My Inquiry
My Account
STMicroelectronics USBLC6-2P6
- Part No.:
- USBLC6-2P6
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- SOT-563, SOT-666
- Datasheet:
-
USBLC6-2P6.pdf
- Description:
- TVS DIODE 5.25VWM 17VC SOT666
- Quantity:
- Payment:
- Shipping:
Inventory:48,877
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
USBLC6-2P6 from STMicroelectronics is a monolithic ESD protection device for high-speed USB 2.0 data lines (D+ and D−) and VBUS, featuring 3.5 pF max I/O-to-GND capacitance, 150 nA max leakage current at 5.25 V, and IEC 61000-4-2 Level 4 compliance (±15 kV air, ±8 kV contact). It uses SOT-666 packaging (1.5 × 1.7 mm, 0.45 mm height) and enables robust protection in space-constrained portable electronics.
For engineers reviewing the USBLC6-2P6 datasheet, USBLC6-2P6 pinout, USBLC6-2P6 application, or USBLC6-2P6 equivalent, key selection criteria include low inter-line capacitance matching (ΔCI/O–GND = 0.015 pF), clamping voltage of 12 V at 1 A (8/20 μs), VBUS protection up to 6 V breakdown, and compatibility with 480 Mb/s USB 2.0 high-speed signaling integrity.
Technical Context
The USBLC6-2P6 implements a rail-to-rail topology with integrated Transil™ and low-capacitance diodes to clamp both positive and negative ESD transients on D+, D−, and VBUS simultaneously. Its dual-path structure ensures symmetrical clamping: VCL+ = VBR + VF and VCL− = −VF, where VBR = 6 V (min) and VF = 1.1 V (typ) at 10 mA.
Designed specifically for high-speed interfaces, it maintains signal fidelity via ultra-low differential capacitance (1.2–1.7 pF I/O-to-I/O) and tight capacitance matching (±0.015 pF I/O-to-GND), meeting USB 2.0 eye diagram and jitter requirements up to 480 Mb/s while attenuating >−55 dB crosstalk up to 1 GHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | IEC 61000-4-2 Level 4: ±15 kV air, ±8 kV contact - guarantees system-level immunity without external shielding |
| I/O-to-GND Capacitance | 2.5–3.5 pF @ 1.65 V - preserves USB 2.0 signal rise/fall times and minimizes bit error rate |
| Capacitance Matching Tolerance | ±0.015 pF I/O-to-GND - ensures D+/D− skew < 0.5 ps for high-speed eye compliance |
| Leakage Current | 10–150 nA @ 5.25 V - extends battery life in USB-powered portable devices |
| Clamping Voltage | 12 V @ 1 A (8/20 μs), 17 V @ 5 A - limits transient overvoltage seen by downstream PHY ICs |
| Breakdown Voltage (VBUS–GND) | 6 V min @ 1 mA - protects 5 V USB power rail against overvoltage events |
| Package | SOT-666 (1.5 × 1.7 × 0.45 mm) - occupies only 2.9 mm² PCB area, ideal for ultra-compact designs |
Pinout & Package
SOT-666 package: 6-pin, 1.5 mm × 1.7 mm body, 0.45 mm nominal height, gull-wing leads, RoHS-compliant ECOPACK®2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O1 (D+) | Protected high-speed data line input/output; bidirectional ESD path to GND and VBUS |
| 2 | GND | Low-inductance ground reference for clamping diodes; must connect directly to PCB ground plane |
| 3 | VBUS | Protected 5 V supply line; integrates Transil diode to GND for overvoltage clamping |
| 4 | VBUS | Redundant VBUS terminal - electrically tied internally; improves current sharing during surge |
| 5 | I/O2 (D−) | Protected high-speed data line input/output; matched capacitance and timing to Pin 1 |
| 6 | GND | Second ground terminal - reduces loop inductance; requires separate short trace to ground plane |
Key Features
| Feature | Design Value |
|---|---|
| Dual-line USB 2.0 protection | Simultaneous ESD suppression on D+ and D− with matched electrical characteristics |
| VBUS line protection | Integrated 6 V breakdown Transil diode between VBUS and GND prevents overvoltage damage to host power circuitry |
| Ultra-low capacitance matching | ΔCI/O–GND ≤ 0.015 pF ensures sub-picosecond D+/D− skew critical for 480 Mb/s eye opening |
| Rail-to-rail clamping architecture | Independent positive/negative clamping paths eliminate signal inversion and preserve DC bias |
| Monolithic silicon integration | Single-die construction eliminates bond wire inductance and inter-device mismatch common in discrete arrays |
Applications
| USB 2.0 High-Speed Port | Ethernet 10/100 Base-TX |
|---|---|
Use Scenario: Front-panel USB port on industrial HMI with exposed connector subject to frequent ESD events. IC Role / Device Role / Timing Role: Primary ESD shunt placed <2 mm from USB connector, clamping transients before they reach USB transceiver PHY. Use Value: Enables reliable 480 Mb/s operation without signal degradation or link drops under ±15 kV air discharge stress. | Use Scenario: Ethernet PHY interface in networked medical sensor node requiring FCC Class B emissions compliance. IC Role / Device Role / Timing Role: Common-mode ESD suppressor on TX+/TX− pairs, referenced to local ground and isolated from chassis ground. Use Value: Maintains 100 Mbps signal integrity while suppressing fast-rising ESD pulses that would otherwise corrupt auto-negotiation handshake. |
| SIM Card Slot Protection | Portable Video Interface |
