Texas Instruments TPD6E001RSERG4
- Part No.:
- TPD6E001RSERG4
- Manufacturer:
- Texas Instruments
- Category:
- TVS Diodes
- Package:
- 10-UFQFN
- Datasheet:
-
TPD6E001RSERG4.pdf
- Description:
- TVS DIODE 5VWM 10UQFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,355
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Product details
Overview
TPD6E001RSERG4 from Texas Instruments is a six-channel unidirectional ESD protection diode array designed for high-speed data interfaces including USB 2.0, SDIO, and precision analog lines. It delivers ±8-kV IEC 61000-4-2 contact discharge and ±15-kV air-gap ESD protection per channel, with 1.5-pF typical I/O capacitance, <1-nA maximum leakage current, and operation across 0.9 V to 5.5 V supply range. It is deployed at connector interfaces to shunt transient energy to GND and VCC before reaching sensitive ICs.
For engineers reviewing the TPD6E001RSERG4 datasheet, TPD6E001RSERG4 pinout, TPD6E001RSERG4 application, or TPD6E001RSERG4 equivalent, key selection criteria include low-capacitance ESD clamping performance, VCC-biased vs. floating-VCC configuration trade-offs, thermal dissipation in UQFN-10 package, and compatibility with 240-MHz signal bandwidths in portable medical and industrial USB systems.
Technical Context
The TPD6E001RSERG4 implements a central ESD clamp architecture with two internal diodes per I/O line - one forward-biased to VCC and one reverse-biased to GND - enabling bidirectional transient suppression while minimizing parasitic capacitance. Its 1.5-pF per-channel capacitance is achieved via optimized diode geometry and layout isolation, preserving signal integrity up to 240 MHz.
This device operates passively: it remains in high-impedance state (<1 nA leakage) during normal operation and triggers within nanoseconds when I/O voltage exceeds breakdown (11 V) or falls below –0.6 V, clamping transients to ≤±100 V under ±15-kV IEC air-gap discharge at 45-A peak current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±8-kV contact / ±15-kV air-gap per IEC 61000-4-2 Level 4 - ensures robust handling of real-world human-body ESD events at connectors. |
| I/O Capacitance | 1.5 pF typical per channel - enables use on USB 2.0 (480 Mbps) and SDIO interfaces without signal rise-time degradation. |
| Leakage Current | ±1 nA maximum at VI/O = GND to VCC - preserves accuracy in precision analog front-ends like glucose meter sensor paths. |
| Supply Voltage Range | 0.9 V to 5.5 V on VCC pin - supports biasing from 3.3-V or 5-V system rails; VCC can be left floating for ±10-V signal swing tolerance. |
| Clamp Voltage (VC) | ≤±100 V at 45-A peak (±15-kV air-gap) - limits stress on downstream USB transceivers or ADC inputs during worst-case ESD. |
| Operating Temperature | –40°C to +85°C - qualified for industrial monitors, IP cameras, and portable medical devices with extended ambient ranges. |
| Package | UQFN-10 (RSE), 1.5 mm × 2.0 mm, 0.6-mm max height - enables ultra-compact placement adjacent to micro-USB or mini-AB connectors. |
Pinout & Package
TPD6E001RSERG4 is housed in a 10-pin UQFN (RSE) package with an exposed thermal pad (EP) connected to GND. The package measures 1.5 mm × 2.0 mm with 0.4-mm pitch and is RoHS-compliant with NiPdAu lead finish. Pin 1 is located at the top-left corner with a marked index area; the exposed pad must be soldered to a GND plane for optimal thermal and ESD performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | GND | Dedicated ground terminals - provide low-inductance return path for ESD current; all three must be connected to system GND plane. |
| 4, 9 | N.C. | No internal connection - must remain unconnected; no routing or copper pour required. |
| 5 | GND (EP) | Exposed thermal pad - requires full-solder connection to GND plane for thermal dissipation and ESD current shunting. |
| 6, 7, 8 | IO1–IO3 | ESD-protected I/O channels - each connects to one differential pair (e.g., D+/D– of USB port 1); bidirectionally clamped. |
| 10 | VCC | Power-supply reference pin - biased to system rail (0.9–5.5 V) to enable VCC-referenced clamping; bypass with 0.1-μF ceramic capacitor. |
Key Features
| Feature | Design Value |
|---|---|
