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Texas Instruments TPD4E001DRSR
- Part No.:
- TPD4E001DRSR
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- 6-WDFN Exposed Pad
- Datasheet:
-
TPD4E001DRSR.pdf
- Description:
- TVS DIODE 5.5VWM 6SON
- Quantity:
- Payment:
- Shipping:
Inventory:6,310
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Product details
Overview
TPD4E001DRSR from Texas Instruments is a four-channel unidirectional ESD protection diode array in a 6-pin SON (DRS) package, rated per IEC 61000-4-2 Level 4 (±8kV contact / ±15kV air-gap), with 1.5pF typical IO capacitance per channel, <1nA maximum leakage current, and 0.9V–5.5V supply range - deployed for high-speed USB 2.0 and LVDS interface protection.
For engineers reviewing the TPD4E001DRSR datasheet, TPD4E001DRSR pinout, TPD4E001DRSR application, or TPD4E001DRSR equivalent, key selection criteria include low-capacitance ESD clamping performance, thermal resistance (RθJA = 91.9°C/W), VCC-referenced bidirectional clamping architecture, and compatibility with compact layout near high-speed connectors.
Technical Context
The TPD4E001DRSR implements a central ESD clamp with dual-diode per-line topology referenced to both GND and VCC, enabling symmetric clamping for positive and negative transients. Its unidirectional design relies on VCC biasing to define the upper clamping threshold (VCC + 25V at 10A HBM), while lower clamping occurs at –25V.
It operates passively without power consumption during normal signal conditions (<1nA ICC), activates sub-10ns during ESD events, and requires a 0.1µF ceramic capacitor on VCC to stabilize transient response. The DRS package includes an exposed thermal pad connected to GND for enhanced thermal dissipation (RθJC(bot) = 29.9°C/W).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000-4-2) | ±8kV contact / ±15kV air-gap - meets highest industrial immunity requirement for connector-level ESD protection |
| IO Capacitance (per channel) | 1.5pF at 10MHz, VCC/2 bias - preserves signal integrity up to 240MHz USB 2.0 data rates with minimal rise-time degradation |
| Leakage Current | ≤1nA max at VCC = 5.5V - avoids interference in precision analog circuits like glucose meter front-ends |
| Clamp Voltage (VC) | VCC + 25V (positive) / –25V (negative) at 10A HBM - limits stress on downstream USB transceivers during ESD |
| Supply Range | 0.9V to 5.5V - supports direct integration with 3.3V and 5V interface rails without level-shifting |
| Junction-to-Ambient RθJA | 91.9°C/W (DRS package) - enables higher sustained surge handling vs. SOT/SC70 variants under PCB-constrained thermal conditions |
| Operating Temperature | –40°C to +85°C - qualified for industrial and portable medical device environments |
Pinout & Package
TPD4E001DRSR uses a 6-pin SON (DRS) package (3.0mm × 3.0mm body, 0.5mm pitch) with an exposed thermal pad on the bottom surface. The pad must be soldered to a GND plane for optimal thermal and ESD current path performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO1 | ESD-protected input/output channel | First high-speed signal line (e.g., USB D+ of port 1); clamped between GND and VCC |
| IO2 | ESD-protected input/output channel | Second high-speed signal line (e.g., USB D– of port 1); independent clamping path |
| GND | Ground reference | Primary return path for ESD current; must be low-inductance connection to system GND plane |
| VCC | Power-supply reference | Bias node for upper clamping diodes; requires 0.1µF ceramic bypass to GND adjacent to pin |
| IO4 | ESD-protected input/output channel | Fourth signal line (e.g., USB D+ of port 2); shares same clamping architecture as IO1–IO3 |
| IO3 | ESD-protected input/output channel | Third signal line (e.g., USB D– of port 2); fully decoupled channel with 1.5pF loading |
Key Features
| Feature | Design Value |
|---|---|
