Texas Instruments TPD1E1B04DPYT
- Part No.:
- TPD1E1B04DPYT
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- 0402 (1006 Metric)
- Datasheet:
-
TPD1E1B04DPYT.pdf
- Description:
- TVS DIODE 3.6VWM 8.5VC 2X1SON
- Quantity:
- Payment:

- Shipping:

Inventory:7,838
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TPD1E1B04DPYT from Texas Instruments is a single-channel bidirectional TVS ESD protection diode in X1SON (DPY) 2-pin package, featuring 1 pF typical IO capacitance, ±30-kV IEC 61000-4-2 contact/air-gap ESD rating, and 8.5 V clamping voltage at 16-A TLP-designed for USB 2.0 data line (D+/D−) protection in space-constrained portable electronics.
For engineers reviewing the TPD1E1B04DPYT datasheet, TPD1E1B04DPYT pinout, TPD1E1B04DPYT application, or TPD1E1B04DPYT equivalent, key selection criteria include ultra-low dynamic resistance (0.15 Ω), industrial temperature range (–40°C to +125°C), reverse stand-off voltage (±3.6 V), and compatibility with high-speed interfaces requiring sub-1.3 pF capacitance and minimal signal distortion.
Technical Context
The TPD1E1B04DPYT operates as a passive, bidirectional clamping device triggered by overvoltage events on either I/O pin relative to GND. Its symmetrical breakdown voltage (±6.4 V typical) and low RDYN enable fast transient response (<1 ns) and precise voltage limiting during ESD, EFT, and surge events.
It integrates no active circuitry or control logic-functionality relies entirely on silicon PN junction characteristics. The device sustains 80-A IEC 61000-4-4 EFT bursts and 6.3-A IEC 61000-4-5 surges while maintaining ≤100 nA leakage at ±2.5 V bias across its full operating temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000-4-2) | ±30-kV contact & air-gap discharge-meets Level 4 immunity without system-level failure. |
| Clamping Voltage | 8.5 V at 16-A TLP-limits voltage seen by protected USB transceiver during worst-case ESD strike. |
| IO Capacitance | 1 pF typical (1.3 pF max) at 1 MHz-preserves USB 2.0 signal integrity up to 480 Mbps with negligible insertion loss. |
| Dynamic Resistance (RDYN) | 0.15 Ω-minimizes voltage overshoot during fast transients by reducing IR drop across protection path. |
| DC Breakdown Voltage | ±6.4 V typical-ensures reliable triggering above USB 2.0 signal swing (±3.6 V) while avoiding false conduction. |
| Leakage Current | ≤100 nA at ±2.5 V-prevents signal degradation or power drain in battery-powered wearables and mobile devices. |
| Operating Temperature | –40°C to +125°C-supports deployment in automotive infotainment, industrial USB peripherals, and outdoor-connected equipment. |
Pinout & Package
TPD1E1B04DPYT uses the X1SON (DPY) 2-pin surface-mount package (0.60 mm × 1.00 mm, 0.45 mm max height), optimized for flow-through routing and minimal PCB real estate. Pin 1 and Pin 2 are identical bidirectional I/O terminals-either connects to protected signal line (e.g., D+ or D−), the other to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | I/O | Bidirectional ESD channel-connects to signal line (e.g., USB D+) when Pin 2 is grounded. |
| Pin 2 | I/O | Bidirectional ESD channel-connects to GND when protecting a single signal line; symmetric with Pin 1. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low clamping voltage | 8.5 V at 16-A TLP ensures downstream USB transceivers remain within absolute maximum ratings during ESD events. |
| Sub-1.3 pF line capacitance | 1 pF typical enables full-speed USB 2.0 compliance without signal rise-time degradation or eye-diagram closure. |
| 0.15 Ω dynamic resistance | Reduces clamping voltage overshoot and improves energy dissipation efficiency under high-current transients. |
| ±30-kV IEC 61000-4-2 rating | Validated to highest international ESD immunity level-eliminates need for external staging components in end-equipment certification. |
| Industrial temperature range | –40°C to +125°C operation supports reliability in thermally demanding environments like set-top boxes and EPOS terminals. |
Applications
| USB 2.0 Interface Protection | Wearable Device I/O Protection |
|---|---|
Use Scenario: Protecting D+ and D− lines between micro-USB connector and USB PHY in smartphones and tablets. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed directly at connector, shunting transients to GND before reaching transceiver. Use Value: 1 pF capacitance avoids USB 2.0 eye-mask violations; ±30-kV rating satisfies IEC 61000-4-2 pre-compliance testing. |
Use Scenario: Safeguarding GPIO and touch sensor lines in smartwatches and fitness bands exposed to frequent human contact. IC Role / Device Role / Timing Role: Low-leakage (≤100 nA) ESD suppressor on 1.8-V or 3.3-V signal paths with tight power budgets. Use Value: –40°C to +125°C range accommodates body-worn thermal cycling; 0.6 mm × 1.0 mm footprint fits ultra-thin PCB stacks. |
| Set-Top Box Front-Panel USB | EPOS Terminal Button & Audio Lines |
Use Scenario: Shielding front-panel USB ports on cable/satellite receivers subject to repeated plugging/unplugging in living-room environments. IC Role / Device Role / Timing Role: Standalone ESD protection on hot-pluggable interface, operating continuously across wide ambient temperatures. Use Value: 80-A IEC 61000-4-4 EFT rating withstands repetitive electrostatic discharges from user interaction and nearby switching noise. |
Use Scenario: Protecting pushbutton inputs and analog audio jacks in electronic point-of-sale terminals located in retail stores. IC Role / Device Role / Timing Role: Low-capacitance TVS on mechanical switch debouncing paths and headset microphone lines. Use Value: ±6.4 V DC breakdown prevents false triggering during normal 3.3-V button logic transitions; 0.15 Ω RDYN ensures fast recovery post-event. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD5Z3.3T5G (ON Semiconductor) | Higher capacitance (1.5 pF typ), lower ESD rating (±22 kV), same 2-pin SOD-523 package. | Limited to lower-speed interfaces (e.g., UART, I²C); not recommended for USB 2.0 full-speed operation. | Select only if board layout constraints require SOD-523 footprint and USB speed is not required. |
| SMA6J33A (STMicroelectronics) | Unidirectional, higher clamping (12.3 V at 10 A), DO-214AC package (3.5 mm × 1.9 mm). | Requires polarity-aware placement; unsuitable for bidirectional signals like USB D+/D− without redesign. | Use only for DC-biased lines (e.g., VBUS) where unidirectional clamping suffices and board area permits larger package. |
Compared with ESD5Z3.3T5G and SMA6J33A, TPD1E1B04DPYT delivers superior USB 2.0 compatibility via its 1-pF capacitance and true bidirectionality, while its 0.6 mm × 1.0 mm X1SON footprint enables denser layouts than DO-214AC alternatives-critical for modern compact consumer electronics.
