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Texas Instruments TPD4EUSB30DQAR
- Part No.:
- TPD4EUSB30DQAR
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- 10-UFDFN
- Datasheet:
-
TPD4EUSB30DQAR.pdf
- Description:
- TVS DIODE 5.5VWM 8VC 10USON
- Quantity:
- Payment:
- Shipping:
Inventory:12,879
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Product details
Overview
TPD4EUSB30DQAR from Texas Instruments is a 4-channel unidirectional TVS diode array for ESD protection of USB 3.0 SuperSpeed differential data lines (D1+, D1−, D2+, D2−), supporting 5 Gbps data rates with 0.8 pF typical IO-to-GND capacitance, 0.6 Ω typical dynamic resistance, and IEC 61000-4-2 ±8 kV contact ESD rating - deployed in notebook and media player USB Type-A connectors.
For engineers reviewing the TPD4EUSB30DQAR datasheet, TPD4EUSB30DQAR pinout, TPD4EUSB30DQAR application, or TPD4EUSB30DQAR equivalent, key selection criteria include low-capacitance signal integrity preservation, flow-through USON package routing compatibility, IEC 61000-4-5 5 A surge capability, and verified 2 ps eye-jitter penalty at 5 Gbps - critical for high-fidelity USB 3.0 interface protection.
Technical Context
The TPD4EUSB30DQAR implements four independent low-capacitance clamping diodes referenced to a common GND terminal, each rated for 7 V breakdown voltage (VBR) and 8 V clamp voltage (VCLAMP) at 1 A, enabling robust transient suppression without signal distortion on high-speed differential pairs. Its passive architecture activates only during overvoltage events, reverting to <0.1 μA leakage below 2.5 V.
Designed specifically for USB 3.0's 2.5 GHz fundamental frequency and 5 Gbps data rate, the device maintains <−3 dB insertion loss up to 7.4 Gbps (per Figure 6-7), with flow-through pin mapping (D1+, D1−, GND, GND, D2+, D2−) minimizing trace discontinuity and preserving differential impedance continuity across PCB layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000-4-2) | ±8 kV contact discharge - meets Level 4 immunity for direct human-interface port protection |
| Surge Rating (IEC 61000-4-5) | 5 A (8/20 µs) per channel - sustains industrial-grade lightning-induced transients on data lines |
| Capacitance (IO-to-GND) | 0.8 pF typical - enables minimal signal loading for 5 Gbps USB 3.0 eye diagram integrity |
| Dynamic Resistance | 0.6 Ω typical - ensures low VCLAMP (8 V @ 1 A), protecting downstream PHY from overvoltage stress |
| Breakdown Voltage (VBR) | 7 V @ 1 mA - safely exceeds USB 3.0 5.5 V max operating voltage while avoiding false triggering |
| Operating Temperature | −40°C to +85°C - qualified for consumer and industrial portable electronics thermal environments |
| Package | USON-10 (DQA), 2.5 mm × 1.0 mm - space-constrained footprint with exposed thermal pad for ESD current dissipation |
Pinout & Package
TPD4EUSB30DQAR uses the USON-10 (DQA) package: 2.5 mm × 1.0 mm body, 0.55 mm max height, wettable flank terminals, and flow-through pin mapping optimized for differential pair routing adjacent to USB 3.0 connectors.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D1+ | ESD clamp anode | Protects USB 3.0 TX/RX differential pair #1 positive line; connects directly to connector pin |
| D1− | ESD clamp cathode | Protects USB 3.0 TX/RX differential pair #1 negative line; symmetric layout preserves differential balance |
| GND | Common reference | Primary ESD current return path; requires low-inductance via to internal ground plane |
| GND | Common reference | Second dedicated ground terminal reduces loop inductance during multi-amp surge events |
| D2+ | ESD clamp anode | Protects auxiliary USB 3.0 differential pair (e.g., SS RX/TX or alternate lane); independent clamping |
| D2− | ESD clamp cathode | Paired with D2+ for full 4-channel coverage; identical electrical specs to D1+/D1− |
| N.C. | No connection | Pins 6, 7, 9, 10 are internally unconnected - must remain floating or grounded per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through pin mapping | Enables straight-line PCB routing between USB connector and host PHY, eliminating stubs and impedance discontinuities |
