Renesas 2SK3322(1)-ZK-E2-AZ
- Part No.:
- 2SK3322(1)-ZK-E2-AZ
- Manufacturer:
- Renesas
- Category:
- FETs, MOSFETs
- Package:
- -
- Datasheet:
-
2SK3322(1)-ZK-E2-AZ.pdf
- Description:
- N-CHANNEL POWER MOSFET
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Product details
Overview
2SK3322(1)-ZK-E2-AZ from NEC Electronics Corporation is an N-channel enhancement-mode power MOSFET in TO-263 (MP-25ZK) surface-mount package, rated for 600 V VDSS, 5.5 A DC drain current, and 2.2 Ω max RDS(on) at VGS = 10 V. It delivers low gate charge (15 nC typ.), avalanche capability (4.0 A IAS, 10.7 mJ EAS), and is engineered for high-voltage switching power supplies and AC adapters.
For engineers reviewing the 2SK3322(1)-ZK-E2-AZ datasheet, 2SK3322(1)-ZK-E2-AZ pinout, 2SK3322(1)-ZK-E2-AZ application, or 2SK3322(1)-ZK-E2-AZ equivalent, key selection criteria include its 600 V blocking voltage, TO-263 thermal performance (Rth(ch-C) = 1.93 °C/W), body diode reverse recovery (trr = 1.6 µs), and gate drive compatibility with ±30 V rating.
Technical Context
This DMOS FET employs a planar vertical structure optimized for high-voltage operation and fast switching. Its gate threshold voltage (VGS(off) = 2.5–3.5 V) ensures reliable turn-on with standard 10 V logic-level drivers, while the low QG/QGD ratio (15 nC / 4.4 nC) supports efficient hard-switching in offline SMPS topologies.
The device integrates a built-in gate-source protection diode for ESD robustness and features a body diode with VF(S-D) = 1.0 V at 5.5 A - enabling synchronous rectification support in flyback and resonant converters where controlled reverse recovery is critical.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 600 V - Enables direct use in universal-input (85–265 VAC) offline power supplies without voltage derating concerns. |
| RDS(on) max | 2.2 Ω @ VGS = 10 V, ID = 2.8 A - Determines conduction loss in continuous conduction mode; impacts thermal design at full load. |
| QG typ | 15 nC @ VDD = 450 V - Defines gate driver power requirement and switching speed trade-off in high-frequency designs. |
| IAS | 4.0 A single-pulse avalanche - Allows safe operation under inductive switching stress without external snubbers in well-designed layouts. |
| trr | 1.6 µs @ IF = 5.5 A, di/dt = 50 A/µs - Limits switching losses during body diode commutation; critical for quasi-resonant flyback efficiency. |
| Ciss | 550 pF @ VDS = 10 V - Influences gate drive loop stability and EMI filter sizing in high-dV/dt applications. |
| PT2 | 65 W @ TC = 25°C - Specifies maximum steady-state power dissipation when mounted on a heatsink; defines thermal interface requirements. |
Pinout & Package
2SK3322(1)-ZK-E2-AZ is housed in a TO-263 (MP-25ZK) surface-mount package with exposed drain tab for enhanced thermal conduction. The package features gull-wing leads and a molded plastic body compliant with JEDEC MS-013 standards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control electrode | Receives gate drive signal; requires ≤±30 V bias; low input capacitance enables fast switching with modest driver strength. |
| 2 (Drain) | High-side power terminal | Connected to high-voltage rail (up to 600 V); electrically tied to exposed metal tab for heatsinking and current return path. |
| 3 (Source) | Power reference node | Serves as return path for load current and gate drive reference; must be routed with low inductance to minimize switching noise. |
| 4 (Fin/Drain Tab) | Thermal & electrical drain extension | Exposed copper pad soldered to PCB ground plane or heatsink; carries full drain current and dissipates >90% of junction heat. |
Key Features
| Feature | Design Value |
|---|---|
