacitance and 26.9 GHz –3 dB bandwidth ensure minimal insertion loss and preserved eye diagram integrity, as confirmed in TI's Figure 11 and Figure 16 test reports for TPD1E01B04DPYR.
Does TPD1E01B04DPYR require external power or biasing?
No, TPD1E01B04DPYR is a passive TVS diode array with no power pins or control logic. It operates solely on voltage-triggered clamping between its I/O and ground terminals. Per TI's datasheet Section 9, no external bias or supply is needed - the device remains transparent during normal operation and activates only during transient overvoltage events.
Can TPD1E01B04DPYR be used on USB-C CC (Configuration Channel) lines?
TPD1E01B04DPYR is not recommended for CC lines. Its ±6.4 V DC breakdown exceeds the USB-C CC voltage range (0–5.5 V), risking unintended conduction. TI explicitly assigns TPD1E05U06 for CC/SBU protection (Section 8.2.2.1). Using TPD1E01B04DPYR on CC may cause false detection or port negotiation failure - always use TPD1E05U06DPYR or equivalent for auxiliary lines.
What is the thermal performance difference between TPD1E01B04DPYR and TPD1E01B04DPLR?
TPD1E01B04DPYR offers superior thermal performance: RθJB = 162.5°C/W versus 394.4°C/W for DPLR. This 59% reduction enables higher transient power dissipation in thermally constrained layouts. Both share identical silicon, but DPY's larger 1.00 mm × 0.60 mm body and optimized thermal pad improve board-level heat transfer - critical for multi-lane USB-C implementations with stacked ESD devices.
Is TPD1E01B04DPYR compliant with automotive standards?
TPD1E01B04DPYR is not automotive-qualified. TI offers the pin-compatible TPD1E01B04-Q1 variant (per Q100) for automotive applications. The standard TPD1E01B04DPYR is rated for industrial temperature range (–40°C to +125°C) and carries no AEC-Q200 certification, making it suitable for commercial/industrial USB-C equipment but not for automotive infotainment or ADAS systems requiring zero-defect reliability.
TPD1E01B04DPYR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 0402 (1006 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.6V
- Voltage - Breakdown (Min):
- 6.4V
- Voltage - Clamping (Max) @ Ipp:
- 15V
- Current - Peak Pulse (10/1000µs):
- 2.5A
- Power - Peak Pulse:
- 27W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.2pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-X1SON (1x.60)
TPD1E01B04DPYR FAQ
1.How can I place an order for TPD1E01B04DPYR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPD1E01B04DPYR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPD1E01B04DPYR reliable?
The price and inventory of TPD1E01B04DPYR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPD1E01B04DPYR is usually 5 days.
3.What payment methods are accepted for TPD1E01B04DPYR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPD1E01B04DPYR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPD1E01B04DPYR?
TPD1E01B04DPYR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPD1E01B04DPYR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPD1E01B04DPYR?
For technical support, including TPD1E01B04DPYR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPD1E01B04DPYR requirements.
6.How does Aetrix verify that TPD1E01B04DPYR is sourced from the original manufacturer or authorized distributors?
All TPD1E01B04DPYR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPD1E01B04DPYR meets industry standards.
7.What is the process for return or replacement of TPD1E01B04DPYR?
All TPD1E01B04DPYR units undergo pre-shipment inspection (PSI). If there is an issue with TPD1E01B04DPYR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPD1E01B04DPYR part is unused and in its original packaging.
Return procedure for TPD1E01B04DPYR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPD1E01B04DPYR Tags
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