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Texas Instruments TPD2E2U06DCKR

Part No.:
TPD2E2U06DCKR
Manufacturer:
Texas Instruments
Category:
TVS Diodes
Package:
SC-70, SOT-323
Datasheet:
AetrixTPD2E2U06DCKR.pdf
Description:
TVS DIODE 5.5VWM 12.4VC SC70-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,804

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Product details

Overview

TPD2E2U06DCKR from Texas Instruments is a dual-channel TVS diode ESD protection device in SC70-3 package, designed for USB 2.0 data lines (D+ and D−). It delivers ±25 kV contact / ±30 kV air-gap IEC 61000-4-2 ESD protection, 1.5 pF typical line capacitance, 6.5 V minimum DC breakdown voltage, and 10 nA max leakage at 2.5 V - enabling high-speed signal integrity in portable USB interfaces.

For engineers reviewing the TPD2E2U06DCKR datasheet, TPD2E2U06DCKR pinout, TPD2E2U06DCKR application, or TPD2E2U06DCKR equivalent, this page provides verified technical context, validated pin functions, USB 2.0–specific implementation guidance, and two confirmed alternative parts with documented functional and packaging differences.

Technical Context

The TPD2E2U06DCKR implements a symmetric dual-diode architecture per channel, with bidirectional clamping between each I/O pin and GND. Its low dynamic resistance (0.6 Ω IO-to-GND, 0.4 Ω GND-to-IO in DCK package) ensures sub-12.4 V clamping at 5 A TLP pulse, limiting transient stress on downstream USB transceivers.

It operates passively across –40°C to +125°C with no bias required, leveraging silicon avalanche diodes optimized for fast response (<1 ns) and minimal parasitic capacitance. The SC70-3 footprint supports flow-through routing directly at USB connectors, minimizing stub length and preserving 480 Mbps signal fidelity.

Key Specifications

Parameter Value and Actual Design Meaning
ESD Rating (IEC 61000-4-2) ±25 kV contact / ±30 kV air-gap - meets Level 4 immunity for handheld and portable USB endpoints
Line Capacitance 1.5 pF (typ) - preserves USB 2.0 eye diagram integrity up to 480 Mbps without equalization
DC Breakdown Voltage 6.5 V (min) - safely tolerates 5.5 V USB VBUS-coupled transients while protecting 3.3 V logic
Leakage Current 10 nA (max) at 2.5 V - negligible loading on I²C or USB pull-up/pull-down networks
Clamping Voltage 9.7 V at 1 A TLP - limits peak stress on USB PHY I/O during ESD events
Surge Current 5.5 A (8/20 µs) - handles IEC 61000-4-5 induced surges near external ports
Operating Temperature –40°C to +125°C - supports industrial and automotive-adjacent USB host/device applications

Pinout & Package

TPD2E2U06DCKR uses the SC70-3 (DCK) package: 2.0 mm × 1.25 mm body, 1.1 mm max height, 0.65 mm pitch, with gull-wing leads. Pin 1 = IO1, Pin 2 = IO2, Pin 3 = GND.

Pin/Terminal Circuit Role Design Meaning
Pin 1 (IO1) I/O protection channel Connects to one high-speed signal line (e.g., USB D+); bidirectionally clamps ESD to GND
Pin 2 (IO2) I/O protection channel Connects to second high-speed signal line (e.g., USB D−); electrically identical to IO1
Pin 3 (GND) Reference terminal Low-inductance ground return path for ESD current; must connect to system ground plane near connector

Key Features

Feature Design Value
Dual-channel symmetry Identical IO1/IO2 channels enable flexible D+/D− assignment without performance trade-off
Ultra-low capacitance 1.5 pF typ ensures <0.5 dB insertion loss at 240 MHz - critical for USB 2.0 full-speed compliance
Bidirectional clamping Clamps both positive and negative transients to GND without polarity constraints on signal lines
Flow-through layout SC70-3 pinout allows in-line routing between connector and PHY - eliminates vias or stubs
Industrial temperature range Validated operation from –40°C to +125°C supports deployment in set-top boxes, servers, and EPOS terminals

Applications

USB 2.0 Port Protection LVDS Interface Protection

Use Scenario: Protecting upstream/downstream USB 2.0 ports on notebook docking stations against user-handling ESD.

IC Role / Device Role / Timing Role: Passive ESD clamp placed between USB connector and USB transceiver PHY, triggered only during transients.

Use Value: Prevents latch-up or gate oxide damage in USB PHY ICs while maintaining 480 Mbps data rate via 1.5 pF capacitance.

Use Scenario: Safeguarding LVDS video links in industrial displays exposed to field-installation ESD.

IC Role / Device Role / Timing Role: Low-capacitance shunt protector on differential LVDS pairs, preserving common-mode rejection.

Use Value: Enables robust 655 Mbps LVDS signaling (1080p60) without degrading rise/fall times due to 1.5 pF loading.

I²C Bus Protection MIPI D-PHY Data Lane Protection

Use Scenario: Hardening I²C control buses in server baseboard management controllers (BMC) against board-level ESD.

IC Role / Device Role / Timing Role: Dual-channel protector on SDA/SCL lines, leveraging ultra-low 10 nA leakage to avoid bus contention.

Use Value: Maintains I²C timing margins at 400 kHz standard mode while providing ±25 kV contact ESD immunity.

Use Scenario: Adding ESD resilience to MIPI D-PHY data lanes in mobile camera modules without compromising 1.5 Gbps bandwidth.

IC Role / Device Role / Timing Role: Channel-matched TVS pair on HS data lanes, minimizing skew between D+ and D− paths.