| 0.8 pF IO-to-GND capacitance | Preserves >7.4 Gbps signal bandwidth (−3 dB point), limiting eye closure to ~2 ps jitter penalty at 5 Gbps |
| 0.6 Ω dynamic resistance | Clamps 1 A ESD current to ≤8 V, keeping protected IC within safe operating voltage margin |
| ±8 kV IEC 61000-4-2 contact rating | Exceeds USB-IF compliance requirement for external ports, validated per international immunity standard |
| DQA 2.5 mm × 1.0 mm USON package | Reduces board area by 60% vs. SOIC alternatives while supporting automated optical inspection (AOI) via wettable flanks |
Applications
| USB 3.0 Host Port Protection | USB 3.0 Device Port Protection |
|---|---|
Use Scenario: Protecting the upstream-facing USB 3.0 Type-A receptacle on a notebook or set-top box against user-handling ESD events. IC Role / Device Role / Timing Role: Passive clamping diode array placed immediately adjacent to the connector, shunting ESD current to GND before it reaches the USB 3.0 controller PHY. Use Value: Maintains 5 Gbps signal fidelity with <2 ps added jitter and prevents PHY latch-up or damage from ±8 kV contact discharges. |
Use Scenario: Securing the downstream-facing USB 3.0 Type-A port on a portable media player or DVD player during cable insertion/removal. IC Role / Device Role / Timing Role: Bidirectional ESD suppressor on both TX and RX differential lanes, referenced to shared system GND. Use Value: Enables compact 2.5 mm × 1.0 mm layout integration while meeting IEC 61000-4-2 Level 4 and IEC 61000-4-5 surge requirements. |
| High-Density Docking Station Interface | Embedded USB 3.0 Expansion Module |
Use Scenario: Safeguarding multiple concurrent USB 3.0 lanes in a compact docking station with space-constrained PCB real estate. IC Role / Device Role / Timing Role: Single 4-channel device protecting two full-speed differential pairs (e.g., SS TX/RX + alternate lane), minimizing component count. Use Value: Replaces two dual-channel devices, reducing BOM cost and layout complexity without sacrificing 0.8 pF signal loading performance. |
Use Scenario: Adding certified USB 3.0 connectivity to an industrial embedded module where reliability under ESD stress is mission-critical. IC Role / Device Role / Timing Role: System-level ESD front-end protector mounted at the edge connector, preceding any active USB switch or retimer. Use Value: Provides 5 A (8/20 µs) surge withstand capability and −40°C to +85°C operation, ensuring field robustness in uncontrolled environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2EUSB30DRTR | 2-channel, SOT-9X3 (DRT) package, 0.7 pF capacitance, same 7 V VBR and 0.6 Ω Rdyn | Requires two units to protect four lanes; smaller 1.0 mm × 1.0 mm footprint but no dual-GND terminals | Select when protecting only one differential pair or when board space permits discrete placement per lane |
| SZ1.5SMIC8.2A | Single-channel 8.2 V Zener TVS, DO-214AC package, 150 pF capacitance, 15 kW surge rating | Not suitable for >1 Gbps signals due to excessive capacitance; intended for power-rail or low-speed I/O protection | Avoid for USB 3.0 - high capacitance degrades signal integrity beyond acceptable eye margin |
Compared with TPD2EUSB30DRTR, TPD4EUSB30DQAR consolidates four channels into one flow-through USON package, reducing layout area and eliminating inter-pair skew; unlike SZ1.5SMIC8.2A, it delivers sub-1 pF capacitance essential for 5 Gbps compliance.
Availability
TPD4EUSB30DQAR is available at Aetrix Electronics and suitable for notebooks, set-top boxes, portable media players, and docking stations requiring stable component supply with guaranteed long-term manufacturability and RoHS-compliant sourcing.
Supply support for TPD4EUSB30DQAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in precision analog, power management, and interface technologies since 1930.
TPD4EUSB30DQAR belongs to TI's ESD protection diode array product line, engineered specifically for high-speed serial interfaces including USB 3.0, HDMI, and DisplayPort - prioritizing ultra-low capacitance and IEC-certified transient immunity.
