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Vishay Siliconix VP0808B-E3

Part No.:
VP0808B-E3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
TO-205AD, TO-39-3 Metal Can
Datasheet:
AetrixVP0808B-E3.pdf
Description:
MOSFET P-CH 80V 880MA TO39
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,859

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Product details

Overview

VP0808B-E3 from Siliconix is a P-channel enhancement-mode MOSFET designed for high-side switching in low-power DC circuits, featuring –80 V drain-source breakdown voltage, 2.5 Ω maximum rDS(on) at –10 V VGS, –3.4 V typical gate threshold voltage, –0.88 A continuous drain current, and TO-205AD (TO-39) metal-can package with case-drain configuration. It operates reliably in battery-powered systems requiring moderate-voltage, low-current load control.

For engineers reviewing the VP0808B-E3 datasheet, VP0808B-E3 pinout, VP0808B-E3 application, or VP0808B-E3 equivalent, key selection criteria include verified high-side switch capability, confirmed –80 V V(BR)DSS rating, measured 2.5 Ω rDS(on) at –10 V, documented –3.4 V VGS(th) center point, and TO-205AD thermal performance with RthJA = 156 °C/W.

Technical Context

This device uses a planar vertical DMOS structure optimized for stable threshold behavior across temperature, with gate-body leakage limited to 100 nA at 20 V and 500 nA at 125 °C. Its static characteristics are specified under pulse conditions (PW ≤ 300 µs, duty cycle ≤ 2%) to avoid self-heating effects during parameter validation.

Switching performance is characterized with VDD = –25 V, RL = 50 Ω, and VGS swing from 0 to –10 V, yielding 11 ns turn-on delay, 30 ns rise time, 20 ns turn-off delay, and 30 ns fall time - values confirmed independent of operating temperature per datasheet note.

Key Specifications

ParameterValue and Actual Design Meaning
V(BR)DSS–80 V minimum; ensures safe operation up to –80 V drain-source potential without avalanche conduction.
rDS(on)2.5 Ω max at VGS = –10 V, ID = –1 A; enables <1.5 W conduction loss at –0.88 A continuous current.
VGS(th)–2 to –4.5 V range, –3.4 V typical; supports direct logic-level drive from 5 V microcontrollers with margin.
ID (continuous)–0.88 A at TJ = 150 °C; defines maximum steady-state load current in thermally unrestricted ambient.
Ciss75 pF at VDS = –25 V, VGS = 0 V; determines gate drive energy requirement and switching speed sensitivity to drive resistance.
td(on)11 ns; sets minimum controllable on-time in PWM applications with fast transient response.
RthJA156 °C/W; establishes thermal derating slope: 6.25 W max power dissipation at 25 °C ambient, dropping to 2.5 W at 70 °C ambient.

Pinout & Package

VP0808B-E3 is housed in a TO-205AD (TO-39) metal-can package with case-drain configuration, providing mechanical robustness and direct heatsinking via the case. The package has three leads: Drain connected to case, Gate, and Source.

Pin/TerminalCircuit RoleDesign Meaning
Drain (Case)Main current-carrying terminal, electrically tied to metal canEnables direct mounting to heatsink; requires electrical isolation from PCB ground unless circuit topology permits common-drain configuration.
GateControl electrodeHigh-impedance input requiring <100 nA leakage current; sensitive to ESD but compatible with standard CMOS logic drive levels.
SourceReference terminal for gate drive and current return pathServes as local ground reference for gate-source voltage; must be routed with low inductance in switching applications.

Key Features

FeatureDesign Value
Low rDS(on)2.5 Ω max enables efficient power delivery in low-current (<1 A) high-side loads such as LED arrays or sensor bias networks.
Moderate VGS(th)–3.4 V typical allows reliable turn-on using 5 V microcontroller GPIO without level-shifting or buffering.
Fast switching11 ns td(on) and 30 ns tr support PWM frequencies >1 MHz in precision timing or noise-sensitive analog supply control.
Low Ciss75 pF input capacitance reduces gate drive power and simplifies driver selection for space-constrained designs.
Case-drain thermal pathTO-205AD package delivers 156 °C/W junction-to-ambient thermal resistance, enabling passive cooling in sealed enclosures.

Applications

Battery-Powered Load SwitchingLow-Voltage Power Supply Sequencing

Use Scenario: Isolating backup battery from main system rail during sleep mode in portable medical monitors.

IC Role / Device Role / Timing Role: High-side switch controlling 3.3 V/5 V system power domain with precise enable/disable timing.

Use Value: 2.5 Ω rDS(on) limits dropout to <2.2 mV at 0.88 A, preserving battery runtime while supporting fast wake-up transitions.

Use Scenario: Enabling auxiliary 3.3 V LDO only after primary 5 V rail stabilizes in industrial PLC I/O modules.

IC Role / Device Role / Timing Role: Controlled power-path switch with defined turn-on delay and minimal leakage during off-state.

Use Value: –500 nA IDSS at 125 °C ensures <1 µW standby loss, critical for long-term unpowered storage compliance.

Relay/Solenoid Driver InterfaceLED Display Backlight Control

Use Scenario: Driving 24 V DC relay coil in HVAC control panels where microcontroller outputs lack sufficient current.

IC Role / Device Role / Timing Role: Logic-level-compatible high-side driver interfacing MCU GPIO to inductive load.

Use Value: –3.4 V VGS(th) and 75 pF Ciss allow direct drive from 5 V MCU pins with no external buffer, reducing BOM count.

Use Scenario: Controlling 12-segment LED backlight in handheld test equipment powered by single-cell Li-ion.

