Texas Instruments TPD4E110DPWR
- Part No.:
- TPD4E110DPWR
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- 4-XFDFN Exposed Pad
- Datasheet:
-
TPD4E110DPWR.pdf
- Description:
- TVS DIODE 5.5VWM 13VC 4X2SON
- Quantity:
- Payment:

- Shipping:

Inventory:9,319
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TPD4E110DPWR from Texas Instruments is a unidirectional ESD protection diode array designed for high-speed differential signal lines, featuring 0.45 pF typical channel capacitance, ±12 kV contact/±15 kV air-gap IEC 61000-4-2 ESD rating, and 6.5 V minimum DC breakdown voltage. It protects four independent IO channels (IO1–IO4) referenced to GND in USB 3.0, HDMI 2.0, and PCIe interfaces.
For engineers reviewing the TPD4E110DPWR datasheet, TPD4E110DPWR pinout, TPD4E110DPWR application, or TPD4E110DPWR equivalent, key selection criteria include ultra-low capacitance for >6 Gbps data integrity, low dynamic resistance (0.7–0.8 Ω), clamping voltage ≤13 V at 5 A TLP, and compatibility with space-constrained 0.8 mm × 0.8 mm X2SON packaging.
Technical Context
The TPD4E110DPWR employs a central ESD clamp architecture with two series-hiding diodes per channel to minimize capacitive loading while maintaining fast response (<10 ns) during ±15 kV ESD transients. Its passive operation triggers only when line voltage exceeds 6.5 V (breakdown) or drops below –0.6 V (forward conduction), diverting surge current to GND.
Each of the four identical IO channels supports 0–5.5 V signal swing and exhibits matched capacitance variation (ΔCIO-TO-GND ≤ 0.05 pF), enabling precise differential pair routing without skew. The device operates across –40°C to 125°C and sustains 2.5 A (8/20 µs) IEC 61000-4-5 surge events with peak pulse power up to 35 W forward.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| IO Capacitance | 0.45 pF typ - preserves signal integrity up to 6 Gbps with minimal insertion loss in USB 3.0/HDMI 2.0 links |
| ESD Rating | ±12 kV contact / ±15 kV air-gap per IEC 61000-4-2 Level 4 - meets industrial system-level ESD immunity requirements |
| Clamp Voltage | 13 V max at 5 A TLP - limits transient overvoltage seen by protected ICs during ESD strikes |
| Breakdown Voltage | 6.5 V min - ensures reliable protection activation above 5.5 V system IO rails |
| Leakage Current | 1 nA max at 2.5 V - prevents signal distortion or power drain in low-voltage, high-impedance interfaces |
| Dynamic Resistance | 0.7 Ω typ (GND→IO) - reduces clamping voltage rise under high-current surges |
| Operating Temp | –40°C to 125°C - supports automotive infotainment, industrial camera, and embedded computing environments |
Pinout & Package
The TPD4E110DPWR uses a 4-terminal X2SON (DPW) package measuring 0.8 mm × 0.8 mm with 0.4 mm maximum height and an exposed thermal pad. Pin 1 index is marked on top; orientation follows Q2 quadrant convention. Thermal pad must be soldered for mechanical stability and thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO1 | Protected signal input | ESD-protected channel for first high-speed differential pair (e.g., SSTX+/SSTX–) |
| IO2 | Protected signal input | ESD-protected channel for second high-speed differential pair (e.g., SSRX+/SSRX–) |
| IO3 | Protected signal input | ESD-protected channel for auxiliary high-speed line (e.g., HDMI TMDS+, DisplayPort Lane 0+) |
| IO4 | Protected signal input | ESD-protected channel for auxiliary high-speed line (e.g., HDMI TMDS–, DisplayPort Lane 0–) |
| GND | Common reference | Low-inductance return path for all four ESD clamps; must connect directly to solid ground plane |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low channel capacitance | 0.45 pF typ enables <1 dB insertion loss at 3 GHz - critical for USB 3.0 eye diagram compliance |
