Microchip Technology UM7502F
- Part No.:
- UM7502F
- Manufacturer:
- Microchip Technology
- Category:
- RF Diodes
- Package:
- -
- Datasheet:
-
UM7502F.pdf
- Description:
- SI PPIN HERMETIC MELF
- Quantity:
- Payment:

- Shipping:

Inventory:5,236
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
UM7502F from Microsemi is a high-voltage, low-leakage RF power PIN diode designed for microwave switching and attenuator circuits in MRI systems, CAT scan equipment, and MIL-STD-750-compliant military transceivers. It features 200 V reverse voltage rating, <0.5 µA reverse current at rated voltage, 0.8–1.0 Ω series resistance at 100 MHz/50 mA, 2.5–3.5 µs carrier lifetime, and hermetic fused-in-glass construction.
For engineers reviewing the UM7502F datasheet, UM7502F pinout, UM7502F application, or UM7502F equivalent, key selection criteria include reverse voltage margin for pulsed RF systems, thermal resistance under stud-mount conditions (20 °C/W for Package D), harmonic distortion performance (≥60 dBc reverse bias), and compatibility with automatic insertion equipment in high-reliability medical and defense assemblies.
Technical Context
The UM7502F employs a fully passivated silicon PIN structure with precisely controlled 100 µm I-region width to achieve stable reverse characteristics and low distortion across 100 MHz–1 GHz. Its metallurgically bonded, thermally matched construction ensures reliable power dissipation up to 7.5 W at 25 °C stud temperature.
It delivers low-loss RF switching via low series resistance (0.8–1.0 Ω) and high parallel resistance (>100 kΩ at 100 V), while maintaining <0.5 µA leakage-critical for high-isolation switch designs in MRI gradient amplifiers and radar T/R modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 200 V - Supports RF switch operation in 100–200 V bias rails without breakdown risk |
| Reverse Current (IR) | <0.5 µA @ 200 V - Enables high isolation >60 dBc in receive-path attenuators |
| Series Resistance (RS) | 0.8–1.0 Ω @ 100 MHz/50 mA - Minimizes insertion loss in transmit-path switches |
| Carrier Lifetime (τ) | 2.5–3.5 µs - Ensures fast RF switching speed with low intermodulation distortion |
| I-Region Width | 100 µm - Optimized for trade-off between breakdown voltage and RF response time |
| Max Power Dissipation | 7.5 W @ 25 °C stud temp (Package D) - Requires heatsink design per thermal impedance curve |
| Operating Temp Range | −65 °C to +175 °C - Validated for under-hood military and MRI cryo-coil proximity use |
Pinout & Package
UM7502F is supplied in Style "D" package: hermetically sealed, fused-in-glass, stud-mounted metal case with anode and cathode terminals on opposite sides of the cylindrical body. Thermal path is optimized through the stud interface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Stud) | Positive DC bias terminal / RF signal input | Directly mounted to heatsink; carries full RF current and DC forward bias |
| Cathode (Cap) | Negative DC return / RF signal output | Isolated cap terminal enables coaxial RF routing with minimal parasitic inductance |
Key Features
| Feature | Design Value |
|---|---|
| Fully passivated PIN chip | Eliminates surface contamination-induced leakage drift during long-term MRI system operation |
| Hermetic fused-in-glass construction | Prevents moisture ingress and parameter shift in sterilized medical enclosures |
| Metallurgically bonded, thermally matched design | Reduces thermal stress cycling failure in pulsed radar applications (MIL-STD-750 HTRB qualified) |
| Low harmonic distortion (≥60 dBc reverse bias) | Meets spectral purity requirements for MRI RF excitation waveforms |
| Compatible with automatic insertion equipment | Enables high-yield SMT-compatible assembly of multi-diode RF front-end modules |
Applications
| MRI Gradient Amplifier Switching | CAT Scan RF Attenuation |
|---|---|
Use Scenario: High-speed switching of RF pulses in MRI gradient coil drivers operating at 100–300 kHz with 200 V peak bias. IC Role / Device Role / Timing Role: RF power switch controlling pulse polarity and amplitude in gradient waveform synthesis. Use Value: Low RS (0.8–1.0 Ω) minimizes pulse edge distortion; <0.5 µA IR ensures baseline stability over 10,000+ pulse cycles. | Use Scenario: Precision RF attenuation in CT scanner X-ray tube control circuits requiring 0–200 V variable bias. IC Role / Device Role / Timing Role: Voltage-controlled RF attenuator element in feedback-controlled beam modulation paths. Use Value: Stable RP (>100 kΩ @ 100 V) enables repeatable 40–60 dB attenuation range; 100 µm I-region ensures linearity across 100 MHz bandwidth. |
| Military Radar T/R Module | High-Power RF Test Fixture |
Use Scenario: Transmit/receive switching in airborne radar front-ends exposed to −55 °C to +125 °C ambient with 1 kW peak RF. IC Role / Device Role / Timing Role: High-isolation SPDT switch isolating LNA input during high-power transmit bursts. Use Value: 200 V rating provides 2× safety margin vs. 100 V bias rails; MIL-STD-750 qualification confirms reliability under thermal shock and HTRB stress. | Use Scenario: Calibration-grade RF load switching in automated test equipment for 5G base station PA validation. IC Role / Device Role / Timing Role: Precision reference switch enabling traceable S-parameter measurements up to 1 GHz. Use Value: Low CT (0.8–1.0 pF) and stable RS ensure <±0.1 dB measurement repeatability; fused-glass package prevents parameter drift during 72-hour burn-in. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power PIN diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MACOM MADP-000907 | Surface-mount SOIC-8; 200 V rating; RS = 1.2 Ω; IR = 1.0 µA max | Designed for PCB-level integration in compact phased-array modules, not stud-mount chassis systems | Select when board space is constrained and thermal management uses copper pour-not stud heatsinking |