FAQ
What is the maximum data rate supported by TPD4EUSB30DQAR without signal degradation?
TPD4EUSB30DQAR supports USB 3.0 SuperSpeed operation at 5 Gbps with verified signal integrity: its 0.8 pF IO-to-GND capacitance yields a −3 dB insertion loss point at 7.4 Gbps (per Figure 6-7), and eye diagram testing shows only ~2 ps added jitter. This confirms full compatibility with USB 3.0 specification timing margins and ensures reliable link training and packet transmission in TPD4EUSB30DQAR-protected systems.
Does TPD4EUSB30DQAR require a power supply or bias voltage to operate?
No, TPD4EUSB30DQAR is a passive TVS diode array with no power pins or bias requirements. It operates solely through avalanche and forward conduction of internal clamping diodes during overvoltage events. The device remains in high-impedance standby (<0.1 μA leakage at 2.5 V) until triggered by ESD or surge, making TPD4EUSB30DQAR compatible with all USB 3.0 voltage domains (0–5.5 V) without external circuitry.
How does the dual-GND configuration in TPD4EUSB30DQAR improve ESD performance?
The two dedicated GND pins (pins 3 and 8) in TPD4EUSB30DQAR reduce current-loop inductance during high-di/dt ESD events (e.g., 8 kV contact discharge), lowering peak voltage overshoot at the protected IO lines. Layout guidelines specify connecting both GND pins to the PCB ground plane via separate large vias - this dual-path design improves transient energy dissipation efficiency and enhances system-level IEC 61000-4-2 pass/fail margin compared to single-GND alternatives like TPD2EUSB30DQAR.
Can TPD4EUSB30DQAR be used to protect USB 2.0 signals in addition to USB 3.0?
Yes, TPD4EUSB30DQAR protects both USB 3.0 SuperSpeed (5 Gbps) and legacy USB 2.0 (480 Mbps) differential pairs, as its 7 V breakdown voltage and 8 V clamp voltage safely accommodate USB 2.0's 3.3 V signaling range while providing superior ESD immunity (±8 kV contact) beyond USB-IF minimum requirements. Its low 0.8 pF capacitance introduces negligible loading on low-speed lines, making TPD4EUSB30DQAR a unified solution for mixed-generation USB ports.
What is the recommended PCB layout practice for TPD4EUSB30DQAR to maximize ESD protection efficacy?
Place TPD4EUSB30DQAR within 3 mm of the USB 3.0 connector, route D1+/D1− and D2+/D2− traces straight through the device with no stubs, connect both GND pins to the ground plane using ≥0.3 mm diameter vias, and avoid routing unprotected signals near protected traces. TI's layout examples (Figure 10-1) confirm that this approach minimizes inductance, prevents EMI coupling, and ensures >90% of ESD current flows through TPD4EUSB30DQAR rather than parasitic paths.
TPD4EUSB30DQAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 10-UFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 7V
- Voltage - Clamping (Max) @ Ipp:
- 8V
- Current - Peak Pulse (10/1000µs):
- 1A (8/20µs)
- Power - Peak Pulse:
- 45W
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-USON (2.5x1)
TPD4EUSB30DQAR FAQ
1.How can I place an order for TPD4EUSB30DQAR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPD4EUSB30DQAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPD4EUSB30DQAR reliable?
The price and inventory of TPD4EUSB30DQAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPD4EUSB30DQAR is usually 5 days.
3.What payment methods are accepted for TPD4EUSB30DQAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPD4EUSB30DQAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPD4EUSB30DQAR?
TPD4EUSB30DQAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPD4EUSB30DQAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPD4EUSB30DQAR?
For technical support, including TPD4EUSB30DQAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPD4EUSB30DQAR requirements.
6.How does Aetrix verify that TPD4EUSB30DQAR is sourced from the original manufacturer or authorized distributors?
All TPD4EUSB30DQAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPD4EUSB30DQAR meets industry standards.
7.What is the process for return or replacement of TPD4EUSB30DQAR?
All TPD4EUSB30DQAR units undergo pre-shipment inspection (PSI). If there is an issue with TPD4EUSB30DQAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPD4EUSB30DQAR part is unused and in its original packaging.
Return procedure for TPD4EUSB30DQAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPD4EUSB30DQAR Tags
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