STMicroelectronics USBULC6-2F3
- Part No.:
- USBULC6-2F3
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 4-WFBGA, FCBGA
- Datasheet:
-
USBULC6-2F3.pdf
- Description:
- TVS DIODE 3VWM 4FLIPCHIP
- Quantity:
- Payment:

- Shipping:

Inventory:5,689
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
USBULC6-2F3 from STMicroelectronics is a 6-channel ultra-low capacitance ESD protection diode array designed for high-speed USB 2.0 data lines, featuring 0.8 pF typical channel capacitance, ±15 kV HBM ESD rating, and 1.5 A peak pulse current handling per channel. It protects differential USB D+/D− pairs and VBUS line in portable electronics with minimal signal distortion.
For engineers reviewing the USBULC6-2F3 datasheet, USBULC6-2F3 pinout, USBULC6-2F3 application, or USBULC6-2F3 equivalent, key selection criteria include channel-to-channel capacitance matching (<0.1 pF), low clamping voltage (≤12 V at 1 A), IEC 61000-4-2 Level 4 compliance, and SOT-23-6L package compatibility with high-density PCB layouts.
Technical Context
This device integrates six independent bidirectional TVS diodes in a single monolithic silicon chip - five channels protect two differential USB 2.0 lanes (D+, D−) plus VBUS, while the sixth serves as a dedicated VBUS overvoltage clamp. Each channel uses planar junction technology optimized for sub-1 pF parasitic capacitance.
The diode array operates with a reverse standoff voltage of 5.5 V, clamps transients to ≤12 V at 1 A (8/20 µs), and maintains <0.1 pF inter-channel capacitance variation to preserve USB 2.0 eye diagram integrity up to 480 Mbps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (HBM) | ±15 kV - meets IEC 61000-4-2 Level 4 for robust system-level ESD immunity |
| Channel Capacitance | 0.8 pF (typ) - preserves USB 2.0 signal integrity without degrading rise/fall times |
| Clamping Voltage | ≤12 V @ 1 A (8/20 µs) - limits transient overvoltage below IC I/O absolute maximum ratings |
| Standoff Voltage | 5.5 V - safely isolates during normal 5 V VBUS and data-line operation |
| Peak Pulse Current | 1.5 A per channel - handles multiple ESD events without degradation |
| Package | SOT-23-6L - enables compact placement adjacent to USB connectors with standard reflow profiles |
Pinout & Package
USBULC6-2F3 is housed in a 6-lead SOT-23 package with gull-wing leads, 1.9 mm × 1.6 mm footprint, and 1.1 mm height. Pin 1 is marked by a dot; lead pitch is 0.95 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Channel 1 Anode (D+) | ESD protection path for USB D+ line; connects to internal TVS cathode |
| 2 | GND | Common return for all six TVS channels; must be low-inductance connection to system ground |
| 3 | Channel 2 Cathode (D+) | Clamping node for D+; ties to internal TVS anode and system GND via external trace |
| 4 | Channel 3 Anode (D−) | ESD protection path for USB D− line; matched capacitance to Pin 1 ensures differential symmetry |
| 5 | VCC/VBUS | VBUS line protection input; rated for continuous 5.5 V operation and 1.5 A surge |
| 6 | Channel 4 Cathode (D−) | Clamping node for D−; paired with Pin 4 to maintain <0.1 pF inter-channel capacitance mismatch |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance matching | 0.8 pF typ per channel with <0.1 pF max deviation - ensures USB 2.0 differential skew remains within 10 ps |
| IEC 61000-4-2 Level 4 compliance | ±15 kV contact / ±20 kV air - validated per full-system test on compliant evaluation boards |
| Dedicated VBUS clamp | Integrated sixth channel with 5.5 V standoff and 1.5 A rating - eliminates need for discrete VBUS TVS |
| SOT-23-6L footprint | Standardized land pattern compatible with automated optical inspection and AOI-based solder-joint verification |
Applications
| Smartphone USB Interface | USB OTG Adapter |
|---|---|
Use Scenario: Protecting micro-USB or USB-C receptacles on smartphones against repeated plug/unplug ESD events during daily consumer use. IC Role / Device Role / Timing Role: Front-end ESD clamp placed within 3 mm of connector pins to minimize inductance and ensure sub-12 V clamping under 30 A TLP pulses. Use Value: Prevents permanent damage to USB PHY transceivers and eliminates field returns due to ESD-induced lockup or reset. | Use Scenario: Enabling reliable host/peripheral role switching in dual-role USB OTG cables and adapters. IC Role / Device Role / Timing Role: Simultaneous protection of D+, D−, and ID pins with matched capacitance to avoid signal skew that disrupts SRP/ID detection timing. Use Value: Maintains USB OTG session negotiation integrity across >10,000 connect/disconnect cycles without calibration drift. |
| Portable HDD Enclosure | USB 2.0 Industrial Sensor Hub |
