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Texas Instruments TPD6E001RSER
- Part No.:
- TPD6E001RSER
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- 10-UFQFN
- Datasheet:
-
TPD6E001RSER.pdf
- Description:
- TVS DIODE 5VWM 10UQFN
- Quantity:
- Payment:
- Shipping:
Inventory:13,541
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Product details
Overview
TPD6E001RSER from Texas Instruments is a six-channel unidirectional ESD protection diode array designed for high-speed data interfaces. It delivers ±8-kV IEC 61000-4-2 contact and ±15-kV air-gap ESD protection, features 1.5-pF typical I/O capacitance per channel, <1-nA maximum leakage current, and operates across 0.9 V to 5.5 V - enabling robust protection of USB 2.0, SDIO, and precision analog signal lines without signal integrity degradation.
For engineers reviewing the TPD6E001RSER datasheet, TPD6E001RSER pinout, TPD6E001RSER application, or TPD6E001RSER equivalent, key selection criteria include low-capacitance ESD clamping performance, VCC-biased vs. floating supply configuration impact on voltage swing tolerance, thermal resistance (RθJA = 235°C/W in RSE), and compatibility with compact UQFN layout constraints for portable medical and industrial interface designs.
Technical Context
The TPD6E001RSER implements a central ESD clamp architecture with two internal diodes per I/O line, connected to VCC to protect both signal lines and the power rail. Its unidirectional topology enables clamping above VCC + VF (0.65–0.95 V) and below GND, with breakdown voltage (VBR) rated at 11 V minimum.
During an ESD event, it activates within nanoseconds to divert up to 45 A (±15-kV air-gap discharge), clamping protected lines to ≤VCC + 100 V (positive) or ≥–100 V (negative), while maintaining ultra-low dynamic impedance to limit voltage overshoot seen by downstream ICs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000-4-2) | ±8-kV contact / ±15-kV air-gap - meets Level 4 immunity for handheld and industrial end-equipment compliance. |
| I/O Capacitance | 1.5 pF typical per channel - preserves signal integrity up to 240 MHz (USB 2.0 full-speed) with minimal rise-time degradation. |
| Leakage Current | ±1 nA max at VIO = GND to VCC - avoids measurement error in precision analog front-ends (e.g., glucose meters). |
| Supply Voltage Range | 0.9 V to 5.5 V - supports direct integration into 1.8-V, 3.3-V, and 5-V interface rails without level-shifting. |
| Clamp Voltage (VC) | VCC + 100 V / –100 V at 45 A - defines worst-case overvoltage stress imposed on protected IC during ±15-kV air discharge. |
| Breakdown Voltage (VBR) | 11 V min at 10 mA - sets minimum trigger threshold before ESD conduction begins on each channel. |
| Junction-to-Ambient RθJA | 235°C/W (RSE package) - determines thermal derating limits under sustained transient power dissipation. |
Pinout & Package
TPD6E001RSER is packaged in a 10-pin UQFN (RSE) with 1.50 mm × 2.00 mm body size and 0.6-mm max height. The exposed pad (EP) must be soldered to GND for optimal thermal and ESD current path performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 6, 7, 8 | IO1–IO6 | ESD-protected bidirectional signal channels - each connects to one high-speed data line (e.g., USB D+/D−, SDIO CLK/DAT). |
| 5 | GND | Primary ground reference for ESD current return - must be low-inductance connection to system GND plane. |
| 10 | VCC | Power-supply bias input - enables enhanced clamping above VCC; bypass with 0.1-μF ceramic capacitor near pin. |
| 4, 9 | N.C. | No internal connection - left unconnected; no routing or copper required. |
| EP | GND (exposed pad) | Thermal and ESD current sink - requires solid solder connection to GND plane for RθJB = 154.6°C/W performance. |
Key Features
| Feature | Design Value |
|---|---|
| Low I/O capacitance | 1.5 pF typical per channel - ensures <0.5% signal attenuation at 240 MHz, critical for USB 2.0 eye diagram compliance. |
| VCC-referenced clamping | Enables precise upper-voltage limit (VCC + VF) - prevents overvoltage damage to 3.3-V or 5-V transceivers during positive transients. |
