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Texas Instruments TPD2E001DRLR
- Part No.:
- TPD2E001DRLR
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- SOT-553
- Datasheet:
-
TPD2E001DRLR.pdf
- Description:
- TVS DIODE 5.5VWM SOT5
- Quantity:
- Payment:
- Shipping:
Inventory:84,999
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Product details
Overview
TPD2E001DRLR from Texas Instruments is a 2-channel unidirectional ESD protection diode array in SOT-5X3 (DRL) package, designed for high-speed data interfaces. It delivers ±8-kV contact / ±15-kV air-gap IEC 61000-4-2 Level 4 ESD protection, 1.5-pF typical IO capacitance, <1-nA leakage, and operates from 0.9 V to 5.5 V - enabling robust USB 2.0 signal-line protection without signal integrity degradation.
For engineers reviewing the TPD2E001DRLR datasheet, TPD2E001DRLR pinout, TPD2E001DRLR application, or TPD2E001DRLR equivalent, this device is selected for low-capacitance, dual-channel transient suppression on differential high-speed lines where layout proximity to connectors and minimal parasitic loading are critical design constraints.
Technical Context
The TPD2E001DRLR integrates two independent ESD clamp paths - each with a central TVS structure connected to VCC and GND - enabling bidirectional clamping for positive and negative transients. Its unidirectional architecture relies on VCC biasing to define the upper clamping threshold (VCC + 25 V typical under ±15-kV HBM), while lower clamping occurs at –25 V relative to GND.
It functions as a passive, voltage-triggered protector: below breakdown (11 V min), it presents high impedance (>1 GΩ); during ESD events, it switches to low dynamic resistance (<1 Ω) within nanoseconds, diverting >24 A (IEC contact) or >45 A (IEC air-gap) surge current to GND/VCC while limiting channel voltage to ≤VCC + 100 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000-4-2) | ±8-kV contact, ±15-kV air-gap - meets Level 4 immunity for consumer/industrial USB ports. |
| IO Capacitance | 1.5 pF @ 10 MHz, VCC/2 bias - preserves signal integrity up to 240 MHz USB 2.0 data rates. |
| Leakage Current | ≤1 nA @ VIO = 0–VCC - avoids DC loading on sensitive analog or low-power signal chains. |
| Clamp Voltage (IO–GND) | VCC + 60 V @ ±8-kV IEC contact - defines maximum stress seen by downstream USB transceiver. |
| Supply Range (VCC) | 0.9 V to 5.5 V - supports single-rail operation across 1.8-V, 3.3-V, and 5-V systems. |
| Breakdown Voltage (VBR) | ≥11 V @ 10 mA - ensures no conduction during normal signal swing (0–5 V). |
| Operating Temp | –40°C to +85°C - qualified for industrial ambient environments. |
Pinout & Package
SOT-5X3 (DRL) package: 5-pin, 1.60 mm × 1.20 mm body, 0.6-mm max height, exposed pad (EP) connected to GND. Optimized for compact USB connector-side placement.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pin 4) | Ground reference | Primary return path for ESD current; must be low-inductance connection to system ground plane. |
| VCC (Pin 1) | Power-supply input | Bias rail for upper-clamp diodes; requires 0.1-μF ceramic bypass capacitor to GND per layout guidelines. |
| IO1 (Pin 3) | Protected signal line | ESD-protected channel for D+ or first high-speed data line; clamps to VCC/GND during transients. |
| IO2 (Pin 5) | Protected signal line | ESD-protected channel for D– or second high-speed data line; electrically identical to IO1. |
| N.C. (Pin 2) | No internal connection | Not bonded; left unconnected on PCB - no routing or thermal tie required. |
Key Features
| Feature | Design Value |
|---|---|
| Low IO capacitance | 1.5 pF enables use on 480-Mbps USB 2.0 differential pairs without measurable eye diagram degradation. |