| Low gate charge | 15 nC typical enables <100 ns switching transitions with 1 A gate drivers, reducing driver IC cost and board space. |
| Avalanche-rated operation | Guaranteed single-pulse energy handling (10.7 mJ) allows robustness against transformer leakage inductance spikes without clamping circuits. |
| Body diode with fast recovery | 1.6 µs trr and 5.3 µC Qrr support quasi-resonant and active-clamp topologies requiring controlled diode conduction. |
| Surface-mount TO-263 package | MP-25ZK footprint provides superior thermal resistance (1.93 °C/W case-to-junction) versus through-hole TO-220, enabling higher power density. |
| ESD-protected gate | Integrated gate-source Zener diode limits transient overvoltage to ±30 V, reducing need for external gate protection in moderate-noise environments. |
Applications
| AC-DC Adapter Primary Switch | Industrial SMPS Main Switch |
|---|---|
Use Scenario: 65 W universal-input AC adapter operating in discontinuous conduction mode (DCM) flyback topology. IC Role / Device Role / Timing Role: High-side primary-side switching element controlling energy transfer via transformer; switched at 65 kHz with zero-voltage switching assist. Use Value: 600 V rating accommodates reflected output voltage plus line surge margin; low QG minimizes gate drive loss at high frequency. | Use Scenario: 300 W industrial open-frame power supply using active-clamp forward converter. IC Role / Device Role / Timing Role: Main power switch synchronizing with clamp FET; subjected to repetitive 400 V drain stress and 10 A peak current pulses. Use Value: Avalanche capability absorbs clamp circuit transients; TO-263 thermal performance sustains 65 W dissipation without oversized heatsink. |
| LED Driver High-Voltage Buck | UPS Inverter Half-Bridge Leg |
Use Scenario: Constant-current LED driver for street lighting, accepting 277 VAC input and driving 48 V/1.5 A string. IC Role / Device Role / Timing Role: Buck regulator switch operating in continuous conduction mode at 100 kHz; handles 400 V transient surges. Use Value: 2.2 Ω RDS(on) limits conduction loss to <1.5 W at full load; body diode trr prevents shoot-through during dead-time. | Use Scenario: 1 kVA online UPS inverter stage converting 380 VDC bus to 230 VAC output using two-level topology. IC Role / Device Role / Timing Role: Low-side switch in half-bridge configuration; commutated at 16 kHz with 5.5 A RMS current. Use Value: Gate voltage rating (±30 V) supports isolated gate drivers with bootstrap supply; low Ciss reduces EMI generation during fast dV/dt transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP6NK60ZFP | 600 V, 6 A, RDS(on) = 1.2 Ω, QG = 22 nC, TO-220FP package | Higher current rating but higher gate charge and lower avalanche energy (EAS = 5.5 mJ) | Preferred where lower RDS(on) dominates over gate drive loss and avalanche margin is secondary. |
| IXTP50N10P | 100 V, 50 A, RDS(on) = 0.022 Ω, TO-220 package, no avalanche rating | Lower voltage rating precludes use in 600 V applications; unsuitable for offline SMPS primary side | Only viable in low-voltage DC-DC stages where 600 V capability is unnecessary. |
Compared with STP6NK60ZFP and IXTP50N10P, the 2SK3322(1)-ZK-E2-AZ offers balanced trade-offs for 600 V primary-side switching: superior avalanche ruggedness over ST's part and essential voltage rating missing in IXYS's low-VDS device - making it uniquely suitable for cost-sensitive, thermally constrained offline power designs.
Availability
2SK3322(1)-ZK-E2-AZ is available at Aetrix Electronics and suitable for AC-DC adapters, industrial SMPS, LED drivers, and UPS inverters requiring stable component supply, long-lifecycle support, and consistent parametric performance across production batches.