| Matched inter-channel capacitance | ΔCIO-TO-GND ≤ 0.05 pF - maintains differential signal balance and minimizes common-mode noise |
| Low clamping voltage | VCLAMP ≤ 13 V at 5 A TLP - protects 3.3 V/5 V interface ICs without overstressing gate oxides |
| Space-optimized footprint | 0.8 mm × 0.8 mm X2SON - allows straight-through routing of two differential pairs on single-layer PCBs with 2.8 mil traces |
| Industrial temperature range | –40°C to 125°C - qualified for under-hood automotive, factory automation, and outdoor display applications |
Applications
| USB 3.0 SuperSpeed Interface | HDMI 2.0 Source Protection |
|---|---|
Use Scenario: Protecting SSTX+/SSTX– and SSRX+/SSRX– lines between Type-A connector and host controller in portable docking stations. IC Role / Device Role / Timing Role: Passive ESD shunt that activates within nanoseconds during human-hand contact discharge, clamping transients before they reach the USB 3.0 PHY. Use Value: Maintains 5 Gbps link integrity with <0.1 dB insertion loss at 2.5 GHz and preserves eye opening per USB-IF compliance testing. | Use Scenario: Shielding TMDS+ and TMDS– channels on HDMI 2.0 source PCBs in set-top boxes and AV receivers. IC Role / Device Role / Timing Role: Unidirectional TVS array that suppresses ESD-induced jitter and bit errors on 6 Gbps video streams without degrading rise/fall times. Use Value: Enables HDMI 2.0 compliance with <0.5% timing skew between differential pairs due to matched 0.05 pF ΔCIO-TO-GND. |
| PCIe Gen3 Differential Pairs | DisplayPort 1.4 Lane Protection |
Use Scenario: Safeguarding PCIe Gen3 x1/x2 lanes in embedded GPU modules and NVMe SSD adapters. IC Role / Device Role / Timing Role: Low-capacitance ESD guard for 8 GT/s serial links, placed adjacent to edge connectors to minimize stub length. Use Value: Achieves <–25 dB crosstalk suppression at 4 GHz and supports PCIe Gen3 equalization training with no BER degradation. | Use Scenario: Protecting DisplayPort 1.4 main link lanes (Lane 0–3) in thin-bezel monitors and VR headset interfaces. IC Role / Device Role / Timing Role: Four-channel ESD suppressor routed inline with each DP lane, leveraging symmetrical pinout for minimal trace discontinuity. Use Value: Delivers 8.1 Gbps bandwidth with <0.3 UI jitter increase and passes VESA DP1.4 electrical compliance tests. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E05U06DQAR | 0.5 pF capacitance, ±12 kV contact, 5.5 V breakdown - slightly higher capacitance and lower VBR | Better suited for 3.3 V systems with tighter voltage margins; less margin for 5 V tolerant interfaces | Select when protecting 3.3 V-only interfaces where 5.5 V VBR provides tighter clamping control |
| SZ1.8SMCG-TP | Unidirectional, 0.6 pF, ±15 kV contact, 18 V VBR - higher breakdown, larger SOD-323 package | Requires board area ~10× larger; used where thermal dissipation >35 W is needed or layout constraints allow discrete placement | Choose for legacy designs using SMT diodes or where higher surge robustness justifies footprint penalty |
Compared with TPD4E110DPWR, TPD4E05U06DQAR offers tighter voltage control for 3.3 V rails but sacrifices 6 Gbps margin, while SZ1.8SMCG-TP trades ultra-low capacitance for higher surge handling and legacy package compatibility - making TPD4E110DPWR optimal for space-constrained, multi-gigabit differential interfaces.
Availability
TPD4E110DPWR is available at Aetrix Electronics and suitable for USB 3.0 docking stations, HDMI 2.0 consumer electronics, and PCIe Gen3 embedded computing applications requiring stable component supply and long-term production continuity.
