My Inquiry
My Account
Texas Instruments TPD4E02B04DQAR
- Part No.:
- TPD4E02B04DQAR
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- 10-UFDFN
- Datasheet:
-
TPD4E02B04DQAR.pdf
- Description:
- TVS DIODE 3.6VWM 8.8VC 10USON
- Quantity:
- Payment:
- Shipping:
Inventory:23,498
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TPD4E02B04DQAR from Texas Instruments is a 4-channel bidirectional TVS ESD protection diode array designed for USB Type-C and HDMI 2.0 high-speed interfaces. It delivers ±12-kV contact / ±15-kV air-gap IEC 61000-4-2 ESD protection, 0.25-pF typical IO-to-GND capacitance, 5.5-V minimum DC breakdown voltage, and supports data rates up to 10 Gbps in industrial temperature range (–40°C to +125°C).
For engineers reviewing the TPD4E02B04DQAR datasheet, TPD4E02B04DQAR pinout, TPD4E02B04DQAR application, or TPD4E02B04DQAR equivalent, this device is selected for ultra-low-capacitance transient suppression on SuperSpeed+ differential pairs (e.g., SSTX1P/N, SSRX1P/N), CC/SBU lines, and DisplayPort/USB 3.1 Gen 2 signal paths where signal integrity at 5–10 GHz must be preserved.
Technical Context
The TPD4E02B04DQAR implements a passive, bidirectional clamping architecture using silicon avalanche diodes per channel, with each I/O pin rated for ±5.5 V DC breakdown and 8.8 V clamping at 5-A TLP. Its 0.47-Ω dynamic resistance ensures minimal voltage overshoot during fast transients.
It operates without bias or power supply, triggering only when transient voltages exceed VBRF (+5.5 V) or VBRR (–5.5 V); recovery occurs sub-10 ns after event termination. The USON-10 (DQA) package enables flow-through routing with 0.5-mm pitch, minimizing trace stubs and parasitic inductance critical for 10-Gbps eye diagram integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection (IEC 61000-4-2) | ±12-kV contact / ±15-kV air-gap discharge - meets Level 4 immunity for end-equipment compliance |
| IO Capacitance (per channel) | 0.25 pF typical / 0.33 pF max - preserves signal integrity up to 10 Gbps (e.g., USB 3.1 Gen 2) |
| DC Breakdown Voltage | ≥ ±5.5 V - ensures robust protection above ±3.6-V signal swing of SuperSpeed+ lanes |
| Clamping Voltage | 8.8 V at 5-A TLP - limits stress on downstream PHY ICs during ESD events |
| Leakage Current | ≤ 10 nA at ±2.5 V - prevents DC loading on high-impedance interface receivers |
| Surge Rating (IEC 61000-4-5) | 2 A (8/20 µs) - withstands lightning-induced surges on exposed connectors |
| Operating Temperature | –40°C to +125°C - qualified for industrial and extended-temperature embedded systems |
Pinout & Package
TPD4E02B04DQAR is housed in a 10-pin USON (DQA) package measuring 2.50 mm × 1.00 mm with 0.5-mm pitch and maximum height of 0.55 mm. The flow-through layout minimizes PCB routing complexity and maintains controlled impedance on high-speed differential traces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (IO1) | Protected I/O channel | Connects to first high-speed signal pair (e.g., SSTX1P or SSRX1P) |
| 2 (IO2) | Protected I/O channel | Connects to complementary line of same pair (e.g., SSTX1N or SSRX1N) |
| 3 (GND) | Ground reference | Low-inductance return path for ESD current; must connect directly to solid ground plane |
| 4 (IO3) | Protected I/O channel | Supports second differential pair (e.g., SSTX2P/SSRX2P) |
| 5 (IO4) | Protected I/O channel | Supports complementary line of second pair (e.g., SSTX2N/SSRX2N) |
| 6, 7, 9, 10 (NC) | No-connect terminals | Optional routing aids; may be left floating or grounded per layout needs |
| 8 (GND) | Ground reference | Second dedicated ground terminal for enhanced current shunting and thermal dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low IO capacitance | 0.25 pF typical enables clean 10-Gbps eye diagrams without measurable jitter degradation |
| Bidirectional clamping | ±5.5-V symmetric breakdown protects AC-coupled differential signals without polarity constraints |
