Texas Instruments TPD2E001DRYRG4

Overview

TPD2E001DRYRG4 from Texas Instruments is a two-channel unidirectional ESD protection diode array in a 6-pin USON (DRY) package, rated for ±8-kV contact and ±15-kV air-gap IEC 61000-4-2 Level 4 ESD suppression, with 1.5 pF typical IO capacitance, 1 nA max leakage, and 0.9–5.5 V operating range-designed for high-speed USB 2.0 data line protection.

For engineers reviewing the TPD2E001DRYRG4 datasheet, TPD2E001DRYRG4 pinout, TPD2E001DRYRG4 application, or TPD2E001DRYRG4 equivalent, this device delivers low-capacitance transient clamping for differential signal integrity in space-constrained portable and medical interfaces where ESD robustness and minimal signal distortion are critical.

Technical Context

The TPD2E001DRYRG4 implements a central ESD clamp architecture with two internal diodes per channel tied to VCC and GND, enabling bidirectional transient diversion during ±15-kV HBM or IEC 61000-4-2 events. Its uni-directional topology provides forward conduction above VCC + VF and reverse conduction below GND – 0.6 V.

It operates passively without bias current draw beyond 1 nA supply current, supports 0–5 V signal swing when VCC is connected, or up to 10 V swing when VCC is floating (with 0.1-µF bypass capacitor recommended), and maintains stable clamping voltage (VC ≤ VCC + 100 V for ±15-kV air discharge) across –40°C to +85°C.

Key Specifications

Pinout & Package

TPD2E001DRYRG4 uses a 6-pin USON (DRY) package with exposed thermal pad (EP), measuring 1.45 mm × 1.00 mm × 0.6 mm max height. The EP must be soldered to GND for optimal thermal performance and ESD current shunting.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with TPD2E001DRLRG4, TPD2E001DRYRG4 saves 0.15 mm² board area and improves thermal coupling via USON's exposed pad, while TPD2E2U06DRLR trades footprint flexibility for superior clamping and reduced external components-making TPD2E001DRYRG4 optimal for miniaturized USB endpoints where space and manufacturability are primary constraints.

Availability

TPD2E001DRYRG4 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, portable medical device design, and industrial Ethernet PHY safeguarding requiring stable component supply across production lifecycles.

Supply support for TPD2E001DRYRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in precision analog, power management, and signal chain technologies.

TPD2E001DRYRG4 belongs to TI's ESD protection portfolio designed specifically for high-speed data interfaces-including USB, LVDS, and FireWire-where low capacitance, certified IEC immunity, and miniature packaging are mandatory.

FAQ

What is the maximum signal voltage swing supported by TPD2E001DRYRG4 on its IO pins?

TPD2E001DRYRG4 supports 0–VCC signal swing when the VCC pin is connected to the system supply, or up to 0–10 V swing when VCC is left floating (with 0.1-µF capacitor to GND). This dual-mode operation allows compatibility with both 3.3-V USB PHYs and higher-voltage industrial interfaces without redesign. The TPD2E001DRYRG4 datasheet specifies absolute maximum IO voltage as VCC + 0.3 V in connected mode and 10 V in floating mode.

Does TPD2E001DRYRG4 require an external bypass capacitor on the VCC pin?

Yes-a 0.1-µF ceramic capacitor between VCC and GND is recommended regardless of whether VCC is connected to the system rail or left floating. This capacitor stabilizes the internal clamp reference during fast ESD transients and reduces high-frequency impedance in the protection path. The TPD2E001DRYRG4 application note explicitly states this requirement for reliable IEC 61000-4-2 Level 4 performance.

Is TPD2E001DRYRG4 pin-compatible with other members of the TPD2E001 family?

No-TPD2E001DRYRG4 (6-pin USON) is not pin-compatible with TPD2E001DRLRG4 (5-pin SOT) or TPD2E001DZDRG4 (4-pin SOT-23). Each variant has distinct pin counts, layouts, and N.C. pin placements. The DRY package has two N.C. pins (2 and 6), while DRL has one N.C. (Pin 2) and DZD has no N.C. pins. PCB layout must be redesigned for each package type; TPD2E001DRYRG4 requires its specific USON land pattern.

What is the thermal performance of TPD2E001DRYRG4 in its USON package?

TPD2E001DRYRG4 exhibits RθJA = 374.2°C/W (junction-to-ambient) and RθJB = 227.8°C/W (junction-to-board) in the USON-6 (DRY) package. Its exposed thermal pad (EP) must be soldered to a solid GND plane to achieve these values. Compared to the DRL variant (RθJA = 257.6°C/W), the DRY package trades higher ambient resistance for smaller footprint-making it ideal for thermally isolated, space-constrained designs where board-level copper spreading is limited.

Can TPD2E001DRYRG4 protect both USB D+ and D– lines simultaneously?

Yes-TPD2E001DRYRG4 integrates two independent ESD protection channels (IO1 and IO2) optimized for differential signaling. In USB 2.0 applications, IO1 protects D+ and IO2 protects D–, with matched 1.5-pF capacitance and sub-1-nA leakage ensuring balanced signal integrity. The device's symmetric clamping behavior (VC ≤ VCC + 60 V for +ve transients, ≤ –60 V for –ve) prevents common-mode skew and preserves USB eye diagrams at 480 Mbps.