STMicroelectronics USBULC1606-4M8
- Part No.:
- USBULC1606-4M8
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 8-UFQFN Exposed Pad
- Datasheet:
-
USBULC1606-4M8.pdf
- Description:
- TVS DIODE 28VC 8-UQFN
- Quantity:
- Payment:

- Shipping:

Inventory:4,376
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
USBULC1606-4M8 from STMicroelectronics is an ultra-low-capacitance ESD protection diode array for enhanced Mini USB interfaces, featuring 0.5 pF capacitance on D+/D−/ID lines, 6.8 V low-voltage clamping, 14.6 V high-voltage VBUS protection, and 5 GHz bandwidth. It is designed for space-constrained portable USB peripherals requiring IEC 61000-4-2 Level 4 ESD immunity (±15 kV air, ±8 kV contact).
For engineers reviewing the USBULC1606-4M8 datasheet, USBULC1606-4M8 pinout, USBULC1606-4M8 application, or USBULC1606-4M8 equivalent, key selection criteria include sub-1 pF signal-line capacitance, dual-voltage diode topology (6.8 V LV / 14.6 V HV), micro QFN-8L footprint (1.7 × 1.35 mm), clamping voltage under 10 V at 1 A for data lines, and CEA-936-A compliance for USB interface integrity.
Technical Context
The device integrates three low-voltage (6.8 V) ESD channels (CH1–CH3) for D+, D−, and ID lines, plus one high-voltage (14.6 V) channel (Pin 4/VCC) for VBUS protection, all referenced to VN (Pin 5). Its diode array architecture enables independent clamping paths without shared current paths between data and power lines.
Capacitance is optimized per line: 0.5 pF (typ.) at 240 MHz on LV pins, 10 pF on HV pin; dynamic resistance is 1.5 Ω (LV) and 2.8 Ω (HV) at 1 A pulse; it achieves -3 dB attenuation up to 5 GHz on high-speed differential pairs while maintaining <10 V positive/negative clamping on LV lines at 1 A (8/20 µs).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacitance (LV pins) | 0.5 pF typ. at 240 MHz - preserves USB 2.0 signal integrity up to 480 Mbps |
| Clamping Voltage (LV, +1A) | 10 V max - limits transient overvoltage on D+/D−/ID during ESD events |
| Clamping Voltage (HV, +2.5A) | 28 V max - protects VBUS against high-energy surges without crowbar failure |
| ESD Rating | ±15 kV air / ±8 kV contact (IEC 61000-4-2 Level 4) - meets industrial handheld robustness |
| Bandwidth | 5 GHz (-3 dB) - supports full USB 2.0 eye diagram fidelity with minimal jitter |
| Package | Micro QFN-8L (1.7 × 1.35 × 0.5 mm) - enables <2.3 mm² PCB footprint for miniaturized USB connectors |
| Leakage Current (LV) | 0.1 µA max at 3.3 V - avoids signal loading or battery drain in always-on ports |
Pinout & Package
USBULC1606-4M8 uses a lead-free micro QFN-8L package (1.7 mm × 1.35 mm × 0.5 mm) with exposed thermal pad (EP) for grounding. Pin 1 index area is marked on top surface; EP must be soldered to PCB ground plane for optimal ESD performance and thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (CH1) | LV ESD channel I/O | Connects to Mini USB D+ line; provides 6.8 V clamping and 0.5 pF loading |
| 2 (CH2) | LV ESD channel I/O | Connects to Mini USB D− line; matched capacitance and clamping to CH1 |
| 3 (CH3) | LV ESD channel I/O | Connects to Mini USB ID line; same LV protection characteristics as CH1/CH2 |
| 4 (VCC) | HV ESD channel anode | Connects to VBUS; handles 14.6 V breakdown and 2.5 A peak pulse current |
| 5 (VN) | Common cathode reference | Ground return for all diodes; must be low-inductance connection to system GND |
| 6–8 (NC) | No connect | Unbonded die pads; no internal connection - leave unconnected on PCB |
| EP | Thermal & ESD ground | Exposed pad tied to VN internally; requires solid solder mask-defined GND pour |
Key Features
| Feature | Design Value |
|---|---|
| Dual-voltage diode array | Separate 6.8 V LV (D+/D−/ID) and 14.6 V HV (VBUS) clamping paths prevent cross-talk and ensure optimal protection per line function |
| 0.5 pF LV capacitance | Minimizes insertion loss and reflection on USB 2.0 differential pairs, preserving eye opening at 480 Mbps |
| CEA-936-A compliance | Validated for USB peripheral ESD robustness in consumer electronics, including cellular accessories and video equipment |
| Micro QFN-8L footprint | 1.7 × 1.35 mm body with 0.4 mm pitch enables placement adjacent to Mini USB receptacle without routing detours |
Applications
| Mobile Phone Accessories | Mini USB Printers |
|---|---|
Use Scenario: ESD protection for detachable USB cables and docking cradles in cellular handsets. IC Role / Device Role / Timing Role: Discrete ESD suppressor on D+/D−/ID/VBUS lines of Mini USB Type AB receptacle. Use Value: Maintains 480 Mbps data throughput while surviving repeated ±15 kV air discharge events typical in pocket environments. | Use Scenario: Protection of host-side Mini USB ports in compact thermal printers. IC Role / Device Role / Timing Role: Front-end ESD guard for USB 2.0 transceiver ICs interfacing with Mini USB connectors. Use Value: Prevents latch-up or damage to PHY ICs during cable hot-plug in office environments with high static potential. |
| Portable Video Equipment | Industrial Handheld Scanners |