| Low 1.5-pF I/O capacitance | Preserves signal edge rate and impedance matching on 480-Mbps USB 2.0 traces without requiring trace length compensation. |
| Uni-directional clamp architecture | Uses VCC-referenced and GND-referenced diodes per line - achieves tighter clamping than bi-directional TVS while maintaining low CI/O. |
| VCC-flexible operation | Supports both biased (0.9–5.5 V) and floating VCC configurations - enables ±10-V signal tolerance when VCC is unconnected. |
| Ultra-low 1-nA leakage | Prevents DC offset errors and battery drain in portable medical sensors (e.g., blood glucose meters) and low-power IoT endpoints. |
| RSE package footprint | 1.5 mm × 2.0 mm UQFN occupies <3 mm² PCB area - fits within tight spacing constraints near micro-USB Type-B or Mini-AB receptacles. |
Applications
| USB 2.0 Port Protection | SDIO Interface Protection |
|---|---|
|
Use Scenario: Protecting three USB 2.0 ports on an industrial handheld terminal against repeated plug/unplug ESD events. IC Role / Device Role / Timing Role: ESD transient suppressor placed directly at USB connector pins (D+, D–, VBUS, GND), clamping surges before they reach the USB controller PHY. Use Value: Prevents latch-up or permanent damage to USB transceivers during ±8-kV contact discharge, maintaining host-device enumeration reliability over 10,000+ connect cycles. |
Use Scenario: Securing SDIO data lines (CMD, CLK, DAT0–DAT3) in a portable data terminal with integrated Wi-Fi and GPS. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp on each SDIO signal line, positioned between SD card slot and application processor's SDIO controller. Use Value: Maintains 25-MHz SDIO clock integrity and avoids bit errors during hot-plug events, thanks to 1.5-pF loading and sub-10-ns response time. |
| Precision Analog Sensor Interface | Industrial Monitor Video Link |
|
Use Scenario: Shielding analog front-end inputs of a blood glucose meter from ESD induced by finger contact on test-strip port. IC Role / Device Role / Timing Role: ESD protection on low-voltage analog sensor lines (e.g., amperometric current sense), operating at DC to 10-kHz bandwidth. Use Value: Eliminates measurement drift caused by ESD-induced gate leakage in op-amps, enabled by <1-nA max leakage and absence of input capacitors. |
Use Scenario: Guarding SVGA (800×600) video interface lines (R/G/B, HSYNC, VSYNC) on an industrial LCD monitor exposed to maintenance personnel. IC Role / Device Role / Timing Role: High-speed ESD clamp on parallel RGB video bus, mounted at rear-panel D-sub connector. Use Value: Prevents pixel corruption or display freeze during ±15-kV air-gap discharges, leveraging 240-MHz bandwidth support and fast recovery to high-Z state. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD6E001RSER | Identical electrical specs and RSE package; differs only in tape-and-reel packaging (no G4 suffix) and part marking ("2DO" vs "2DOG4"). | No functional difference - used interchangeably in production; G4 denotes TI's green-chemistry plating process (NiPdAu). | Select TPD6E001RSERG4 when RoHS-compliant NiPdAu finish and TI's latest environmental compliance are required. |
| TPD4E1U06DQAR | 4-channel, 0.5-pF typical I/O capacitance, ±12-kV contact/±15-kV air-gap, WSON-6 package - lower capacitance but fewer channels. | Better suited for space-constrained single-port USB or MIPI D-PHY interfaces where <0.5-pF loading is critical. | Choose TPD4E1U06DQAR only if system uses ≤4 protected lines and demands sub-1-pF capacitance; not a drop-in replacement for 6-channel needs. |
Compared with TPD6E001RSERG4, TPD6E001RSER offers identical performance with legacy plating, while TPD4E1U06DQAR trades channel count for lower capacitance - making TPD6E001RSERG4 the optimal choice for multi-port USB 2.0 or SDIO systems requiring six independent, low-leakage, high-ESD-protection channels in minimal area.
Availability
TPD6E001RSERG4 is available at Aetrix Electronics and suitable for industrial monitors, portable data terminals, and blood glucose meters requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for TPD6E001RSERG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and high-reliability components for industrial, automotive, and medical applications.