| Ultra-low leakage | ≤1 nA max across –40°C to 85°C - eliminates offset drift in microamp-level analog sensor paths (e.g., ECG, blood glucose). |
| Multi-line ESD coordination | Central clamp structure shares protection between all six channels - reduces component count vs. discrete TVS diodes per line. |
| RSE package footprint | 1.5 mm × 2.0 mm, 0.6 mm height - fits tight spacing near USB/SD card connectors in portable devices without sacrificing thermal performance. |
Applications
| USB 2.0 Interface Protection | SDIO Card Slot Protection |
|---|---|
Use Scenario: Protecting D+/D−, VBUS, and ID pins of three USB 2.0 Type-A receptacles on an industrial tablet. IC Role / Device Role / Timing Role: ESD transient suppressor placed directly at connector entry point - routes ±15-kV air-gap energy to GND/VCC before reaching USB PHY. Use Value: Maintains 480-Mbps data integrity via 1.5-pF loading and clamps transients to ≤VCC + 100 V, preventing PHY latch-up or damage. | Use Scenario: Securing SDIO clock, command, and four data lines on a portable medical imaging device with removable SD card slot. IC Role / Device Role / Timing Role: Six-channel I/O protector covering all SDIO signals - leverages VCC bias to clamp only above rail, avoiding false triggering during hot-plug transitions. Use Value: Enables reliable hot-swap operation with <1-nA leakage, eliminating baseline shift in SDIO command detection circuitry. |
| Precision Analog Sensor Interface | Industrial Monitor Video Port |
Use Scenario: Shielding differential analog inputs of a glucose meter's ADC front-end from user-handling ESD events. IC Role / Device Role / Timing Role: Low-leakage ESD guard for millivolt-level biosensor signals - operates at 1.8-V supply with no added series resistance or capacitance. Use Value: Prevents measurement corruption by limiting leakage to ±1 nA and preserving DC accuracy over temperature (–40°C to 85°C). | Use Scenario: Protecting SVGA RGB analog video lines and sync signals on a factory-floor HMI display exposed to frequent operator contact. IC Role / Device Role / Timing Role: High-speed ESD buffer for 640×480@60Hz analog video - uses low-capacitance design to avoid pixel smearing or color crosstalk. Use Value: Delivers clean video output by holding I/O capacitance to 1.5 pF/channel, minimizing RC time constant distortion on 75-Ω coaxial traces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E1U06RSER | 4-channel, 0.5-pF I/O capacitance, no VCC pin, higher ±15-kV ESD rating | Optimized for ultra-high-speed interfaces (>500 MHz); lacks VCC-referenced clamping | Select when lowest possible capacitance is critical and VCC biasing is not required. |
| TPD6E003RSER | 6-channel, 0.8-pF I/O capacitance, ±12-kV contact ESD rating, same RSE package | Lower ESD robustness but tighter capacitance spec - suitable for cost-sensitive consumer USB ports | Choose for balanced ESD margin and signal fidelity where ±12-kV contact immunity suffices. |
Compared with TPD6E001RSER, TPD4E1U06RSER offers lower capacitance but sacrifices channel count and VCC coordination, while TPD6E003RSER trades 3-kV ESD margin for 0.7-pF capacitance reduction - making TPD6E001RSER optimal for applications needing full Level 4 compliance with six-channel coverage and rail-referenced clamping.
Availability
TPD6E001RSER is available at Aetrix Electronics and suitable for USB 2.0 interface protection, SDIO card slot hardening, and precision analog sensor front-end shielding requiring stable component supply across medical, industrial, and portable electronics programs.
Supply support for TPD6E001RSER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and personal electronics markets.
The TPD6E001RSER belongs to TI's ESD protection diode array product line, engineered specifically for high-speed digital and precision analog interfaces where low capacitance, ultra-low leakage, and IEC 61000-4-2 Level 4 compliance are mandatory.
FAQ
What is the maximum operating temperature range for the TPD6E001RSER?