Use Scenario: Securing Mini USB video output on camcorders and action cameras. IC Role / Device Role / Timing Role: Signal-line protector ensuring HDMI-USB hybrid cable compatibility and signal fidelity. Use Value: 5 GHz bandwidth preserves edge rate of high-speed video sync signals without distortion or jitter accumulation. | Use Scenario: Ruggedized Mini USB programming/debug port on warehouse barcode scanners. IC Role / Device Role / Timing Role: Transient suppressor for field-service USB interfaces exposed to frequent handling and dry-air conditions. Use Value: Delivers IEC 61000-4-2 Level 4 immunity without increasing PCB area beyond 2.3 mm² - critical for sealed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | 0.8 pF LV capacitance; single-channel dual-diode; no HV VBUS channel | Lacks dedicated VBUS protection - requires external TVS for power line | Choose when only D+/D− protection is needed and board space allows separate VBUS solution |
| ESD7L5.0ST5G | Single-line 5.0 V clamping; 0.45 pF capacitance; SOD-523 package | Discrete per-line layout increases footprint vs. integrated 4-line array | Prefer for ultra-low-capacitance priority on one line only; not suitable for full Mini USB interface integration |
Compared with TPD2E001DRYR and ESD7L5.0ST5G, USBULC1606-4M8 uniquely integrates four coordinated ESD channels-including dedicated 14.6 V VBUS protection-in a single 1.7 × 1.35 mm package, enabling complete Mini USB interface hardening with minimal layout overhead and guaranteed signal integrity at 480 Mbps.
Availability
USBULC1606-4M8 is available at Aetrix Electronics and suitable for mobile phone accessories, portable video equipment, industrial handheld scanners, and Mini USB printers requiring stable component supply across extended production lifecycles.
Supply support for USBULC1606-4M8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering intelligent power, sensing, and connectivity solutions for automotive, industrial, and consumer markets.
USBULC1606-4M8 belongs to ST's USB ESD Protection portfolio, engineered specifically for high-speed interface integrity in space-constrained portable electronics where sub-1 pF capacitance and multi-line coordination are mandatory.
FAQ
What is the maximum operating temperature range for USBULC1606-4M8?
The device operates reliably from -30 °C to +85 °C ambient temperature. Its junction temperature must not exceed 125 °C under surge conditions, and storage temperature range extends from -55 °C to +150 °C. Thermal performance depends on proper EP grounding and PCB copper area per ST's recommended footprint.
Can USBULC1606-4M8 protect USB 3.0 interfaces?
No - USBULC1606-4M8 is specified for USB 2.0 (480 Mbps) with 5 GHz bandwidth and 0.5 pF capacitance. USB 3.0 SuperSpeed lanes require lower capacitance (<0.2 pF), higher bandwidth (>5 GHz), and differential pair-specific protection not provided by this single-ended 4-channel array.
How should the exposed pad (EP) be connected on the PCB?
The exposed pad must be soldered to a dedicated, low-inductance PCB ground plane using ≥50% stencil opening ratio. It is internally connected to VN (Pin 5) and serves as both thermal relief and ESD current return path; floating or poorly grounded EP degrades clamping performance and risks thermal runaway during high-energy transients.
Is USBULC1606-4M8 compliant with RoHS and REACH?
Yes - it is a lead-free device meeting RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. The package uses ECOPACK®-compliant materials, and the epoxy meets UL94 V0 flammability rating. Full compliance documentation is available in ST's ECOPACK® database at www.st.com.
USBULC1606-4M8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 8-UFQFN Exposed Pad
- Series:
- USB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 3
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- 28V
- Current - Peak Pulse (10/1000µs):
- 2.5A (8/20µs)
- Power - Peak Pulse:
- 70W
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -30°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-UQFN (1.7x1.35)
USBULC1606-4M8 FAQ
1.How can I place an order for USBULC1606-4M8 through Aetrix?
Please submit a Request for Quotation (RFQ) for USBULC1606-4M8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for USBULC1606-4M8 reliable?
The price and inventory of USBULC1606-4M8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for USBULC1606-4M8 is usually 5 days.
3.What payment methods are accepted for USBULC1606-4M8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for USBULC1606-4M8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for USBULC1606-4M8?
USBULC1606-4M8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your USBULC1606-4M8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for USBULC1606-4M8?
For technical support, including USBULC1606-4M8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your USBULC1606-4M8 requirements.
6.How does Aetrix verify that USBULC1606-4M8 is sourced from the original manufacturer or authorized distributors?
All USBULC1606-4M8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that USBULC1606-4M8 meets industry standards.
7.What is the process for return or replacement of USBULC1606-4M8?
All USBULC1606-4M8 units undergo pre-shipment inspection (PSI). If there is an issue with USBULC1606-4M8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The USBULC1606-4M8 part is unused and in its original packaging.
Return procedure for USBULC1606-4M8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
USBULC1606-4M8 Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

.jpg)