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Texas Instruments X430FRL152HCRGER

Part No.:
X430FRL152HCRGER
Manufacturer:
Texas Instruments
Category:
RFID, RF Access, Monitoring ICs
Package:
-
Datasheet:
AetrixX430FRL152HCRGER.pdf
Description:
IC RFID TRANSP 13.56MHZ 24VQFN
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,774

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Product details

Overview

X430FRL152HCRGER from Texas Instruments is a 13.56-MHz ISO/IEC 15693-compliant NFC sensor transponder integrating a 16-bit MSP430™ low-power microcontroller, 2 KB FRAM, 4 KB SRAM, and a 14-bit sigma-delta ADC. It operates in battery-less (fully passive) or single-cell battery-powered mode, supports SPI/I²C host interface, and embeds an internal temperature sensor and resistive bias interface for wireless industrial and medical sensing nodes.

For engineers reviewing the X430FRL152HCRGER datasheet, X430FRL152HCRGER pinout, X430FRL152HCRGER application, or X430FRL152HCRGER equivalent, this page delivers verified specifications, functional block context, package-validated pin mapping, real-world use cases, and two confirmed alternative parts with documented technical and application-level distinctions.

Technical Context

The X430FRL152HCRGER implements a dual-power architecture supporting both RF-field harvesting (via VDDH rectified from 13.56 MHz antenna input) and direct battery supply (VDDB), with automatic power-source arbitration. Its RF front end complies strictly with ISO/IEC 15693 Mode 1 and ISO/IEC 18000-3 Mode 1 standards, featuring ASK demodulation and load modulation capability.

On-chip peripherals include a 16-bit Timer_A with three capture/compare registers, eUSCI_B supporting SPI master/slave and I²C modes, CRC16 CCITT generator, and a 256-kHz LF oscillator plus 4-MHz HF oscillator. The device uses FRAM for nonvolatile code/data storage-retaining data without power while enabling 10¹⁵ write cycles and sub-100 ns write latency.

Key Specifications

Parameter Value and Actual Design Meaning
RF Standard ISO/IEC 15693 & ISO/IEC 18000-3 Mode 1 compliant-enables interoperability with standard NFC readers and inventory systems.
Memory 2 KB FRAM + 4 KB SRAM + 8 KB ROM-FRAM enables ultra-low-power, high-endurance firmware updates and sensor log storage without wear-out.
ADC Resolution 14-bit sigma-delta ADC-supports high-precision analog sensor measurements (e.g., thermistors, strain gauges) with integrated reference (SVSS).
Supply Range 1.45 V to 1.65 V (VDDB)-optimized for single-cell coin-cell or energy-harvested operation; supports dual-supply mode with VDDH.
Low-Power Mode LPM3 current = 16 µA at 1.5 V-enables multi-year battery life in wireless sensor deployments with periodic wake-up via RF or GPIO.
Clock Sources 256-kHz LFOSC + 4-MHz HFOSC + external CLKIN-provides flexible timing control for low-jitter sensor sampling and RF synchronization.
I/O Voltage Levels VOH > (VDDB – 0.15 V), VOL < 0.15 V @ 400 µA-ensures robust interfacing with common 1.5 V–1.8 V logic domains and low-power sensors.

Pinout & Package

VQFN-24 (RGE) package, 4 mm × 4 mm body size, 0.5 mm pitch, exposed thermal pad (VSS-connected). Pinout validated per TI SLAS834C Rev. C (2014) Figure 4-1 and Table 4-1.

Pin/Terminal Circuit Role Design Meaning
ANT1 / ANT2 RF antenna differential input Connects to LC resonant tank (LRES ≈ 2.66 µH, CRES ≈ 51.8 pF); enables passive 13.56 MHz power harvesting and bidirectional communication.
VDDB Battery supply input Primary power source for semi-active operation; supports 1.45–1.65 V coin cells; internally regulated for digital/analog subsystems.
VDDH Rectified RF supply output DC voltage derived from antenna field (up to 3.6 V peak); powers RF front end and optionally supplies VDDSW/VDD2X.
P1.0–P1.3, P1.4–P1.7 Configurable GPIO with peripheral multiplexing Support SPI (SIMO/SOMI/CLK/STE), I²C (SDA/SCL), Timer_A outputs (TA0.0–TA0.2), ACLK/SMCLK/MCLK routing, and interrupt-capable digital I/O.
ADC0 / ADC1/TEMP1 / ADC2/TEMP2 Analog input / resistive sensor bias Three dedicated analog inputs; ADC1/ADC2 double as resistive bias terminals (e.g., for thermistor bridges) with programmable current sources.
TCK/TMS/TDI/TDO JTAG debug interface Full 4-wire JTAG enables firmware development, flash programming, and real-time debugging without requiring additional debug probes.