| Low dynamic resistance | 0.47 Ω ensures rapid voltage clamping and minimal overshoot during 5-A TLP transients |
| Flow-through USON-10 layout | Linear pin arrangement allows straight trace routing-reducing stub length and crosstalk risk |
| Industrial temperature rating | –40°C to +125°C operation supports deployment in laptops, set-top boxes, and automotive infotainment |
Applications
| USB 3.1 Gen 2 Type-C Port | HDMI 2.0 Interface |
|---|---|
Use Scenario: Protecting SuperSpeed+ differential lanes (SSTX1P/N, SSRX1P/N, SSTX2P/N, SSRX2P/N) on a USB Type-C receptacle against human-body ESD events. IC Role / Device Role / Timing Role: Passive ESD clamp placed between connector and USB 3.1 Gen 2 PHY, diverting >12-kV discharges to ground within nanoseconds. Use Value: Maintains 10-Gbps signal fidelity by limiting channel capacitance to 0.25 pF and clamping voltage to ≤8.8 V at 5-A TLP. |
Use Scenario: Shielding TMDS clock and data channels (TMDS_CK±, TMDS_D0±–D2±) in 4K@60Hz HDMI 2.0 source devices from connector-level ESD. IC Role / Device Role / Timing Role: Bidirectional TVS array absorbing ±15-kV air-gap discharges before they reach HDMI transmitter ICs. Use Value: Preserves 6-Gbps eye opening via sub-0.33-pF max capacitance and <10-ns response time-verified in HDMI2.0 TP2 eye diagrams. |
| DisplayPort 1.3 Link | Laptop Docking Station Hub |
Use Scenario: Securing main link lanes (ML_Lane0–3) and AUX CH in DisplayPort 1.3 implementations against ESD during cable insertion/removal. IC Role / Device Role / Timing Role: Low-capacitance ESD suppressor placed adjacent to DP receptacle, providing fail-safe protection without degrading 8.1-Gbps differential signaling. Use Value: Enables full DP 1.3 compliance with ≤0.33-pF channel capacitance and 8.8-V clamping-validated in 8.1-Gbps eye testing. |
Use Scenario: Integrated ESD protection across multiple interfaces (USB-C, DP, HDMI, SBU/CC) in compact multiport laptop docks requiring single-chip solution scalability. IC Role / Device Role / Timing Role: Primary ESD guard for all high-speed and sideband-use signal lines, sharing dual GND pins for low-impedance surge return. Use Value: Reduces BOM count and PCB area vs discrete diodes while maintaining independent 0.25-pF per-channel performance across 4 protected paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E05U06DQAR | 0.5-pF typical capacitance; higher clamping voltage (10.5 V at 5-A TLP); supports 0–5.5-V signal range | Better suited for lower-speed lines (CC, SBU, DP/DM) up to 480 MHz-not recommended for 10-Gbps SuperSpeed+ | Select TPD4E05U06DQAR only for auxiliary/low-frequency USB-C signals; avoid for SSTX/SSRX lanes due to excessive capacitance. |
| TPD4E02B04-Q1 | Automotive-qualified (AEC-Q100 Grade 2); identical electrical specs and USON-10 package; enhanced reliability screening | Required for automotive infotainment head units and ADAS display interfaces needing zero-defect qualification | Choose TPD4E02B04-Q1 when deploying in vehicles; otherwise, standard TPD4E02B04DQAR suffices for industrial/consumer designs. |
Compared with TPD4E02B04DQAR, TPD4E05U06DQAR trades lower speed compatibility for broader voltage tolerance, while TPD4E02B04-Q1 adds automotive qualification without altering core ESD performance-making the base part optimal for cost-sensitive, high-speed consumer electronics.
Availability
TPD4E02B04DQAR is available at Aetrix Electronics and suitable for USB Type-C, HDMI 2.0, and DisplayPort 1.3 applications requiring stable component supply, high-volume production readiness, and long-term lifecycle assurance.
Supply support for TPD4E02B04DQAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with over 90 years of innovation in power management, signal chain, and interface technologies.
TPD4E02B04DQAR belongs to TI's ESD protection portfolio engineered specifically for ultra-high-speed digital interfaces-including USB 3.1 Gen 2, HDMI 2.0, and DisplayPort-where sub-0.3-pF capacitance and nanosecond response are mandatory.
