Microchip Technology UM4001CR
- Part No.:
- UM4001CR
- Manufacturer:
- Microchip Technology
- Category:
- RF Diodes
- Package:
- Stud
- Datasheet:
-
UM4001CR.pdf
- Description:
- SI PPIN HERMETIC STUD
- Quantity:
- Payment:

- Shipping:

Inventory:5,431
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
UM4001CR from Microsemi is a high-power RF PIN diode designed for low-distortion switching and attenuation in HF–S-band systems. It features 200 V reverse voltage rating, 0.5 Ω typical series resistance at 100 MHz, >5 µs carrier lifetime, 3 pF capacitance at 100 V/1 MHz, and operates in stud-mounted isolated packages for thermal reliability in phase shifters and duplexers.
For engineers reviewing the UM4001CR datasheet, UM4001CR pinout, UM4001CR application, or UM4001CR equivalent, key selection criteria include reverse voltage margin, RF series resistance at operating frequency, carrier lifetime impact on switching linearity, thermal path configuration (stud vs. surface mount), and compatibility with high-peak-power pulsed RF environments.
Technical Context
The UM4001CR uses a non-cavity, thick I-region PIN structure optimized for high RF power handling and low intermodulation distortion. Its long carrier lifetime (>5 µs) enables efficient control of high RF signal levels with modest DC bias current, while low 0 V-bias capacitance (≤3 pF) and conductance support broadband impedance matching in filter and cavity networks.
Thermally, the CR package employs an isolated stud-mount configuration with direct chip-to-stud thermal conduction-enabling 25 W power dissipation at 25°C stud temperature and 12 W in free air. This architecture supports proven operation in megawatt-peak-power UHF duplexers and high-reliability antenna selector designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage | 200 V - sets maximum RF peak voltage swing before breakdown in switch/attenuator legs |
| Series Resistance | 0.5 Ω typ. @ 100 MHz - determines insertion loss and power handling in forward-biased RF paths |
| Capacitance | 3 pF max. @ 100 V, 1 MHz - defines off-state shunt reactance and tuning range in resonant networks |
| Carrier Lifetime | >5 µs - ensures linear RF control with low bias current and minimizes harmonic generation |
| Power Dissipation | 25 W @ 25°C stud temp - enables continuous-wave operation in thermally managed RF subsystems |
| Forward Voltage | 1.0 V @ 100 mA - establishes DC bias circuit voltage drop and heat generation in control paths |
Pinout & Package
The UM4001CR is housed in an isolated stud-mount "CR" package (Style CR per Microsemi mechanical drawings), featuring a metal stud anode terminal and insulated cathode flange for high-voltage standoff and direct heatsinking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Stud) | DC bias input / RF signal path entry | Electrically active mounting surface; requires insulating washer and torque-controlled fastening to heatsink |
| Cathode (Flange) | DC return / RF signal path exit | Isolated metal flange; provides RF ground reference while maintaining HV isolation from stud |
Key Features
| Feature | Design Value |
|---|---|
| Non-cavity construction | Eliminates parasitic resonances above 3 GHz, enabling stable S-band performance without mode suppression |
| Thermally matched configuration | Minimizes thermal stress between silicon die and copper stud under rapid RF pulsing (e.g., radar duplexers) |
| Low 0 V-bias capacitance | Reduces off-state coupling in multi-pole filter switching, preserving stopband rejection up to 1 GHz |
| RoHS-compliant matte tin finish | Enables lead-free reflow assembly while maintaining solder wetting and intermetallic stability at RF junctions |
Applications
| UHF Phase Shifters | Megawatt Radar Duplexers |
|---|---|
Use Scenario: Digital beamforming arrays requiring precise phase control across 300–1000 MHz bands. IC Role / Device Role / Timing Role: PIN diode switch element in switched-line or loaded-line phase shifter topologies. Use Value: Long carrier lifetime and low Rs enable <−60 dBc IM3 suppression at +40 dBm RF input with 10 mA bias. | Use Scenario: High-peak-power T/R modules protecting receiver front-ends during 1–10 µs transmit pulses. IC Role / Device Role / Timing Role: Transmit path series switch and receive path shunt limiter in circulator-less architectures. Use Value: 100 kW pulse rating and 200 V reverse voltage withstand allow safe operation with 5 kV peak RF transients. |
| Antenna Selection Networks | RF Filter Tuning Arrays |
Use Scenario: Multi-band base station radios dynamically selecting between 700 MHz, 1.8 GHz, and 2.6 GHz antennas. IC Role / Device Role / Timing Role: High-isolation RF switch routing signals to band-specific front-end chains. Use Value: 3 pF off-capacitance and >10 kΩ parallel resistance ensure >40 dB isolation at 2.6 GHz with minimal detuning. | Use Scenario: Reconfigurable cavity filters in satellite uplink amplifiers requiring real-time bandwidth adjustment. IC Role / Device Role / Timing Role: Capacitance-tuned shunt element switching discrete inductors/capacitors into resonant loops. Use Value: Low Rs and high τ enable monotonic CT vs. VR response, supporting accurate 0.1% center-frequency resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-power RF PIN diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| UMX4001CR | RoHS-compliant matte tin finish; identical electrical specs and CR package | Required for lead-free manufacturing; same thermal and RF performance | Select UMX4001CR when RoHS compliance is mandated and Sn/Pb soldering is prohibited |
| UM4901CR | Same 200 V rating but higher 37.5 W power dissipation due to shorter thermal path | Better suited for continuous-wave high-duty-cycle applications above 15 W average power | Choose UM4901CR where ambient stud temperature exceeds 50°C or average power exceeds 12 W |
