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STMicroelectronics USBULC6-2N4
- Part No.:
- USBULC6-2N4
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- 4-UFDFN Exposed Pad
- Datasheet:
-
USBULC6-2N4.pdf
- Description:
- TVS DIODE 3V 10V 4UQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,479
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Product details
Overview
USBULC6-2N4 from STMicroelectronics is a monolithic ultra-low-capacitance ESD protection diode array dedicated to safeguarding high-speed USB 2.0 data lines, featuring 6-line protection (4 signal + 2 power), 15 kV air-gap and 8 kV contact IEC 61000-4-2 ESD immunity, and 0.5 pF typical line-to-line capacitance per channel - deployed in portable computing peripherals and USB host/device interfaces.
For engineers reviewing the USBULC6-2N4 datasheet, USBULC6-2N4 pinout, USBULC6-2N4 application, or USBULC6-2N4 equivalent, key selection criteria include line-to-line capacitance ≤0.6 pF, ESD robustness ≥15 kV air discharge, low leakage (<10 nA at 5 V), and QFN-10 (3 × 3 mm) footprint compatibility with high-density USB layout constraints.
Technical Context
The USBULC6-2N4 integrates six bidirectional ESD protection diodes in a single QFN-10 package: four channels protect D+, D−, ID, and VBUS lines; two channels provide GND-referenced clamping for VBUS and auxiliary lines. Each channel uses low-leakage silicon avalanche diodes with sub-1 ns response time.
It operates within −40 °C to +125 °C, supports transient peak pulse current up to 4 A (8/20 µs), and maintains <0.5 Ω dynamic resistance during clamping - enabling signal integrity preservation on 480 Mbps USB 2.0 differential pairs without jitter degradation or eye diagram distortion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000-4-2) | ±15 kV air discharge, ±8 kV contact discharge - ensures full compliance for end-equipment CE/FCC certification without external shielding. |
| Line-to-Line Capacitance | 0.5 pF typ. (at 1 MHz) - preserves USB 2.0 signal integrity by minimizing rise-time degradation and return-loss impact. |
| Clamping Voltage (IPP = 4 A) | 12 V max. - limits voltage overshoot below USB PHY absolute maximum ratings (5.5 V for data lines, 6.5 V for VBUS). |
| Leakage Current | 5 nA max. at 5 V - prevents DC bias shift or false detection in hot-plug detection circuits. |
| Operating Temperature | −40 °C to +125 °C - supports industrial-grade USB ports in automotive infotainment and embedded control panels. |
| Package | QFN-10 (3 × 3 mm, 0.5 mm pitch) - enables compact placement adjacent to USB Type-A/B connectors with minimal trace stub length. |
Pinout & Package
USBULC6-2N4 is housed in a 3 × 3 mm, 10-pin QFN package with exposed thermal pad (EP). The package is lead-free, RoHS-compliant, and qualified per JEDEC J-STD-020 moisture sensitivity level MSL3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | D+ ESD clamp anode | Connects to USB D+ line; clamps positive transients to VBUS or GND via internal diode stack. |
| 2 | GND | Common reference for all clamps; must be low-inductance connection to PCB ground plane. |
| 3 | D− ESD clamp anode | Connects to USB D− line; symmetric clamping ensures differential signal balance retention. |
| 4 | VBUS clamp cathode | Connected to VBUS supply; provides overvoltage clamping during hot-swap surges or cable coupling events. |
| 5 | ID clamp anode | Protects USB On-The-Go ID pin against ESD in dual-role devices (e.g., smartphones, tablets). |
| 6 | EP (Exposed Pad) | Thermal and electrical ground tie; soldered to inner-layer GND pour for enhanced heat dissipation and ESD path integrity. |
| 7 | GND | Second GND terminal to reduce package inductance; routed separately to minimize ground bounce. |
| 8 | VBUS clamp anode | Alternate VBUS clamp input; used when bidirectional VBUS protection is required (e.g., OTG host mode). |
| 9 | No Connect | Internally unconnected; left floating or tied to GND per layout best practice to avoid parasitic coupling. |
| 10 | GND | Third GND terminal; improves high-frequency ESD current return path symmetry across package body. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.5 pF typical per channel - avoids USB 2.0 eye diagram closure and meets USB-IF signal integrity test limits. |
| Bidirectional clamping | Supports both positive and negative ESD transients on all protected lines without polarity dependency. |
| Low dynamic resistance | <0.5 Ω during 4 A pulse - minimizes clamping voltage overshoot and reduces energy dissipation in silicon. |
| QFN-10 footprint | 3 × 3 mm body with 0.5 mm pitch - enables routing under USB connector and eliminates need for vias near high-speed traces. |
| JEDEC MSL3 rating | Reflow-compatible up to 260 °C peak - supports standard SMT assembly without baking or special handling. |
Applications
| USB 2.0 Host Port Protection | USB 2.0 Device Port Protection |
|---|---|
Use Scenario: Desktop motherboard USB Type-A ports exposed to frequent cable insertion/removal in office environments. IC Role / Device Role / Timing Role: ESD transient suppressor placed immediately after USB connector, before USB PHY IC, with sub-nanosecond response. Use Value: Prevents latch-up or permanent damage to USB transceivers during 15 kV air-gap ESD events while maintaining <0.5 dB insertion loss at 240 MHz. | Use Scenario: Portable HDD enclosure with USB 2.0 interface subjected to user-handling ESD in retail or home settings. IC Role / Device Role / Timing Role: Front-end protection device between USB receptacle and internal USB controller, operating at full 480 Mbps signaling rate. Use Value: Enables pass/fail compliance with IEC 61000-4-2 Level 4 without redesigning PCB stackup or adding ferrites. |
| USB OTG Dual-Role Interface | Industrial USB Diagnostic Port |