Supply support for 2SK3322(1)-ZK-E2-AZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NEC Electronics Corporation was a Japanese semiconductor manufacturer specializing in analog, power, and mixed-signal ICs before merging into Renesas Electronics in 2010.
The 2SK3322 series belongs to NEC's high-voltage discrete power MOSFET product line, designed specifically for reliability-critical offline switching applications demanding avalanche tolerance and stable RDS(on) over temperature.
FAQ
What is the maximum continuous drain current rating for the 2SK3322(1)-ZK-E2-AZ at 25°C case temperature?
The 2SK3322(1)-ZK-E2-AZ has a maximum continuous drain current (ID(DC)) rating of ±5.5 A at TC = 25°C. This value assumes proper heatsinking and is limited by package thermal resistance (Rth(ch-C) = 1.93 °C/W). At elevated case temperatures, the current must be derated per the datasheet's forward-bias SOA curve.
Does the 2SK3322(1)-ZK-E2-AZ have an integrated gate protection diode?
Yes, the 2SK3322(1)-ZK-E2-AZ includes an internal gate-source Zener diode for ESD protection, rated for ±30 V. However, the datasheet explicitly states that external protection remains necessary if voltages exceeding this rating may occur in the application - such as from inductive kickback or poor layout-induced ringing.
What is the typical gate charge (QG) of the 2SK3322(1)-ZK-E2-AZ and how does it affect switching performance?
The 2SK3322(1)-ZK-E2-AZ has a typical total gate charge (QG) of 15 nC under VDD = 450 V, VGS = 10 V, and ID = 5.5 A conditions. This low QG enables faster turn-on/turn-off transitions with modest gate drivers, reducing switching losses - especially beneficial in high-frequency flyback and resonant converters where driver efficiency matters.
Can the 2SK3322(1)-ZK-E2-AZ be used in avalanche mode repeatedly?
No - the 2SK3322(1)-ZK-E2-AZ is rated for single-pulse avalanche only (IAS = 4.0 A, EAS = 10.7 mJ). Repetitive avalanche operation is not guaranteed and may cause cumulative degradation. Designers must ensure circuit conditions (e.g., inductive energy, VDD, RG) stay within single-pulse limits or implement clamping to avoid reliance on avalanche conduction.
What is the body diode forward voltage (VF(S-D)) of the 2SK3322(1)-ZK-E2-AZ and why does it matter?
The body diode forward voltage of the 2SK3322(1)-ZK-E2-AZ is 1.0 V at IF = 5.5 A and VGS = 0 V. This parameter directly impacts conduction loss during freewheeling phases in buck, flyback, and half-bridge topologies - especially where the MOSFET's intrinsic diode conducts before synchronous rectification takes over.
2SK3322(1)-ZK-E2-AZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- FET Type:
- -
- Technology:
- -
- Drain to Source Voltage (Vdss):
- -
- Current - Continuous Drain (Id) @ 25°C:
- -
- Drive Voltage (Max Rds On, Min Rds On):
- -
- Rds On (Max) @ Id, Vgs:
- -
- Vgs(th) (Max) @ Id:
- -
- Gate Charge (Qg) (Max) @ Vgs:
- -
- Vgs (Max):
- -
- Input Capacitance (Ciss) (Max) @ Vds:
- -
- FET Feature:
- -
- Power Dissipation (Max):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
2SK3322(1)-ZK-E2-AZ FAQ
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All 2SK3322(1)-ZK-E2-AZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 2SK3322(1)-ZK-E2-AZ meets industry standards.
7.What is the process for return or replacement of 2SK3322(1)-ZK-E2-AZ?
All 2SK3322(1)-ZK-E2-AZ units undergo pre-shipment inspection (PSI). If there is an issue with 2SK3322(1)-ZK-E2-AZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 2SK3322(1)-ZK-E2-AZ part is unused and in its original packaging.
Return procedure for 2SK3322(1)-ZK-E2-AZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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