Compared with UM4001CR, UMX4001CR offers identical RF and thermal behavior with lead-free process compatibility, while UM4901CR delivers superior steady-state thermal capacity at the cost of slightly higher package inductance-making UM4001CR optimal for pulsed, medium-average-power S-band switches where cost and legacy process alignment matter.
Availability
UM4001CR is available at Aetrix Electronics and suitable for UHF phase shifters, radar duplexers, antenna selection networks, and RF filter tuning arrays requiring stable component supply across extended production lifecycles.
Supply support for UM4001CR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi (now part of Microchip Technology) specializes in high-reliability analog and RF semiconductors for aerospace, defense, and communications infrastructure.
The UM4000/UM4900 series was engineered specifically for high-power microwave switching in mission-critical radar, EW, and SATCOM systems where RF linearity, thermal robustness, and long-term reliability are non-negotiable.
FAQ
What is the maximum reverse voltage rating for UM4001CR?
The UM4001CR has a reverse voltage rating of 200 V at 10 µA leakage current. This rating defines the maximum DC or peak RF voltage the device can block in its off state without breakdown. Exceeding this voltage risks irreversible avalanche damage, especially under high-duty-cycle or high-temperature conditions. The 200 V rating makes UM4001CR suitable for S-band radar switches and UHF antenna tuners where peak RF voltages remain below this threshold.
How does UM4001CR's carrier lifetime affect RF linearity?
UM4001CR's carrier lifetime exceeds 5 µs, which directly improves RF linearity by reducing harmonic and intermodulation distortion during high-level signal switching. Longer lifetime allows smoother charge storage modulation under RF drive, enabling clean switching transitions even at +40 dBm input power. This characteristic is critical in phase shifters and attenuators where third-order intercept point (IP3) must exceed +60 dBm-achievable only with lifetime-optimized PIN diodes like UM4001CR.
Can UM4001CR be used in surface-mount designs?
No-UM4001CR is exclusively offered in the CR-style isolated stud-mount package, not a surface-mount variant. The CR package requires mechanical fastening to a heatsink via its threaded anode stud and relies on direct thermal conduction through the stud. For surface-mount alternatives, consider the SM-package variants (e.g., UM4001SM), which share the same 200 V rating and electrical specs but use a different thermal and mechanical interface incompatible with UM4001CR's mounting requirements.
What is the typical series resistance of UM4001CR at 100 MHz?
The typical series resistance (RS) of UM4001CR is 0.5 Ω when measured at 100 MHz with 100 mA forward bias. This value determines insertion loss in the on-state and power dissipation under RF current flow. At higher frequencies (e.g., 2 GHz), RS increases slightly due to skin effect, but remains below 0.7 Ω-ensuring low-loss performance in S-band switch designs. Designers use this spec to calculate worst-case I²R heating and verify thermal margin in high-duty-cycle operation.
Is UM4001CR RoHS compliant?
The standard UM4001CR uses Sn/Pb plating and is not RoHS compliant. However, Microsemi offers the functionally identical UMX4001CR variant with matte tin finish that meets EU Directive 2002/95/EC. Both parts share identical electrical, thermal, and mechanical specifications-the only difference is the termination finish. Customers requiring RoHS compliance must specify UMX4001CR; substituting UM4001CR in lead-free assembly processes may cause solder joint reliability issues.
UM4001CR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- UM4000
- Package/Case:
- Stud
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Diode Type:
- PIN - Single
- Voltage - Peak Reverse (Max):
- 100V
- Current - Max:
- -
- Capacitance @ Vr, F:
- 3pF @ 100V, 1MHz
- Resistance @ If, F:
- 500mOhm @ 100mA, 100MHz
- Power Dissipation (Max):
- 25 W
- Operating Temperature:
- -65°C ~ 175°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- -
UM4001CR FAQ
1.How can I place an order for UM4001CR through Aetrix?
Please submit a Request for Quotation (RFQ) for UM4001CR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UM4001CR reliable?
The price and inventory of UM4001CR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UM4001CR is usually 5 days.
3.What payment methods are accepted for UM4001CR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UM4001CR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UM4001CR?
UM4001CR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UM4001CR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UM4001CR?
For technical support, including UM4001CR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UM4001CR requirements.
6.How does Aetrix verify that UM4001CR is sourced from the original manufacturer or authorized distributors?
All UM4001CR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UM4001CR meets industry standards.
7.What is the process for return or replacement of UM4001CR?
All UM4001CR units undergo pre-shipment inspection (PSI). If there is an issue with UM4001CR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UM4001CR part is unused and in its original packaging.
Return procedure for UM4001CR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
UM4001CR Tags
.jpg)
-
BAP70-02,115
NXP USA Inc.

-
SMP1321-040LF
Skyworks Solutions Inc.

-
NSVR351SDSA3T1G
onsemi

-
BAT6302VH6327XTSA1
Infineon Technologies

-
SMP1307-011LF
Skyworks Solutions Inc.

-
SMP1345-040LF
Skyworks Solutions Inc.

-
BAT1503WE6327HTSA1
Infineon Technologies

-
SMS7630-005LF
Skyworks Solutions Inc.

-
SMP1322-040LF
Skyworks Solutions Inc.

-
SMS7621-040LF
Skyworks Solutions Inc.

-
SMS7621-079LF
Skyworks Solutions Inc.

-
SMS7630-040LF
Skyworks Solutions Inc.
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