The TPD6E001RSER is specified for operation from –40°C to +85°C ambient temperature. This range is validated across all electrical parameters including leakage current, clamp voltage, and ESD robustness. Thermal metrics such as RθJA = 235°C/W (RSE package) assume this ambient range, and derating is required if junction temperature exceeds 150°C under sustained transient conditions. The TPD6E001RSER maintains full IEC 61000-4-2 Level 4 performance across this entire temperature span.
Can the VCC pin of the TPD6E001RSER be left unconnected?
Yes, the VCC pin of the TPD6E001RSER can be left floating, enabling signal swing tolerance up to ±10 V - useful in systems without a stable local supply rail. However, TI recommends connecting VCC to the system power rail (0.9 V to 5.5 V) and bypassing it with a 0.1-μF capacitor to achieve optimal clamping behavior (VCC + VF) and lowest capacitance. Leaving VCC unconnected removes VCC-referenced clamping but retains GND-referenced protection for negative transients.
How does the TPD6E001RSER differ from the TPD6E001RSFR variant?
The TPD6E001RSER uses a 10-pin UQFN (RSE) package (1.50 mm × 2.00 mm), while TPD6E001RSFR uses a 12-pin WQFN (RSF) package (4.00 mm × 4.00 mm). Key differences include thermal performance (RθJA = 235°C/W vs. 75.8°C/W), pin count (10 vs. 12), and IO channel mapping - RSFR adds two N.C. pins and relocates GND. Both share identical electrical specs, ESD ratings, and functional behavior. Layout density and thermal requirements determine selection: RSER for space-constrained portable designs, RSFR for higher-power or thermally demanding applications.
Is the TPD6E001RSER suitable for protecting USB 3.0 or higher-speed interfaces?
No, the TPD6E001RSER is not recommended for USB 3.0 (5 Gbps) or higher-speed interfaces. Its 1.5-pF typical I/O capacitance and internal diode structure are optimized for up to 240 MHz (USB 2.0 full-speed), as confirmed in the datasheet's Typical Application section. For SuperSpeed interfaces, TI recommends alternatives like TPD4E05U06 (0.2-pF) or TPD6S300A (integrated USB 3.0 + VBUS protection). Using TPD6E001RSER on USB 3.0 lanes would degrade eye diagram margins and fail USB-IF compliance testing.
What is the role of the exposed pad (EP) on the TPD6E001RSER package?
The exposed pad (EP) on the TPD6E001RSER is an integral part of the thermal and ESD current path - it must be soldered directly to the PCB's GND plane. This connection achieves RθJB = 154.6°C/W and provides low-inductance discharge for high-current ESD transients (up to 45 A). Failure to connect EP results in degraded thermal performance, elevated junction temperature during repeated ESD events, and compromised clamping response time. The datasheet specifies EP as "GND" and mandates its use in layout guidelines and mechanical drawings.
TPD6E001RSER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 10-UFQFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 6
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5V (Max)
- Voltage - Breakdown (Min):
- 11V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-UQFN (2.0x1.5)
TPD6E001RSER FAQ
1.How can I place an order for TPD6E001RSER through Aetrix?
Please submit a Request for Quotation (RFQ) for TPD6E001RSER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPD6E001RSER reliable?
The price and inventory of TPD6E001RSER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPD6E001RSER is usually 5 days.
3.What payment methods are accepted for TPD6E001RSER?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPD6E001RSER transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPD6E001RSER?
TPD6E001RSER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPD6E001RSER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPD6E001RSER?
For technical support, including TPD6E001RSER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPD6E001RSER requirements.
6.How does Aetrix verify that TPD6E001RSER is sourced from the original manufacturer or authorized distributors?
All TPD6E001RSER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPD6E001RSER meets industry standards.
7.What is the process for return or replacement of TPD6E001RSER?
All TPD6E001RSER units undergo pre-shipment inspection (PSI). If there is an issue with TPD6E001RSER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPD6E001RSER part is unused and in its original packaging.
Return procedure for TPD6E001RSER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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