Texas Instruments TPD2E001DZDR
- Part No.:
- TPD2E001DZDR
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- TO-253-4, TO-253AA
- Datasheet:
-
TPD2E001DZDR.pdf
- Description:
- TVS DIODE 5.5VWM 4SOP
- Quantity:
- Payment:

- Shipping:

Inventory:17,481
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Product details
Overview
TPD2E001DZDR from Texas Instruments is a 2-channel unidirectional ESD protection diode array in SOT-23 (DZD) package, rated for ±8-kV contact and ±15-kV air-gap IEC 61000-4-2 Level 4 ESD suppression, with 1.5 pF typical IO capacitance, 1 nA max leakage, and 0.9 V to 5.5 V supply range - deployed on USB 2.0 D+/D– lines to protect host controllers from electrostatic discharge.
For engineers reviewing the TPD2E001DZDR datasheet, TPD2E001DZDR pinout, TPD2E001DZDR application, or TPD2E001DZDR equivalent, this device delivers low-capacitance, rail-to-rail clamping protection for high-speed differential data interfaces where signal integrity and ESD robustness are jointly critical.
Technical Context
The TPD2E001DZDR integrates two independent ESD clamp channels tied to a central VCC-referenced TVS structure, enabling bidirectional transient diversion to GND and VCC during ±15-kV HBM or IEC 61000-4-2 events. Its unidirectional architecture relies on forward-biased diodes to VCC and reverse-biased diodes to GND, with clamping activated above VBR = 11 V and below –0.6 V.
Each channel exhibits 1.5 pF capacitance at 10 MHz and 5 V bias, ensuring minimal loading on 240-MHz USB 2.0 signals; leakage remains ≤1 nA across –40°C to 85°C, and supply current is 1 nA - confirming true passive operation without active biasing requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000-4-2) | ±8-kV contact / ±15-kV air-gap - meets Level 4 immunity for industrial and medical USB ports |
| IO Capacitance | 1.5 pF typ @ 10 MHz - preserves signal rise/fall times in 480-Mbps USB 2.0 links |
| Leakage Current | ≤1 nA max @ VIO = 0–VCC - avoids DC loading on sensitive analog or low-power IO lines |
| Clamp Voltage (IEC ±8-kV) | VCC + 60 V (pos) / –60 V (neg) - limits voltage stress on downstream USB transceivers |
| Supply Range (VCC) | 0.9 V to 5.5 V - supports single-supply operation across 1.8-V, 3.3-V, and 5-V system rails |
| Operating Temperature | –40°C to +85°C - qualified for industrial ambient environments and portable medical devices |
| Breakdown Voltage (VBR) | 11 V min @ 10 mA - defines minimum trigger threshold before clamping activates |
Pinout & Package
SOT-23 (DZD) package, 4-pin, 2.90 mm × 1.30 mm body size, exposed pad not present - compact footprint compatible with dense USB connector routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (VCC) | Power-supply reference input | Bypass with 0.1-µF ceramic capacitor to GND; enables VCC-referenced clamping for positive transients |
| 2 (IO1) | ESD-protected signal channel 1 | Connects to USB D+ or LVDS+; clamps to VCC/GND during ESD events |
| 3 (IO2) | ESD-protected signal channel 2 | Connects to USB D– or LVDS–; operates identically to IO1 with matched capacitance and leakage |
| 4 (GND) | Ground reference terminal | Primary return path for ESD current; must be low-inductance connection to system ground plane |
Key Features
| Feature | Design Value |
|---|---|
| IEC 61000-4-2 Level 4 compliance | Validated ±8-kV contact / ±15-kV air-gap protection - eliminates need for external test-level qualification |
| Low IO capacitance | 1.5 pF typical - prevents signal distortion and eye closure in 480-Mbps USB 2.0 applications |
| Rail-to-rail clamping architecture | Clamps both above VCC and below GND - protects against overvoltage and negative transients simultaneously |
| Ultra-low leakage | ≤1 nA max - avoids interference with glucose meter sensor inputs or medical imaging analog front-ends |
| Single-supply flexibility | Operates from 0.9 V to 5.5 V - supports battery-powered USB peripherals and mixed-voltage SoC interfaces |
Applications
| USB 2.0 Interface Protection | Ethernet PHY Line Protection |
|---|---|
Use Scenario: Protecting D+ and D– pins of a Type-A USB 2.0 receptacle on a portable ultrasound device against repeated handling-induced ESD. IC Role / Device Role / Timing Role: ESD transient suppressor placed between connector and USB transceiver IC, providing sub-10-ns response to ±15-kV discharges. Use Value: Prevents latch-up or permanent damage to the USB PHY while maintaining <1.5-pF loading to preserve 480-Mbps eye diagram integrity. |
Use Scenario: Shielding MDI differential pairs in an industrial Ethernet switch port from ESD events during field cable insertion. IC Role / Device Role / Timing Role: Two-channel TVS array clamping TX+/TX– and RX+/RX– lines to GND/VCC, operating within IEEE 802.3 timing margins. Use Value: Enables pass/fail compliance with IEC 61000-4-2 Level 4 without degrading 100-MHz Ethernet signal jitter or return loss. |
| Medical Glucose Meter Sensor Interface | LVDS Display Interface Protection |
Use Scenario: Safeguarding analog sensor inputs (e.g., amperometric electrode traces) in a handheld glucose meter from user-touch ESD. IC Role / Device Role / Timing Role: Low-leakage (≤1 nA) ESD clamp on high-impedance sensor nodes, referenced to system VCC and GND. Use Value: Maintains measurement accuracy by avoiding DC offset shift or noise injection - critical for sub-1-mV resolution sensing. |
Use Scenario: Protecting 650-Mbps LVDS clock/data pairs driving an automotive infotainment display panel. IC Role / Device Role / Timing Role: Dual-channel ESD suppressor on each differential pair, minimizing inter-pair skew via matched 1.5-pF capacitance. Use Value: Ensures bit-error-rate stability under ESD stress while meeting LVDS common-mode voltage and skew specifications. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRLR | 5-pin SOT-5X3 package; includes NC pin; identical electrical specs and ESD rating | Requires PCB layout revision due to different pin count and 1.60 mm × 1.20 mm footprint | Select when board space allows larger SOT-5X3 and NC pin routing is acceptable |
| TPD2E2U06DRLR | Higher IEC ESD rating (±20-kV contact), lower clamping voltage (VCC + 12 V), no input capacitor required | Eliminates need for external 0.1-µF VCC bypass; optimized for newer USB-C and high-reliability medical systems | Choose for next-gen designs requiring enhanced surge margin and simplified BOM |
Compared with TPD2E001DZDR, TPD2E001DRLR offers identical protection performance in a physically larger 5-pin SOT, while TPD2E2U06DRLR provides superior clamping and eliminates the VCC bypass capacitor - making it suitable for space-constrained or higher-safety-tier applications where TPD2E001DZDR's 4-pin SOT-23 footprint and proven USB 2.0 compatibility remain optimal.