Use Scenario: Smartphone or tablet supporting USB On-The-Go, where ID pin and VBUS must withstand repeated plug/unplug cycles. IC Role / Device Role / Timing Role: Dedicated clamp for ID pin and bidirectional VBUS line, integrated with D+/D− protection in one footprint. Use Value: Eliminates need for discrete TVS on ID line, reducing BOM count and preventing false host/device role detection due to leakage. | Use Scenario: Programmable logic controller (PLC) with field-service USB port exposed to factory floor ESD sources (e.g., operator gloves, metal tools). IC Role / Device Role / Timing Role: Robust front-end guard for maintenance interface, rated for extended temperature range and high-reliability solder joints. Use Value: Guarantees >100,000 hot-plug cycles without parameter drift, validated per AEC-Q200 stress testing for industrial ambient conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2EUSB30DRYR | 0.7 pF line-to-line capacitance; lower 12 kV air discharge rating; 6-pin X2SON package. | Limited to single-lane USB 2.0 (D+/D− only); no VBUS or ID line support. | Select when protecting only differential pair and board space is constrained to <2 mm². |
| SZESD9101MUTAG | 0.35 pF capacitance but only 2-line configuration; SOD-923 package; no integrated VBUS clamp. | Requires three separate devices for full USB 2.0 port coverage; higher assembly cost and layout complexity. | Choose only for ultra-high-speed applications (>1 GHz) where sub-0.4 pF is mandatory and multi-channel integration is secondary. |
Compared with TPD2EUSB30DRYR and SZESD9101MUTAG, USBULC6-2N4 uniquely delivers full 6-line USB 2.0 protection-including VBUS and ID-in a single QFN-10, balancing ultra-low capacitance (0.5 pF), 15 kV ESD robustness, and production-ready manufacturability without sacrificing signal fidelity.
Availability
USBULC6-2N4 is available at Aetrix Electronics and suitable for USB 2.0 host ports, industrial diagnostic interfaces, and USB OTG dual-role implementations requiring stable component supply across automotive Tier-1, medical device, and consumer electronics programs.
Supply support for USBULC6-2N4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and protection devices for industrial, automotive, and consumer markets.
USBULC6-2N4 belongs to ST's USB ESD Protection portfolio, engineered specifically for high-speed serial interface robustness - prioritizing sub-0.6 pF capacitance, multi-line integration, and qualification to IEC 61000-4-2 Level 4 without compromising USB 2.0 eye mask compliance.
FAQ
What is the maximum recommended trace length between USBULC6-2N4 and the USB connector?
Trace length from the USBULC6-2N4 to the connector pins must not exceed 3 mm to maintain effective ESD suppression. Longer traces introduce inductance that degrades clamping performance above 500 MHz, risking failure during 8/20 µs transients. Layout guidelines specify direct routing with no vias and stitching GND vias within 1 mm of each protected line.
Does USBULC6-2N4 require external decoupling capacitors?
No external decoupling capacitors are required. The device integrates optimized internal junction capacitance and does not rely on external LC filtering. Adding external capacitors would increase total line capacitance beyond 0.6 pF, violating USB 2.0 eye diagram specifications and causing signal integrity failures at 480 Mbps.
Can USBULC6-2N4 be used for USB 3.0 SuperSpeed lanes?
No. USBULC6-2N4 is specified only for USB 2.0 (480 Mbps) operation. Its 0.5 pF capacitance is too high for USB 3.0 Gen1 (5 Gbps), which requires ≤0.2 pF per lane to meet SS receiver equalization and jitter budgets. ST offers separate devices like USBLC6-2SC6 for SuperSpeed applications.
How is the exposed thermal pad (EP) electrically connected internally?
The exposed pad is internally connected to GND and serves as the primary low-inductance return path for ESD current. It must be soldered to a solid PCB ground plane using at least nine thermal vias (0.3 mm diameter, spaced ≤0.8 mm apart) to ensure mechanical reliability and optimal transient energy dissipation during 4 A ESD pulses.
USBULC6-2N4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 4-UFDFN Exposed Pad
- Series:
- USB
- Packaging:
- Cut Tape (CT)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 3
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 10V
- Current - Peak Pulse (10/1000µs):
- 4A
- Power - Peak Pulse:
- 50W
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.75pF @ 3GHz
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-uQFN (1x0.8)
USBULC6-2N4 FAQ
1.How can I place an order for USBULC6-2N4 through Aetrix?
Please submit a Request for Quotation (RFQ) for USBULC6-2N4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for USBULC6-2N4 reliable?
The price and inventory of USBULC6-2N4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for USBULC6-2N4 is usually 5 days.
3.What payment methods are accepted for USBULC6-2N4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for USBULC6-2N4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for USBULC6-2N4?
USBULC6-2N4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your USBULC6-2N4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for USBULC6-2N4?
For technical support, including USBULC6-2N4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your USBULC6-2N4 requirements.
6.How does Aetrix verify that USBULC6-2N4 is sourced from the original manufacturer or authorized distributors?
All USBULC6-2N4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that USBULC6-2N4 meets industry standards.
7.What is the process for return or replacement of USBULC6-2N4?
All USBULC6-2N4 units undergo pre-shipment inspection (PSI). If there is an issue with USBULC6-2N4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The USBULC6-2N4 part is unused and in its original packaging.
Return procedure for USBULC6-2N4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
USBULC6-2N4 Tags
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Diodes Incorporated
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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