IC Role / Device Role / Timing Role: Constant-current source switch regulating brightness via PWM duty cycle.

Use Value: 30 ns rise/fall times support 33 kHz PWM without visible flicker, while 2.5 Ω rDS(on) maintains <1% current error across 0–100% dimming range.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel MOSFET high-side switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRF9530NPbF–100 V V(BR)DSS, 6 Ω rDS(on) at –10 V, TO-220 packageHigher voltage rating but higher on-resistance and larger footprint; suited for higher-power 24 V industrial loadsSelect when >–80 V blocking or >1 A current is required; not drop-in due to package and thermal profile mismatch.
ZVP3306A–60 V V(BR)DSS, 3.5 Ω rDS(on) at –10 V, SOT-223 packageLower voltage rating and surface-mount format; optimized for compact consumer electronicsChoose for space-constrained PCBs where –60 V margin suffices and reflow assembly is preferred over through-hole mounting.

Compared with IRF9530NPbF and ZVP3306A, VP0808B-E3 offers the optimal balance of –80 V rating, 2.5 Ω conduction loss, and TO-205AD thermal performance for medium-voltage, low-current high-side switching where mechanical ruggedness and through-hole reliability are prioritized.

Availability

VP0808B-E3 is available at Aetrix Electronics and suitable for battery-operated systems, power supply converter circuits, motor control interfaces, and relay/solenoid drivers requiring stable component supply and long-lifecycle availability.

Supply support for VP0808B-E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Siliconix, founded in 1962 and acquired by Vishay in 1998, pioneered commercial power MOSFET technology and established industry standards for discrete power devices.

The VP0808B-E3 belongs to Siliconix's legacy P-channel enhancement-mode MOSFET family, engineered specifically for high-reliability, low-power high-side switching in industrial and portable electronics where predictable threshold behavior and stable on-resistance are critical.

FAQ

What is the maximum continuous drain current rating for VP0808B-E3?

The VP0808B-E3 has a maximum continuous drain current of –0.88 A at TJ = 150 °C, derated to –0.53 A at TA = 25 °C per its absolute maximum ratings table. This value reflects thermal limits of the TO-205AD package and is validated under pulsed test conditions (PW ≤ 300 µs, duty cycle ≤ 2%) to prevent self-heating artifacts. The VP0808B-E3 must be used within these boundaries to ensure long-term reliability.

Is VP0808B-E3 suitable for high-side switching applications?

Yes, VP0808B-E3 is explicitly designed for high-side switching, as confirmed by its P-channel architecture, case-drain TO-205AD package, and application notes listing "High-Side Switching" as a primary use case. Its –3.4 V gate threshold and 2.5 Ω rDS(on) enable direct interface with 5 V logic controllers without level shifters, and the metal-can case provides mechanical stability in vibration-prone environments where VP0808B-E3 is deployed.

What is the gate-to-source threshold voltage range for VP0808B-E3?

The VP0808B-E3 has a gate-to-source threshold voltage range of –2 V to –4.5 V, with –3.4 V as the typical value measured at VDS = VGS and ID = –1 mA. This range is guaranteed across temperature and process variation, allowing robust turn-on margin when driven from standard 5 V microcontroller outputs. The VP0808B-E3 remains fully enhanced above –4.5 V and begins conducting measurably below –2 V, supporting predictable digital control.

Does VP0808B-E3 have avalanche rating or energy specification?

No, the VP0808B-E3 datasheet does not specify avalanche voltage, single-pulse avalanche energy (EAS), or repetitive avalanche ratings. Its absolute maximum ratings define V(BR)DSS = –80 V as the DC breakdown limit, and operation beyond this voltage-even briefly-may cause irreversible failure. Designers must implement external clamping or snubbing when driving inductive loads to protect the VP0808B-E3, as no intrinsic avalanche capability is documented.

What package type is used for VP0808B-E3 and how is the drain terminal configured?

The VP0808B-E3 uses the TO-205AD (TO-39) metal-can package with drain internally connected to the case, as shown in the top-view diagram labeled "Case Drain." This configuration requires electrical isolation of the mounting surface from other circuit nodes unless the application intentionally references the drain to chassis ground. The VP0808B-E3's case-drain design enhances thermal transfer but mandates careful PCB layout to avoid short circuits.

VP0808B-E3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
TO-205AD, TO-39-3 Metal Can
Packaging:
Tube
Product Status:
Obsolete
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
80 V
Current - Continuous Drain (Id) @ 25°C:
880mA (Ta)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
5Ohm @ 1A, 10V
Vgs(th) (Max) @ Id:
4.5V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
-
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
150 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
6.25W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-39

VP0808B-E3 FAQ

1.How can I place an order for VP0808B-E3 through Aetrix?

Please submit a Request for Quotation (RFQ) for VP0808B-E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for VP0808B-E3 reliable?

The price and inventory of VP0808B-E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for VP0808B-E3 is usually 5 days.

3.What payment methods are accepted for VP0808B-E3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for VP0808B-E3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for VP0808B-E3?

VP0808B-E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your VP0808B-E3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for VP0808B-E3?

For technical support, including VP0808B-E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your VP0808B-E3 requirements.

6.How does Aetrix verify that VP0808B-E3 is sourced from the original manufacturer or authorized distributors?

All VP0808B-E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that VP0808B-E3 meets industry standards.

7.What is the process for return or replacement of VP0808B-E3?

All VP0808B-E3 units undergo pre-shipment inspection (PSI). If there is an issue with VP0808B-E3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The VP0808B-E3 part is unused and in its original packaging.

Return procedure for VP0808B-E3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

VP0808B-E3 Tags

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