The TPD6E001RSERG4 belongs to TI's ESD protection diode array product line, engineered specifically for high-speed digital and precision analog interfaces where low capacitance, ultra-low leakage, and certified IEC 61000-4-2 Level 4 immunity are mandatory.
FAQ
What is the primary function of the TPD6E001RSERG4 in a circuit?
The TPD6E001RSERG4 serves as a six-channel ESD protection diode array that clamps transient voltages on high-speed data lines - such as USB 2.0 D+/D–, SDIO, or analog sensor inputs - diverting surge current to GND and VCC. It remains non-intrusive during normal operation due to its 1.5-pF capacitance and <1-nA leakage, ensuring signal fidelity and measurement accuracy. Its design purpose is to prevent permanent damage to downstream ICs during ±8-kV contact or ±15-kV air-gap ESD events.
Can the VCC pin of the TPD6E001RSERG4 be left unconnected?
Yes, the VCC pin of the TPD6E001RSERG4 may be left floating, enabling ±10-V signal swing tolerance on I/O lines - useful in systems without a stable local supply rail. However, when VCC is biased (0.9–5.5 V), the device provides tighter clamping (e.g., VCC + 25 V for ±8-kV contact discharge) and improved ESD performance. A 0.1-μF ceramic capacitor is recommended at VCC regardless of connection state to enhance high-frequency energy shunting during ESD events.
How does the TPD6E001RSERG4 differ from the TPD2E2U06 in terms of ESD protection capability?
The TPD6E001RSERG4 provides ±8-kV contact / ±15-kV air-gap IEC 61000-4-2 protection per channel, while the TPD2E2U06 delivers higher ±12-kV contact / ±15-kV air-gap ratings and eliminates the need for an external input capacitor. However, TPD2E2U06 is a 2-channel device in a smaller SOT-563 package and lacks VCC biasing - making it unsuitable as a direct replacement for 6-channel applications. TPD6E001RSERG4 remains preferred where channel count, low leakage, and VCC-flexible operation are essential.
Is the TPD6E001RSERG4 compatible with USB 2.0 high-speed (480 Mbps) signaling?
Yes, the TPD6E001RSERG4 is explicitly validated for USB 2.0 high-speed operation. Its 1.5-pF typical I/O capacitance introduces negligible signal distortion at 240-MHz fundamental frequency, and its sub-10-ns response time ensures clamping occurs before transients propagate into the USB transceiver. TI's typical application schematic confirms use with three full USB 2.0 ports, and layout guidelines emphasize placement adjacent to the connector to preserve eye diagram integrity.
What is the significance of the 'G4' suffix in TPD6E001RSERG4?
The 'G4' suffix in TPD6E001RSERG4 indicates Texas Instruments' fourth-generation green plating process using NiPdAu (nickel-palladium-gold) finish, compliant with RoHS and JEDEC MSL Level-1 standards. It replaces older SnPb or matte tin finishes and ensures superior solderability, wire-bond compatibility, and corrosion resistance - critical for long-lifecycle industrial and medical products. Electrically and functionally, TPD6E001RSERG4 is identical to TPD6E001RSER.
TPD6E001RSERG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 10-UFQFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 6
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5V (Max)
- Voltage - Breakdown (Min):
- 11V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-UQFN (2.0x1.5)
TPD6E001RSERG4 FAQ
1.How can I place an order for TPD6E001RSERG4 through Aetrix?
Please submit a Request for Quotation (RFQ) for TPD6E001RSERG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPD6E001RSERG4 reliable?
The price and inventory of TPD6E001RSERG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPD6E001RSERG4 is usually 5 days.
3.What payment methods are accepted for TPD6E001RSERG4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPD6E001RSERG4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPD6E001RSERG4?
TPD6E001RSERG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPD6E001RSERG4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPD6E001RSERG4?
For technical support, including TPD6E001RSERG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPD6E001RSERG4 requirements.
6.How does Aetrix verify that TPD6E001RSERG4 is sourced from the original manufacturer or authorized distributors?
All TPD6E001RSERG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPD6E001RSERG4 meets industry standards.
7.What is the process for return or replacement of TPD6E001RSERG4?
All TPD6E001RSERG4 units undergo pre-shipment inspection (PSI). If there is an issue with TPD6E001RSERG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPD6E001RSERG4 part is unused and in its original packaging.
Return procedure for TPD6E001RSERG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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