Use Scenario: Hot-pluggable SIM tray in LTE-enabled handheld scanner subjected to user-hand ESD. IC Role / Device Role / Timing Role: Bidirectional I/O protector on SIM CLK, I/O, and RST lines, operating at ≤10 MHz with low leakage. Use Value: Prevents SIM card initialization failure after repeated ±8 kV contact discharges, extending field reliability. | Use Scenario: MIPI D-PHY video link between camera module and SoC in compact action cam. IC Role / Device Role / Timing Role: Low-capacitance ESD guard on high-speed differential video lanes (up to 1.5 Gbps aggregate). Use Value: Eliminates pixel corruption and frame drop caused by ESD-induced common-mode noise on video differential pairs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed data line ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| USBLC6-2SC6 | SOT23-6L package (2.8 × 2.9 mm); 9 mm² footprint; identical electrical specs and pinout mapping | Better thermal dissipation for sustained surge duty; preferred when board layout allows larger footprint | Select when PCB real estate permits and higher surge energy handling is required beyond single-event ESD. |
| TPD2EUSB30DRYR | 0.65 pF lower typical I/O–GND capacitance (2.85 pF); 3-pin WCSP; no VBUS protection path | Requires external VBUS TVS; optimized for ultra-low-jitter USB 3.0 Gen 1 (5 Gbps) but not rated for VBUS | Choose only if VBUS protection is handled separately and sub-3 pF capacitance is mandatory for signal integrity margin. |
Compared with USBLC6-2SC6, the USBLC6-2P6 saves >67% PCB area while maintaining identical clamping performance and USB 2.0 compliance; versus TPD2EUSB30DRYR, it provides integrated VBUS protection and tighter capacitance matching at the cost of slightly higher CI/O–GND, making it more suitable for cost-sensitive, space-constrained USB 2.0 implementations.
Availability
USBLC6-2P6 is available at Aetrix Electronics and suitable for USB 2.0 ports, Ethernet 10/100 interfaces, and SIM card slots requiring stable component supply across automotive infotainment, industrial HMIs, and portable medical devices.
Supply support for USBLC6-2P6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and protection devices for industrial, automotive, and consumer markets.
The USBLC6-2 series belongs to ST's dedicated ESD protection product line, engineered specifically for high-speed digital interfaces where signal integrity, minimal board area, and system-level ESD immunity are co-primary design constraints.
FAQ
What is the maximum recommended PCB trace length between USBLC6-2P6 and the USB connector?
The datasheet specifies that I/O and GND traces must be as short as possible to minimize parasitic inductance. For full IEC 61000-4-2 Level 4 immunity, ST recommends ≤2 mm from each I/O pin to the connector pad and ≤3 mm from GND pins to the nearest solid ground plane via. Longer traces increase clamping voltage overshoot due to L·di/dt effects, risking PHY damage.
Does USBLC6-2P6 require external decoupling capacitors on VBUS?
No external capacitor is required for basic ESD protection functionality. However, ST recommends placing a 100 nF ceramic capacitor between VBUS and GND near the device to improve high-frequency surge energy absorption and stabilize local supply during transient events. This capacitor does not affect ESD clamping speed but enhances system-level robustness.
Can USBLC6-2P6 be used to protect USB 3.0 SuperSpeed differential pairs?
No. USBLC6-2P6 is characterized and qualified only for USB 2.0 (480 Mb/s) and lower-speed interfaces. Its 3.5 pF max I/O–GND capacitance exceeds the <1.1 pF typical requirement for USB 3.0 Gen 1 (5 Gbps) eye diagram compliance. Using it on SS Tx/Rx lines would cause excessive signal attenuation and jitter, leading to link training failure.
How does the dual-GND pin configuration improve ESD performance?
The two dedicated GND pins (Pins 2 and 6) reduce total ground path inductance by providing parallel return paths for surge current. This lowers the effective L·di/dt voltage overshoot during fast ESD events. Layout guidelines require both pins to connect independently to the ground plane using short, wide traces - not daisy-chained - to achieve the specified ±15 kV air discharge immunity.
USBLC6-2P6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- SOT-563, SOT-666
- Series:
- USB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.25V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 17V
- Current - Peak Pulse (10/1000µs):
- 5A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- USB
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-666
USBLC6-2P6 FAQ
1.How can I place an order for USBLC6-2P6 through Aetrix?
Please submit a Request for Quotation (RFQ) for USBLC6-2P6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for USBLC6-2P6 reliable?
The price and inventory of USBLC6-2P6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for USBLC6-2P6 is usually 5 days.
3.What payment methods are accepted for USBLC6-2P6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for USBLC6-2P6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for USBLC6-2P6?
USBLC6-2P6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your USBLC6-2P6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for USBLC6-2P6?
For technical support, including USBLC6-2P6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your USBLC6-2P6 requirements.
6.How does Aetrix verify that USBLC6-2P6 is sourced from the original manufacturer or authorized distributors?
All USBLC6-2P6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that USBLC6-2P6 meets industry standards.
7.What is the process for return or replacement of USBLC6-2P6?
All USBLC6-2P6 units undergo pre-shipment inspection (PSI). If there is an issue with USBLC6-2P6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The USBLC6-2P6 part is unused and in its original packaging.
Return procedure for USBLC6-2P6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
USBLC6-2P6 Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