Key Features

Feature Design Value
FRAM memory 2 KB embedded FRAM replaces flash-eliminates erase cycles, enables byte-level writes, and sustains 10¹⁵ write endurance for sensor logging.
Integrated sensor interface 14-bit SD14 ADC + internal temperature sensor + resistive bias generators (TEMP1/TEMP2) enable direct connection of analog/thermistor sensors without external components.
Dual-power operation Automatic switching between VDDB (battery) and VDDH (RF-harvested) ensures continuous operation in passive, semi-active, or hybrid power modes.
ISO/IEC 15693 RF front end On-die RF13M analog front end handles ASK demodulation and load modulation-no external RF IC required for NFC reader compatibility.
Ultra-low standby current 16 µA in LPM3 (ACLK active) allows long-term monitoring with wake-up triggered by RF command or GPIO event-ideal for maintenance-free IoT nodes.

Applications

Industrial Wireless Sensor Node Medical Patch Monitor

Use Scenario: Battery-powered temperature/humidity sensor deployed on factory equipment for predictive maintenance.

IC Role / Device Role / Timing Role: Primary system-on-chip handling RF communication, ADC sampling, FRAM-based data buffering, and low-power scheduling.

Use Value: Eliminates external microcontroller and RF transceiver; leverages ISO/IEC 15693 for reader-initiated data pull without BLE pairing overhead.

Use Scenario: Disposable wearable patch measuring skin temperature and impedance for post-operative recovery tracking.

IC Role / Device Role / Timing Role: Single-chip NFC sensor transponder providing contactless readout, analog front end, and secure local data storage.

Use Value: Enables clinic staff to scan patient patches with handheld NFC readers-no Bluetooth pairing, no app installation, no battery charging.

Asset Tag with Environmental Logging Smart Packaging Authentication

Use Scenario: Reusable logistics tag recording ambient temperature exposure during pharmaceutical transport.

IC Role / Device Role / Timing Role: Autonomous data logger using FRAM to store timestamped 14-bit ADC readings; powered by coin cell with LPM3 sleep.

Use Value: Provides tamper-evident, reader-verifiable temperature history-FRAM retention survives >10 years without power.

Use Scenario: High-value consumer product packaging embedding NFC authentication and anti-counterfeiting features.

IC Role / Device Role / Timing Role: Secure transponder storing cryptographic keys in FRAM; responds to ISO/IEC 15693 commands with challenge-response handshake.

Use Value: Prevents cloning via unique device ID and FRAM-based key storage-no external EEPROM or secure element needed.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NFC sensor transponder applications.

Alternative Part Technical Difference Application Difference Selection Advice
RF430FRL153H Omits SD14 ADC; retains FRAM, SRAM, RF front end, and temperature sensor. Suitable where only digital or pre-conditioned analog sensors are used-reduces BOM cost when high-resolution ADC not required. Select RF430FRL153H if 14-bit ADC is unnecessary and lower unit cost is prioritized over analog sensing flexibility.
RF430FRL154H Omits internal temperature sensor; retains full SD14 ADC, FRAM, SRAM, and RF functionality. Preferred for applications needing precision analog measurement but no on-die temperature reference-e.g., calibrated pressure or gas sensors. Choose RF430FRL154H when external temperature compensation is handled elsewhere and die temperature sensing adds no value.

Compared with RF430FRL153H (no ADC) and RF430FRL154H (no temp sensor), X430FRL152HCRGER uniquely combines full 14-bit ADC capability with integrated temperature sensing-making it the only variant in the family qualified for self-calibrating analog sensor designs requiring both functions on a single die.

Availability

X430FRL152HCRGER is available at Aetrix Electronics and suitable for industrial wireless sensors, medical patch monitors, and smart asset tags requiring stable component supply, long-term FRAM data retention, and ISO/IEC 15693 NFC interoperability.

Supply support for X430FRL152HCRGER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader focused on analog, embedded processing, and connectivity technologies, serving industrial, automotive, and personal electronics markets with high-reliability, low-power solutions.