Availability
TPD1E1B04DPYT is available at Aetrix Electronics and suitable for USB 2.0 interface protection, wearable device I/O safeguarding, and set-top box front-panel port hardening requiring stable component supply and long-term design-in support.
Supply support for TPD1E1B04DPYT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies, with leadership in precision analog and high-reliability protection solutions.
The TPD1E1B04DPYT belongs to TI's ESD protection portfolio, engineered specifically for high-speed digital interfaces-including USB, HDMI, and MIPI-where ultra-low capacitance and rapid clamping response are mandatory for signal fidelity and system robustness.
FAQ
What is the primary function of the TPD1E1B04DPYT in a USB 2.0 design?
The TPD1E1B04DPYT serves as a bidirectional ESD protection diode placed between the USB connector and transceiver IC. It clamps transient voltages-such as ±30-kV ESD strikes-to 8.5 V at 16-A TLP, preventing damage to sensitive downstream circuitry. Its 1-pF capacitance ensures minimal impact on USB 2.0 signal integrity, making it ideal for D+ and D− line protection in TPD1E1B04DPYT-based designs.
Does the TPD1E1B04DPYT require any external bias or power supply?
No, the TPD1E1B04DPYT is a passive TVS diode and requires no external power or bias. It operates solely based on voltage thresholds: it remains non-conductive below ±3.6 V reverse stand-off voltage and triggers into low-resistance clamping mode during overvoltage events. This makes TPD1E1B04DPYT suitable for always-on, low-power applications such as wearables and portable USB peripherals.
Can the TPD1E1B04DPYT be used to protect both D+ and D− lines simultaneously?
Yes-each TPD1E1B04DPYT protects one signal line. A complete USB 2.0 protection scheme uses two TPD1E1B04DPYT devices: one for D+, one for D−, each connected between its respective line and GND. The device's bidirectional symmetry and matched electrical characteristics ensure balanced protection without skew or timing mismatch in TPD1E1B04DPYT implementations.
What is the significance of the 0.15 Ω dynamic resistance (RDYN) specification for the TPD1E1B04DPYT?
The 0.15 Ω RDYN value reflects the internal resistance of the TPD1E1B04DPYT during clamping, directly determining the voltage overshoot (V = I × R) seen by protected circuitry. At 16-A TLP current, this yields only 2.4 V of resistive drop-contributing to the low 8.5 V total clamping voltage. This low RDYN is critical for preserving margin in systems with tight voltage tolerances, such as those using 3.3-V USB transceivers in TPD1E1B04DPYT-protected designs.
Is the TPD1E1B04DPYT compatible with lead-free reflow processes?
Yes, the TPD1E1B04DPYT carries a Level-1 moisture sensitivity rating per JEDEC J-STD-020 and is qualified for peak reflow temperatures up to 260°C. Its NiPdAu or NiPdAuAg lead finish ensures reliable solderability in standard lead-free assembly processes. The device's X1SON (DPY) package is designed for robust thermal performance during reflow, supporting high-yield manufacturing of TPD1E1B04DPYT-equipped PCBs.
TPD1E1B04DPYT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 0402 (1006 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.6V (Max)
- Voltage - Breakdown (Min):
- 6.4V (Typ)
- Voltage - Clamping (Max) @ Ipp:
- 8.5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 6.3A (8/20µs)
- Power - Peak Pulse:
- 50W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 1pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-X1SON (1x.60)
TPD1E1B04DPYT FAQ
1.How can I place an order for TPD1E1B04DPYT through Aetrix?
Please submit a Request for Quotation (RFQ) for TPD1E1B04DPYT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPD1E1B04DPYT reliable?
The price and inventory of TPD1E1B04DPYT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPD1E1B04DPYT is usually 5 days.
3.What payment methods are accepted for TPD1E1B04DPYT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPD1E1B04DPYT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPD1E1B04DPYT?
TPD1E1B04DPYT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPD1E1B04DPYT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPD1E1B04DPYT?
For technical support, including TPD1E1B04DPYT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPD1E1B04DPYT requirements.
6.How does Aetrix verify that TPD1E1B04DPYT is sourced from the original manufacturer or authorized distributors?
All TPD1E1B04DPYT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPD1E1B04DPYT meets industry standards.
7.What is the process for return or replacement of TPD1E1B04DPYT?
All TPD1E1B04DPYT units undergo pre-shipment inspection (PSI). If there is an issue with TPD1E1B04DPYT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPD1E1B04DPYT part is unused and in its original packaging.
Return procedure for TPD1E1B04DPYT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPD1E1B04DPYT Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