| Uni-directional clamping with VCC reference | Enables precise upper-voltage threshold (VCC + 25V) while maintaining low forward drop (~0.65V) for negative transients |
| Dual-diode per-line architecture | Reduces effective IO capacitance to 1.5pF by splitting parasitic capacitance across two series diodes per channel |
| Exposed thermal pad (DRS only) | Lowers junction-to-board thermal resistance to 64.8°C/W - critical for surviving repeated 5.5A 8/20µs surges without thermal runaway |
| VCC-bypass capacitor support | 0.1µF ceramic cap at VCC pin suppresses voltage overshoot during fast ESD transients, limiting peak clamp excursion |
| Low-leakage passive operation | <1nA max leakage ensures no DC loading on sensitive analog sensors (e.g., glucose meter electrodes) or high-impedance signal paths |
Applications
| USB 2.0 Interface Protection | Ethernet PHY Line Protection |
|---|---|
|
Use Scenario: Protecting D+/D– lines of dual USB 2.0 ports against user-handling ESD events in portable diagnostic equipment. IC Role / Device Role / Timing Role: Four-channel ESD clamp placed directly at USB Type-A receptacles, routing transients to local GND/VCC before reaching USB controller IC. Use Value: 1.5pF capacitance prevents signal distortion at 480Mbps; ±8kV contact rating exceeds IEC 61000-4-2 Level 4 compliance for medical handheld devices. |
Use Scenario: Safeguarding differential pairs in 10/100BASE-TX Ethernet PHY interfaces exposed on RJ-45 jacks in industrial gateways. IC Role / Device Role / Timing Role: Channel-wise ESD suppression on TX+/TX– and RX+/RX– lines, leveraging VCC-referenced clamping to avoid common-mode disruption. Use Value: Ultra-low leakage (<1nA) eliminates baseline offset drift in transformer-coupled PHY receivers; 91.9°C/W RθJA sustains reliability under thermally dense board layouts. |
| LVDS Display Interface Protection | Glucose Meter Sensor Interface |
|
Use Scenario: Shielding LVDS clock/data pairs driving SVGA-resolution displays in automotive infotainment head units. IC Role / Device Role / Timing Role: Low-capacitance TVS array mounted at display cable connector, minimizing added jitter and maintaining eye diagram integrity. Use Value: 1.5pF per channel ensures <0.5% rise-time degradation at 240MHz; ±15kV air-gap rating covers worst-case dashboard static discharge scenarios. |
Use Scenario: Protecting electrochemical sensor inputs in Class II glucose meters where microamp-level current accuracy is critical. IC Role / Device Role / Timing Role: Passive ESD shunt on analog front-end traces, activated only during transients - zero DC bias impact on potentiostat circuitry. Use Value: ≤1nA leakage guarantees <0.1% error contribution to 100nA sensor currents; 0.9V–5.5V operating range matches battery-powered rail flexibility. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E1U06DBVR | Lower IO capacitance (0.5pF), higher IEC rating (±15kV contact), p2p compatible with TPD4E001DBVR (SOT-23), not pin-compatible with DRS package | Preferred for >1Gbps interfaces (e.g., USB 3.0 SS lanes) where sub-1pF loading is mandatory | Select TPD4E1U06DBVR only if upgrading from DBV variant and requiring tighter capacitance spec; DRS package users must redesign layout |
| TPD4E001DCKR | Identical electrical specs, SC-70 (DCK) package (2.0mm × 1.25mm), RθJA = 251.1°C/W, no thermal pad | Suitable for space-constrained consumer electronics where thermal load is low and board area is premium | Choose TPD4E001DCKR when footprint size is prioritized over thermal robustness; DRS remains optimal for industrial/high-surge environments |
Compared with TPD4E001DCKR and TPD4E1U06DBVR, the TPD4E001DRSR uniquely balances ultra-low capacitance, industrial-grade thermal performance (91.9°C/W), and compact 3mm × 3mm SON packaging - making it the preferred choice for high-reliability, high-speed interfaces where both ESD immunity and thermal margin are non-negotiable.