| VCC-referenced clamping | Upper clamp at VCC + 25 V (typ) prevents overvoltage on powered ICs while allowing flexible supply rail selection. |
| Passive operation | No external power or enable logic needed - activates automatically during ESD events ≥11 V. |
| Compact SOT-5X3 footprint | 1.6 mm × 1.2 mm area saves board space vs. discrete diode arrays; compatible with standard SMT reflow. |
| Exposed thermal pad | EP (Pin 4) provides enhanced thermal dissipation and mechanical anchoring for reliability in vibration-prone applications. |
Applications
| USB 2.0 Interface Protection | Ethernet PHY Line Protection |
|---|---|
Use Scenario: Protecting D+ and D– pins of a Type-A or Micro-B USB 2.0 receptacle against user-handling ESD events. IC Role / Device Role / Timing Role: Dual-channel ESD suppressor placed directly at connector, shunting transients before they reach the USB controller IC. Use Value: Maintains 480-Mbps signal fidelity via 1.5-pF loading while surviving repeated ±15-kV air-gap discharges per IEC 61000-4-2. | Use Scenario: Safeguarding differential TX+/TX– and RX+/RX– lanes of a 10/100BASE-TX Ethernet PHY interface. IC Role / Device Role / Timing Role: Low-capacitance transient suppressor on magnetics-side PHY lines, reducing coupling-induced latch-up risk. Use Value: Enables compliance with IEC 61000-4-2 Level 4 without degrading 100-MHz Ethernet signal rise/fall times. |
| Medical Glucose Meter Port | LVDS Display Interface |
Use Scenario: Shielding micro-USB or mini-USB service port on portable glucose meters from clinical ESD exposure. IC Role / Device Role / Timing Role: ESD guard for host-facing USB lines in battery-powered Class II medical devices requiring non-magnetic options (see DRS variant). Use Value: Sub-1-nA leakage preserves battery life; 0.9–5.5-V range supports single-cell Li-ion (3.0–4.2 V) operation without level-shifting. | Use Scenario: Protecting LVDS clock/data pairs driving small-form-factor displays in industrial HMIs. IC Role / Device Role / Timing Role: High-speed data-line protector on source-synchronous LVDS links operating at 100–600 Mbps. Use Value: 1.5-pF capacitance avoids skew between differential pairs; ±8-kV contact rating covers routine handling in factory settings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E2U06DRLR | Pin-to-pin compatible; higher IEC rating (±15-kV contact), lower clamping voltage (VCC + 12 V typ), eliminates need for external 0.1-µF VCC capacitor. | Preferred for new designs targeting stricter ESD immunity or simplified BOM; same SOT-5X3 footprint. | Select when upgrading ESD margin beyond Level 4 or minimizing component count on space-constrained boards. |
| ESD5V3U2U-2/TR | 2-channel, 1.0-pF IO capacitance, ±12-kV contact, but rated only to 3.3-V VCC; no VCC-referenced clamping - uses GND-only architecture. | Suitable for 3.3-V-only systems with tighter capacitance budgets; lacks VCC-based upper clamping for 5-V tolerant interfaces. | Choose only if operating voltage is strictly ≤3.3 V and sub-1.5-pF loading is mandatory - not drop-in for 5-V USB. |
Compared with TPD2E001DRLR, TPD2E2U06DRLR offers superior ESD robustness and reduced BOM complexity, while ESD5V3U2U-2/TR trades VCC flexibility and clamping control for ultra-low capacitance in low-voltage applications - making TPD2E001DRLR the balanced choice for general-purpose 0.9–5.5-V USB/Ethernet protection.
Availability
TPD2E001DRLR is available at Aetrix Electronics and suitable for USB 2.0 interface protection, industrial Ethernet PHY safeguarding, and portable medical device connectivity requiring stable component supply and long-term production continuity.
Supply support for TPD2E001DRLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in precision analog, power management, and interface technologies.