FAQ
What is the primary function of the TPD4E02B04DQAR in a USB Type-C design?
The TPD4E02B04DQAR serves as a 4-channel bidirectional ESD protection diode array that safeguards SuperSpeed+ differential signal pairs (SSTX1P/N, SSRX1P/N, etc.) against ±12-kV contact and ±15-kV air-gap electrostatic discharges. Its 0.25-pF typical capacitance ensures minimal signal distortion at 10 Gbps, making it essential for maintaining USB 3.1 Gen 2 compliance in the TPD4E02B04DQAR-based layout.
Does the TPD4E02B04DQAR require external power or biasing?
No, the TPD4E02B04DQAR is a passive TVS diode array with no power supply pins. It operates solely through avalanche breakdown triggered by transient overvoltage events. Engineers must ensure signal voltages remain within the specified –3.6 V to +3.6 V operating range to prevent unintended conduction; no external bias or control logic is needed for the TPD4E02B04DQAR to function.
How does the USON-10 (DQA) package of the TPD4E02B04DQAR improve high-speed layout?
The USON-10 (DQA) package of the TPD4E02B04DQAR features a linear, flow-through pinout (IO1–IO4, dual GND, NCs) with 0.5-mm pitch and 2.5 mm × 1.0 mm footprint. This allows straight trace routing from connector to PHY, eliminating stubs and reducing parasitic inductance-critical for preserving 10-Gbps eye diagrams. The dual GND pins further lower impedance for ESD current return in the TPD4E02B04DQAR implementation.
Can the TPD4E02B04DQAR protect both USB-C SuperSpeed+ and Configuration Channel (CC) lines simultaneously?
No-the TPD4E02B04DQAR is optimized for high-speed differential lanes (SSTX/SSRX) with its 0.25-pF capacitance, but CC lines operate at lower frequencies (<1 MHz) and require different voltage handling (0–5.5 V). TI recommends pairing the TPD4E02B04DQAR with TPD4E05U06DQAR for CC/SBU protection. Using TPD4E02B04DQAR alone on CC lines risks insufficient voltage margin and unnecessary cost premium.
What is the significance of the 8.8-V clamping voltage specification for the TPD4E02B04DQAR?
The 8.8-V clamping voltage (measured at 5-A TLP) defines the maximum voltage imposed on protected ICs during an ESD event. For the TPD4E02B04DQAR, this value ensures downstream USB/HDMI PHYs-typically rated for ≤10-V absolute maximum-remain within safe operating limits. Combined with 0.47-Ω dynamic resistance, this clamping level guarantees reliable system-level ESD immunity without latch-up or damage to the TPD4E02B04DQAR or host ICs.
TPD4E02B04DQAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 10-UFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 4
- Voltage - Reverse Standoff (Typ):
- 3.6V (Max)
- Voltage - Breakdown (Min):
- 5.5V
- Voltage - Clamping (Max) @ Ipp:
- 8.8V (Typ)
- Current - Peak Pulse (10/1000µs):
- 5A (8/20µs)
- Power - Peak Pulse:
- 17W
- Power Line Protection:
- No
- Applications:
- HDMI
- Capacitance @ Frequency:
- 0.27pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-USON (2.5x1)
TPD4E02B04DQAR FAQ
1.How can I place an order for TPD4E02B04DQAR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPD4E02B04DQAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPD4E02B04DQAR reliable?
The price and inventory of TPD4E02B04DQAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPD4E02B04DQAR is usually 5 days.
3.What payment methods are accepted for TPD4E02B04DQAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPD4E02B04DQAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPD4E02B04DQAR?
TPD4E02B04DQAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPD4E02B04DQAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPD4E02B04DQAR?
For technical support, including TPD4E02B04DQAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPD4E02B04DQAR requirements.
6.How does Aetrix verify that TPD4E02B04DQAR is sourced from the original manufacturer or authorized distributors?
All TPD4E02B04DQAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPD4E02B04DQAR meets industry standards.
7.What is the process for return or replacement of TPD4E02B04DQAR?
All TPD4E02B04DQAR units undergo pre-shipment inspection (PSI). If there is an issue with TPD4E02B04DQAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPD4E02B04DQAR part is unused and in its original packaging.
Return procedure for TPD4E02B04DQAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPD4E02B04DQAR Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