| Infineon BAR63-03W | SOD-323 package; 50 V rating; RS = 1.5 Ω; IR = 100 nA | Optimized for low-power cellular front-end switching, not high-voltage MRI or radar | Select only for sub-50 V, <1 W RF applications where size and cost outweigh voltage headroom needs |
Compared with MADP-000907 and BAR63-03W, UM7502F uniquely supports 200 V bias with stud-mount thermal reliability and <0.5 µA leakage-making it irreplaceable in MRI gradient drivers and MIL-qualified T/R modules where voltage margin and long-term parametric stability are non-negotiable.
Availability
UM7502F is available at Aetrix Electronics and suitable for MRI gradient amplifier switching, CAT scan RF attenuation, and military radar T/R module design requiring stable component supply across extended production lifecycles.
Supply support for UM7502F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog and RF components for aerospace, defense, and medical markets.
The UM7500 series was developed specifically for high-power RF switching and attenuation in mission-critical imaging and radar systems where hermeticity, voltage margin, and thermal robustness are essential-exemplified by UM7502F's 200 V rating and MIL-STD-750 qualification.
FAQ
What is the maximum continuous power dissipation for UM7502F?
The UM7502F has a maximum continuous power dissipation of 7.5 W when mounted on a heatsink at 25 °C stud temperature (Package D). Derating is required above 25 °C per the typical thermal impedance curve on page 4 of the datasheet, reaching 0 W at 175 °C junction temperature.
Does UM7502F meet RoHS compliance requirements?
UM7502F itself is not RoHS-compliant due to its lead-containing glass seal and solder materials. For RoHS-compliant alternatives, Microsemi offers the UMX7502B variant-identical electrical specs but with lead-free packaging and processing validated per JEDEC J-STD-020.
What is the typical harmonic distortion performance of UM7502F at 100 MHz?
UM7502F achieves ≥60 dBc reverse-bias harmonic distortion and ≥80 dBc forward-bias harmonic distortion at 100 MHz, 30 W RF power, and 50 mA forward bias-key for MRI RF excitation fidelity and radar spectral cleanliness.
Can UM7502F be used in surface-mount applications?
No-UM7502F is packaged in Style "D", a stud-mounted, hermetic fused-in-glass metal can. For surface-mount equivalents, consider the UM7502SM (Style "SM") variant, which shares identical electrical specs but uses a ceramic SMD footprint compatible with reflow assembly.
How does UM7502F differ from UM7501F and UM7504F?
UM7502F is rated for 200 V reverse voltage, positioned between UM7501F (100 V) and UM7504F (400 V). All share identical construction, leakage (<0.5 µA), RS (0.8–1.0 Ω), and thermal specs-but voltage rating determines safe operating area in pulsed RF bias networks.
UM7502F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Diode Type:
- PIN - Single
- Voltage - Peak Reverse (Max):
- 200V
- Current - Max:
- -
- Capacitance @ Vr, F:
- 1pF @ 100V, 1MHz
- Resistance @ If, F:
- 1Ohm @ 50mA, 100MHz
- Power Dissipation (Max):
- 10 W
- Operating Temperature:
- -65°C ~ 175°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- -
UM7502F FAQ
1.How can I place an order for UM7502F through Aetrix?
Please submit a Request for Quotation (RFQ) for UM7502F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UM7502F reliable?
The price and inventory of UM7502F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UM7502F is usually 5 days.
3.What payment methods are accepted for UM7502F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UM7502F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UM7502F?
UM7502F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UM7502F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UM7502F?
For technical support, including UM7502F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UM7502F requirements.
6.How does Aetrix verify that UM7502F is sourced from the original manufacturer or authorized distributors?
All UM7502F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UM7502F meets industry standards.
7.What is the process for return or replacement of UM7502F?
All UM7502F units undergo pre-shipment inspection (PSI). If there is an issue with UM7502F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UM7502F part is unused and in its original packaging.
Return procedure for UM7502F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
UM7502F Tags
.jpg)
-
BAP70-02,115
NXP USA Inc.

-
SMP1321-040LF
Skyworks Solutions Inc.

-
NSVR351SDSA3T1G
onsemi

-
BAT6302VH6327XTSA1
Infineon Technologies

-
SMP1307-011LF
Skyworks Solutions Inc.

-
SMP1345-040LF
Skyworks Solutions Inc.

-
BAT1503WE6327HTSA1
Infineon Technologies

-
SMS7630-005LF
Skyworks Solutions Inc.

-
SMP1322-040LF
Skyworks Solutions Inc.

-
SMS7621-040LF
Skyworks Solutions Inc.

-
SMS7621-079LF
Skyworks Solutions Inc.

-
SMS7630-040LF
Skyworks Solutions Inc.
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