The TPD2E001 series is part of TI's ESD protection portfolio, engineered specifically for high-speed digital interfaces - balancing ultra-low capacitance, industry-standard ESD immunity, and compact packaging for connector-side integration.
FAQ
What is the primary function of the TPD2E001DRLR in a circuit?
The TPD2E001DRLR serves as a dual-channel ESD protection device that safeguards high-speed data lines - such as USB 2.0 D+ and D– - by clamping transient voltages to safe levels during electrostatic discharge events. It operates passively, activating only during overvoltage conditions above its 11-V breakdown threshold, and returns to high-impedance state afterward. Its 1.5-pF IO capacitance ensures minimal impact on signal integrity, making TPD2E001DRLR ideal for 480-Mbps interfaces.
Does the TPD2E001DRLR require an external capacitor on the VCC pin?
Yes, a 0.1-µF ceramic capacitor is recommended between the VCC pin and GND for effective ESD bypass, regardless of whether VCC is connected to the system supply or left floating. This capacitor stabilizes the internal clamp reference and improves high-frequency transient response. The TPD2E001DRLR datasheet explicitly specifies this requirement in Section 8.2.2, and omitting it may degrade clamping performance during fast-rising ESD pulses.
Can the TPD2E001DRLR be used on 5-V USB interfaces?
Yes, the TPD2E001DRLR supports 5-V USB interfaces: its 0.9–5.5-V VCC range fully covers standard USB VBUS (4.75–5.25 V), and its clamping voltage remains within safe limits (VCC + 60 V max under IEC contact discharge). The device's 11-V minimum breakdown voltage ensures no conduction during normal 0–5-V signal swings, and its 1.5-pF capacitance prevents USB 2.0 eye diagram closure. TPD2E001DRLR is explicitly validated for USB 2.0 in TI's application schematic and Section 8.2.1.
What is the significance of the N.C. pin on the TPD2E001DRLR?
The N.C. (No Connection) pin on the TPD2E001DRLR - Pin 2 in the SOT-5X3 package - is not internally bonded and carries no electrical function. It must remain unconnected on the PCB; neither routing nor grounding is required. This pin exists for mechanical symmetry and package compatibility, not circuit functionality. TI's Pin Functions table (Section 5) and mechanical drawings confirm it is unused, and connecting it could risk unintended coupling or solder bridging.
How does the TPD2E001DRLR differ from the automotive-grade TPD2E001-Q1?
The TPD2E001-Q1 is the AEC-Q100 qualified automotive variant of the same core design, featuring extended temperature range (–40°C to +125°C), enhanced reliability testing (HTOL, uHAST), and automotive-specific qualification documentation. The TPD2E001DRLR is rated for –40°C to +85°C and intended for industrial/consumer applications. Electrically and pinout-wise, both share identical parameters - including 1.5-pF capacitance, ±8-kV contact ESD rating, and SOT-5X3 packaging - but TPD2E001DRLR is not certified for automotive safety-critical systems.
TPD2E001DRLR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- SOT-553
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 11V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- Ethernet
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-5
TPD2E001DRLR FAQ
1.How can I place an order for TPD2E001DRLR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPD2E001DRLR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPD2E001DRLR reliable?
The price and inventory of TPD2E001DRLR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPD2E001DRLR is usually 5 days.
3.What payment methods are accepted for TPD2E001DRLR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPD2E001DRLR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPD2E001DRLR?
TPD2E001DRLR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPD2E001DRLR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPD2E001DRLR?
For technical support, including TPD2E001DRLR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPD2E001DRLR requirements.
6.How does Aetrix verify that TPD2E001DRLR is sourced from the original manufacturer or authorized distributors?
All TPD2E001DRLR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPD2E001DRLR meets industry standards.
7.What is the process for return or replacement of TPD2E001DRLR?
All TPD2E001DRLR units undergo pre-shipment inspection (PSI). If there is an issue with TPD2E001DRLR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPD2E001DRLR part is unused and in its original packaging.
Return procedure for TPD2E001DRLR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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