Availability
TPD2E001DZDR is available at Aetrix Electronics and suitable for USB 2.0 interface protection, medical glucose meter sensor conditioning, and LVDS display link hardening requiring stable component supply across industrial and healthcare production programs.
Supply support for TPD2E001DZDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in precision analog, power management, and signal chain technologies.
The TPD2E001 product line is designed for high-speed data interface ESD protection - targeting USB, Ethernet, LVDS, and medical sensor applications where low capacitance, low leakage, and international ESD compliance are mandatory.
FAQ
What is the maximum operating voltage for the IO pins of the TPD2E001DZDR?
The TPD2E001DZDR IO pins support a voltage range from 0 V to VCC, with VCC itself rated from 0.9 V to 5.5 V. When VCC is unconnected, the device tolerates up to 10 V on IO1/IO2 - but TI recommends connecting VCC with a 0.1-µF bypass capacitor regardless, to ensure full IEC 61000-4-2 Level 4 clamping performance. This specification is confirmed in Section 6.4 of the TPD2E001DZDR datasheet.
Does the TPD2E001DZDR require an external capacitor on the VCC pin?
Yes - a 0.1-µF ceramic capacitor is required between VCC and GND for proper ESD bypass and clamping functionality. This capacitor stabilizes the internal clamp reference and ensures predictable voltage limiting during ±15-kV air-gap discharges. The TPD2E001DZDR datasheet explicitly states this in Section 8.2.2 and Figure 5, and omitting it degrades clamp voltage performance by up to 40 V.
Is the TPD2E001DZDR pin-compatible with other TPD2E001 variants like TPD2E001DRLR?
No - the TPD2E001DZDR uses a 4-pin SOT-23 (DZD) package, while TPD2E001DRLR uses a 5-pin SOT-5X3 (DRL) package with a dedicated NC pin. Their pinouts differ: TPD2E001DZDR pins are VCC–IO1–IO2–GND; TPD2E001DRLR pins are VCC–IO1–GND–IO2–NC. PCB redesign is required for substitution, as confirmed in the Pin Configuration section of the TPD2E001DZDR datasheet.
What is the thermal resistance (RθJA) of the TPD2E001DZDR in its SOT-23 package?
The junction-to-ambient thermal resistance (RθJA) for the TPD2E001DZDR in the SOT-23 (DZD) package is 213.7°C/W, as specified in Table 6-5 of the official datasheet. This value assumes standard JEDEC 2-layer board conditions; actual thermal performance improves with additional copper pour or thermal vias under the GND pad, though the DZD variant lacks an exposed thermal pad.
Can the TPD2E001DZDR be used to protect USB 3.0 SuperSpeed lanes?
No - the TPD2E001DZDR is not suitable for USB 3.0 SuperSpeed (5 Gbps) differential lanes. Its 1.5 pF IO capacitance and internal diode structure introduce excessive insertion loss and return loss above 500 MHz, violating USB 3.0 electrical compliance. It is explicitly validated only for USB 2.0 (480 Mbps), as stated in the Applications section and Figure 5 of the TPD2E001DZDR datasheet.
TPD2E001DZDR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- TO-253-4, TO-253AA
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 11V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- Ethernet
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-SOP
TPD2E001DZDR FAQ
1.How can I place an order for TPD2E001DZDR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPD2E001DZDR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPD2E001DZDR reliable?
The price and inventory of TPD2E001DZDR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPD2E001DZDR is usually 5 days.
3.What payment methods are accepted for TPD2E001DZDR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPD2E001DZDR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPD2E001DZDR?
TPD2E001DZDR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPD2E001DZDR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPD2E001DZDR?
For technical support, including TPD2E001DZDR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPD2E001DZDR requirements.
6.How does Aetrix verify that TPD2E001DZDR is sourced from the original manufacturer or authorized distributors?
All TPD2E001DZDR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPD2E001DZDR meets industry standards.
7.What is the process for return or replacement of TPD2E001DZDR?
All TPD2E001DZDR units undergo pre-shipment inspection (PSI). If there is an issue with TPD2E001DZDR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPD2E001DZDR part is unused and in its original packaging.
Return procedure for TPD2E001DZDR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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