Availability
TPD4E001DRSR is available at Aetrix Electronics and suitable for USB 2.0 interface protection, LVDS display interconnects, and precision medical sensor front-ends requiring stable component supply across production lifecycles.
Supply support for TPD4E001DRSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company designing analog ICs, embedded processors, and connectivity solutions for industrial, automotive, and personal electronics markets.
The TPD4E001DRSR belongs to TI's ESD protection diode array product line, engineered specifically for high-speed data interface protection where low capacitance, low leakage, and IEC 61000-4-2 Level 4 compliance are essential.
FAQ
What is the maximum ESD voltage the TPD4E001DRSR can withstand?
The TPD4E001DRSR is rated per IEC 61000-4-2 Level 4: ±8kV contact discharge and ±15kV air-gap discharge on all IO pins. This rating applies across its full operating temperature range (–40°C to +85°C) and is verified per international test standards - not derated for package type or ambient conditions.
Does the TPD4E001DRSR require external power to operate?
No, the TPD4E001DRSR is a passive ESD protection device. It draws less than 1nA supply current (ICC) under normal operation and activates only during overvoltage transients. The VCC pin serves as a reference for clamping - not a power input - and must be bypassed with a 0.1µF capacitor to GND for optimal transient response.
Can the TPD4E001DRSR be used on 1.8V logic interfaces?
Yes, the TPD4E001DRSR supports a supply range of 0.9V to 5.5V on the VCC pin, making it fully compatible with 1.8V systems. Its clamping behavior scales with VCC: for example, at VCC = 1.8V, the positive clamp threshold is approximately VCC + 25V = 26.8V - well above 1.8V signal swing, ensuring no false triggering during normal operation.
What is the role of the exposed thermal pad on the TPD4E001DRSR package?
The exposed thermal pad on the TPD4E001DRSR (SON/DRS package) must be soldered to a GND plane to achieve its specified thermal performance: RθJC(bot) = 29.9°C/W and RθJA = 91.9°C/W. This pad provides the primary path for heat dissipation during high-current ESD events (e.g., 5.5A 8/20µs pulses) and improves long-term reliability under repeated surge stress.
Is the TPD4E001DRSR pin-compatible with other TPD4E001 package variants?
No, the TPD4E001DRSR (6-pin SON/DRS) has a different pinout and footprint than TPD4E001DBVR (SOT-23), TPD4E001DCKR (SC-70), or TPD4E001DRLR (SOT-5X3). While electrical specifications are identical across variants, mechanical replacement requires PCB layout revision due to differing pad patterns, pitch (0.5mm for DRS vs. 0.65mm for DBV), and thermal pad presence.
TPD4E001DRSR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 6-WDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 11V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- 100W
- Power Line Protection:
- Yes
- Applications:
- Ethernet
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-SON (3x3)
TPD4E001DRSR FAQ
1.How can I place an order for TPD4E001DRSR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPD4E001DRSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPD4E001DRSR reliable?
The price and inventory of TPD4E001DRSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPD4E001DRSR is usually 5 days.
3.What payment methods are accepted for TPD4E001DRSR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPD4E001DRSR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPD4E001DRSR?
TPD4E001DRSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPD4E001DRSR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPD4E001DRSR?
For technical support, including TPD4E001DRSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPD4E001DRSR requirements.
6.How does Aetrix verify that TPD4E001DRSR is sourced from the original manufacturer or authorized distributors?
All TPD4E001DRSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPD4E001DRSR meets industry standards.
7.What is the process for return or replacement of TPD4E001DRSR?
All TPD4E001DRSR units undergo pre-shipment inspection (PSI). If there is an issue with TPD4E001DRSR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPD4E001DRSR part is unused and in its original packaging.
Return procedure for TPD4E001DRSR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPD4E001DRSR Tags
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