Use Value: Achieves <0.03 pF channel-to-channel capacitance mismatch - critical for MIPI eye diagram stability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPD2E001DCKR Single-channel, 1.0 pF capacitance, 5.5 V breakdown - lower capacitance but half the channel count Requires two devices for USB D+/D−; better for space-constrained single-line protection Select when protecting isolated I²C or UART lines where dual-channel integration isn't needed
ESD5451D05R Single-channel, 0.6 pF capacitance, 5.5 V breakdown, SOD-523 package - smaller footprint, lower CL Not pin-compatible; requires PCB redesign; optimized for ultra-high-speed (>5 Gbps) interfaces Choose for next-gen USB 3.x or PCIe Gen1 signal lines where 1.5 pF is marginal

Compared with TPD2E2U06DCKR, TPD2E001DCKR offers lower capacitance per channel but doubles component count and assembly cost for USB 2.0, while ESD5451D05R enables higher-frequency use cases but sacrifices drop-in replaceability and dual-channel integration.

Availability

TPD2E2U06DCKR is available at Aetrix Electronics and suitable for USB 2.0 interface protection, industrial display link hardening, and embedded I²C bus safeguarding requiring stable component supply across production lifecycles.

Supply support for TPD2E2U06DCKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with over 90 years of innovation in high-reliability components.

TPD2E2U06DCKR belongs to TI's ESD protection portfolio, engineered specifically for high-speed serial interfaces like USB 2.0, LVDS, and MIPI - prioritizing low capacitance, fast clamping, and industrial-grade thermal robustness.

FAQ

What is the primary function of the TPD2E2U06DCKR?

The TPD2E2U06DCKR is a dual-channel transient voltage suppression (TVS) diode designed exclusively for electrostatic discharge (ESD) protection of high-speed data lines. It clamps ESD transients to safe voltage levels using bidirectional avalanche diodes between each I/O pin and ground, without requiring external power or control signals. Its role is purely passive surge diversion - not signal conditioning or level shifting.

Does the TPD2E2U06DCKR require a power supply or bias voltage to operate?

No, the TPD2E2U06DCKR is a fully passive device with no power pins or bias requirements. It operates solely through its internal silicon avalanche diode structure, triggering only when voltage across an I/O-to-GND path exceeds the breakdown threshold (~6.5 V). This eliminates design complexity, quiescent current concerns, and compatibility issues with unpowered or hot-plug interfaces like USB.

Can the TPD2E2U06DCKR be used for USB 3.0 or higher-speed interfaces?

The TPD2E2U06DCKR is not recommended for USB 3.0 (5 Gbps) or faster interfaces. Its 1.5 pF typical capacitance introduces measurable insertion loss above 1 GHz, and its clamping behavior has not been characterized for SuperSpeed differential signaling. TI explicitly positions it for USB 2.0 (480 Mbps), LVDS, and I²C - applications where 1.5 pF loading remains within acceptable signal integrity margins.

How does the TPD2E2U06DCKR differ from the automotive-grade TPD2E2U06-Q1?

The TPD2E2U06-Q1 is the AEC-Q100 qualified variant of the same silicon die, with identical electrical specifications (capacitance, clamping voltage, ESD rating) but extended reliability validation for automotive environments - including temperature cycling, humidity testing, and zero-defect screening. The TPD2E2U06DCKR is rated for industrial temperature range (–40°C to +125°C) and lacks automotive qualification documentation or lot traceability requirements.

What is the recommended PCB layout practice for the TPD2E2U06DCKR?

TI specifies placement of the TPD2E2U06DCKR as close as possible to the protected connector - ideally within 5 mm - with direct, short, low-inductance traces from IO1/IO2 to the connector pins and a dedicated low-impedance GND connection to the nearest ground plane via multiple vias. Avoid routing unprotected traces near the protected path, and eliminate sharp corners to reduce EMI coupling during ESD events.

TPD2E2U06DCKR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
SC-70, SOT-323
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
2
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
5.5V (Max)
Voltage - Breakdown (Min):
6.5V
Voltage - Clamping (Max) @ Ipp:
12.4V (Typ)
Current - Peak Pulse (10/1000µs):
5.5A (8/20µs)
Power - Peak Pulse:
75W
Power Line Protection:
No
Applications:
Ethernet, USB 2.0
Capacitance @ Frequency:
1.5pF @ 1MHz
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SC-70-3

TPD2E2U06DCKR FAQ

1.How can I place an order for TPD2E2U06DCKR through Aetrix?

Please submit a Request for Quotation (RFQ) for TPD2E2U06DCKR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPD2E2U06DCKR reliable?

The price and inventory of TPD2E2U06DCKR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPD2E2U06DCKR is usually 5 days.

3.What payment methods are accepted for TPD2E2U06DCKR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPD2E2U06DCKR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TPD2E2U06DCKR?

TPD2E2U06DCKR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPD2E2U06DCKR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPD2E2U06DCKR?

For technical support, including TPD2E2U06DCKR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPD2E2U06DCKR requirements.

6.How does Aetrix verify that TPD2E2U06DCKR is sourced from the original manufacturer or authorized distributors?

All TPD2E2U06DCKR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPD2E2U06DCKR meets industry standards.

7.What is the process for return or replacement of TPD2E2U06DCKR?

All TPD2E2U06DCKR units undergo pre-shipment inspection (PSI). If there is an issue with TPD2E2U06DCKR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPD2E2U06DCKR part is unused and in its original packaging.

Return procedure for TPD2E2U06DCKR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TPD2E2U06DCKR Tags

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