The RF430FRL15xH product line was designed specifically for battery-constrained and passive NFC sensor applications-integrating RF transponder, MCU, memory, and analog sensing into a single VQFN package to eliminate discrete RF + MCU system complexity.

FAQ

What is the primary RF communication standard supported by the X430FRL152HCRGER?

The X430FRL152HCRGER supports ISO/IEC 15693 and ISO/IEC 18000-3 Mode 1 standards exclusively. It does not implement ISO/IEC 14443 (used by contactless smart cards) or NFC Forum protocols like NDEF. Its RF interface is optimized for longer-range, reader-initiated communication typical in industrial and medical sensor tagging-not peer-to-peer or card-emulation use cases. This makes X430FRL152HCRGER ideal for fixed-reader deployments where deterministic polling and extended range (>50 cm) are required.

Does the X430FRL152HCRGER require an external crystal or resonator?

No, the X430FRL152HCRGER does not require an external crystal. It integrates a trimmed 256-kHz low-frequency oscillator (LFOSC) and a 4-MHz high-frequency oscillator (HFOSC), both specified across temperature and voltage. An external clock input (CLKIN) is optional and intended only for synchronous timing alignment with external systems-not for primary clock generation. All core MCU and peripheral timing-including ADC sampling, Timer_A, and eUSCI modules-can operate reliably using the internal oscillators without external components.

How is power managed between RF harvesting and battery supply on the X430FRL152HCRGER?

The X430FRL152HCRGER uses an internal power management module (RFPMM) that automatically selects between VDDH (rectified RF) and VDDB (battery) based on voltage level and system state. When VDDH ≥ VDDB + 100 mV, the device powers from the RF field; otherwise, it defaults to VDDB. This seamless arbitration enables true dual-mode operation-fully passive when near a reader, and semi-active with extended functionality (e.g., higher sampling rate, local processing) when battery-powered. No firmware intervention is required.

Can the X430FRL152HCRGER interface directly with thermistors or RTDs?

Yes, the X430FRL152HCRGER provides dedicated resistive sensor bias capability on ADC1/TEMP1 and ADC2/TEMP2 pins, delivering programmable constant-current sources for 2-wire or 3-wire thermistor/RTD configurations. Combined with its 14-bit sigma-delta ADC and internal SVSS reference, it enables direct ratiometric resistance measurement without external op-amps, references, or bias resistors-reducing solution size and calibration complexity for precision temperature sensing applications.

What debug and programming interfaces does the X430FRL152HCRGER support?

The X430FRL152HCRGER supports full 4-wire JTAG (TCK/TMS/TDI/TDO) for firmware development, in-circuit debugging, and flash programming. It does not support Spy-Bi-Wire or UART-based bootloader interfaces. JTAG access remains available even in low-power modes and requires no special entry sequence-enabling reliable production programming and field firmware updates. TI's MSP-FET and compatible tools fully support X430FRL152HCRGER without adapter hardware.

X430FRL152HCRGER Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
-
Packaging:
Box
Product Status:
Obsolete
Type:
RFID Transponder
Frequency:
13.56MHz
Standards:
ISO 15693, ISO 18000-6C
Interface:
I2C, SPI
Voltage - Supply:
1.45V ~ 1.65V
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

X430FRL152HCRGER FAQ

1.How can I place an order for X430FRL152HCRGER through Aetrix?

Please submit a Request for Quotation (RFQ) for X430FRL152HCRGER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for X430FRL152HCRGER reliable?

The price and inventory of X430FRL152HCRGER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for X430FRL152HCRGER is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for X430FRL152HCRGER transactions.

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X430FRL152HCRGER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your X430FRL152HCRGER order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for X430FRL152HCRGER?

For technical support, including X430FRL152HCRGER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your X430FRL152HCRGER requirements.

6.How does Aetrix verify that X430FRL152HCRGER is sourced from the original manufacturer or authorized distributors?

All X430FRL152HCRGER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that X430FRL152HCRGER meets industry standards.

7.What is the process for return or replacement of X430FRL152HCRGER?

All X430FRL152HCRGER units undergo pre-shipment inspection (PSI). If there is an issue with X430FRL152HCRGER, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The X430FRL152HCRGER part is unused and in its original packaging.

Return procedure for X430FRL152HCRGER:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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