Supply support for TPD4E110DPWR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in precision analog, power management, and high-speed interface protection technologies.
The TPD4E110 product line targets high-speed digital interface protection, specifically engineered to preserve signal fidelity in SuperSpeed (up to 6 Gbps) applications while meeting stringent IEC 61000-4-2 Level 4 ESD requirements.
FAQ
What is the maximum data rate supported by TPD4E110DPWR?
The TPD4E110DPWR supports data rates up to 6 Gbps, validated via insertion loss measurements showing <1 dB attenuation at 3 GHz and eye diagram compliance in USB 3.0 SuperSpeed applications. Its 0.45 pF typical channel capacitance and matched inter-channel capacitance (≤0.05 pF) ensure minimal signal distortion at these speeds.
Does TPD4E110DPWR require external biasing or control signals?
No, the TPD4E110DPWR is a fully passive ESD protection device with no external bias or enable requirements. It operates automatically when transient voltages exceed its 6.5 V breakdown threshold or drop below –0.6 V forward conduction level, making it compatible with any 0–5.5 V IO interface without additional circuitry.
Can TPD4E110DPWR protect bidirectional differential signals like USB 3.0 SSTX+/SSTX–?
Yes, the TPD4E110DPWR's unidirectional architecture protects each IO line relative to GND, allowing it to safeguard both polarities of differential pairs. In USB 3.0, IO1 and IO2 are assigned to SSTX+ and SSTX– respectively, with both referenced to the same GND terminal - maintaining differential mode integrity while suppressing common-mode ESD transients.
What is the recommended PCB layout practice for TPD4E110DPWR?
Place the TPD4E110DPWR as close as possible to the connector - ideally within 5 mm - to minimize unprotected trace length. Route protected lines straight with rounded corners (≥0.5 mm radius), avoid vias between the device and connector, and solder the thermal pad to a solid ground plane. For USB 3.0, this enables single-layer routing of two differential pairs using 2.8 mil traces.
Is TPD4E110DPWR compliant with automotive AEC-Q200 standards?
No, the TPD4E110DPWR is not AEC-Q200 qualified. It is rated for industrial temperature range (–40°C to 125°C) and meets IEC 61000-4-2 Level 4 and IEC 61000-4-5 surge standards, but lacks the stress testing, failure analysis, and qualification documentation required for automotive-grade deployment. For automotive applications, consider TI's AEC-Q200 qualified alternatives such as TPD4E001DPYR.
TPD4E110DPWR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 4-XFDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 6.5V
- Voltage - Clamping (Max) @ Ipp:
- 13V (Typ)
- Current - Peak Pulse (10/1000µs):
- 5A (8/20µs)
- Power - Peak Pulse:
- 35W
- Power Line Protection:
- Yes
- Applications:
- HDMI
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-X2SON (0.8x0.8)
TPD4E110DPWR FAQ
1.How can I place an order for TPD4E110DPWR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPD4E110DPWR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPD4E110DPWR reliable?
The price and inventory of TPD4E110DPWR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPD4E110DPWR is usually 5 days.
3.What payment methods are accepted for TPD4E110DPWR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPD4E110DPWR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPD4E110DPWR?
TPD4E110DPWR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPD4E110DPWR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPD4E110DPWR?
For technical support, including TPD4E110DPWR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPD4E110DPWR requirements.
6.How does Aetrix verify that TPD4E110DPWR is sourced from the original manufacturer or authorized distributors?
All TPD4E110DPWR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPD4E110DPWR meets industry standards.
7.What is the process for return or replacement of TPD4E110DPWR?
All TPD4E110DPWR units undergo pre-shipment inspection (PSI). If there is an issue with TPD4E110DPWR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPD4E110DPWR part is unused and in its original packaging.
Return procedure for TPD4E110DPWR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPD4E110DPWR Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