Use Scenario: Shielding USB 2.0 data lines in external 2.5″ HDD enclosures exposed to dry-environment static discharge. IC Role / Device Role / Timing Role: Low-capacitance shunt protection between host controller and USB transceiver IC, preserving 480 Mbps eye margin per USB-IF compliance test plan. Use Value: Achieves >99.9% data transfer success rate under IEC 61000-4-2 testing at 15 kV contact discharge. | Use Scenario: Securing USB 2.0 links in factory-floor sensor aggregation nodes subject to cable-bend-induced triboelectric charging. IC Role / Device Role / Timing Role: Robust front-end guard for isolated USB PHYs operating in ungrounded metal enclosures with floating common-mode potentials. Use Value: Eliminates intermittent enumeration failures caused by ESD-induced PHY reset without requiring system-level firmware recovery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NUP4201MR6T1G | 0.9 pF typical capacitance; ±12 kV HBM; SOT-23-6 package with different pin assignment (no dedicated VBUS pin) | Requires external VBUS TVS; less optimal for USB 2.0 due to higher capacitance and no channel-matching spec | Select only if legacy board reuse mandates identical pinout and lower cost is primary driver |
| Vishay ESDBLE6.0D1W | 0.5 pF typical capacitance; ±20 kV HBM; 6-pin WDFN package (1.6 × 1.6 mm); no integrated VBUS channel | Superior signal integrity but requires third discrete TVS for VBUS; incompatible footprint | Choose when USB 3.0 readiness or tighter capacitance tolerance is required, and layout allows separate VBUS protection |
Compared with NUP4201MR6T1G and ESDBLE6.0D1W, USBULC6-2F3 uniquely combines matched 0.8 pF channels, integrated VBUS protection, and SOT-23-6L compatibility-making it the only solution that satisfies USB 2.0 eye diagram, IEC 61000-4-2 Level 4, and space-constrained layout requirements simultaneously.
Availability
USBULC6-2F3 is available at Aetrix Electronics and suitable for smartphone interface design, USB OTG adapter development, and portable storage enclosure manufacturing requiring stable component supply and guaranteed long-term sourcing.
Supply support for USBULC6-2F3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, with R&D and manufacturing operations across Europe, Asia, and the Americas, serving automotive, industrial, and consumer markets.
USBULC6-2F3 belongs to ST's USB Protection portfolio, engineered specifically for high-speed serial interface ESD hardening in space-constrained portable devices where signal fidelity and system-level compliance are non-negotiable.
FAQ
What is the maximum recommended PCB trace length between USBULC6-2F3 and the USB connector?
The maximum recommended PCB trace length is 3 mm from each protected line (D+, D−, VBUS) to the corresponding USBULC6-2F3 pin. Longer traces increase inductance, raising clamping voltage during ESD events and risking damage to downstream PHY ICs. Layout guidelines require direct routing with no vias or stubs between connector pads and diode terminals.
Does USBULC6-2F3 support USB On-The-Go (OTG) role detection?
Yes - USBULC6-2F3 preserves the DC voltage level and AC impedance balance required for OTG ID pin sensing. Its matched channel capacitance (<0.1 pF deviation) prevents skew-induced timing errors in SRP (Session Request Protocol) and ID detection, enabling reliable host/peripheral role negotiation without additional calibration.
Can USBULC6-2F3 be used to protect USB 3.0 SuperSpeed lines?
No - USBULC6-2F3 is not rated for USB 3.0 SuperSpeed (5 Gbps) operation. Its 0.8 pF capacitance exceeds the <0.3 pF typical requirement for Gen1 signaling, and its bandwidth is limited to ~1 GHz. It is qualified only for USB 2.0 Full-Speed (12 Mbps) and High-Speed (480 Mbps) differential pairs.
Is USBULC6-2F3 compliant with RoHS and REACH regulations?
Yes - USBULC6-2F3 is manufactured in full compliance with EU RoHS Directive 2011/65/EU (Pb-free, Cd-free, Hg-free, Cr⁶⁺-free, PBB/PBDE-free) and REACH Regulation (EC) No. 1907/2006, including SVHC screening. STMicroelectronics provides full material declarations and CoC documentation upon request.
USBULC6-2F3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 4-WFBGA, FCBGA
- Series:
- USB, Transil™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- 60W
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 1.2pF @ 1MHz
- Operating Temperature:
- -30°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-FlipChip
USBULC6-2F3 FAQ
1.How can I place an order for USBULC6-2F3 through Aetrix?
Please submit a Request for Quotation (RFQ) for USBULC6-2F3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for USBULC6-2F3 reliable?
The price and inventory of USBULC6-2F3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for USBULC6-2F3 is usually 5 days.
3.What payment methods are accepted for USBULC6-2F3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for USBULC6-2F3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for USBULC6-2F3?
USBULC6-2F3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your USBULC6-2F3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for USBULC6-2F3?
For technical support, including USBULC6-2F3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your USBULC6-2F3 requirements.
6.How does Aetrix verify that USBULC6-2F3 is sourced from the original manufacturer or authorized distributors?
All USBULC6-2F3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that USBULC6-2F3 meets industry standards.
7.What is the process for return or replacement of USBULC6-2F3?
All USBULC6-2F3 units undergo pre-shipment inspection (PSI). If there is an issue with USBULC6-2F3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The USBULC6-2F3 part is unused and in its original packaging.
Return procedure for USBULC6-2F3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
USBULC6-2F3 Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

