Renesas 2SK3811-ZP-E1-AY
- Part No.:
- 2SK3811-ZP-E1-AY
- Manufacturer:
- Renesas
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
2SK3811-ZP-E1-AY.pdf
- Description:
- MOSFET N-CH 40V 110A TO263
- Quantity:
- Payment:

- Shipping:

Inventory:2,265
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
2SK3811-ZP-E1-AY from Renesas Electronics is an N-channel power MOSFET designed for high-current DC switching in industrial power supplies and motor drives. It delivers RDS(on) = 1.8 mΩ max at VGS = 10 V and ID = 55 A, supports ±110 A DC drain current, and features TO-263 (MP-25ZP) surface-mount packaging with integrated drain-fin thermal enhancement.
For engineers reviewing the 2SK3811-ZP-E1-AY datasheet, 2SK3811-ZP-E1-AY pinout, 2SK3811-ZP-E1-AY application, or 2SK3811-ZP-E1-AY equivalent, key selection criteria include avalanche energy rating (EAS = 518 mJ), gate charge (QG = 260 nC), body diode reverse recovery (trr = 60 ns), and safe operating area under pulsed conditions up to 440 A.
Technical Context
This device uses a planar vertical DMOS structure optimized for low conduction loss and robust unclamped inductive switching (UIS). Its gate threshold voltage (VGS(off) = 2.0–4.0 V) ensures reliable turn-on with standard 10 V gate drivers, while the 17.7 nF input capacitance (Ciss) and 1.3 nF reverse transfer capacitance (Crss) support fast switching with controlled EMI in hard-switched topologies.
The integrated source-drain body diode exhibits VF(S-D) = 0.87–1.5 V at 110 A and trr = 60 ns with Qrr = 80 nC, enabling synchronous rectification replacement in medium-frequency DC-DC converters. Thermal resistance from channel to case is 0.587°C/W, requiring direct heatsinking via the exposed drain tab.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 40 V - Maximum blocking voltage compatible with 24–36 V nominal bus systems. |
| RDS(on) max | 1.8 mΩ at VGS = 10 V, ID = 55 A - Enables <1 W conduction loss at 55 A, critical for high-efficiency power stages. |
| ID(DC) | ±110 A - Supports high-current output stages without paralleling, reducing layout complexity. |
| EAS | 518 mJ - Withstands single-pulse inductive energy spikes in motor drive H-bridges or solenoid drivers. |
| QG | 260 nC - Requires ~2.6 W average gate drive power at 100 kHz switching, guiding driver IC selection. |
| trr | 60 ns - Limits diode commutation loss and enables operation up to ~200 kHz in non-synchronous buck converters. |
| Tch max | 150°C - Sets maximum junction temperature for thermal design; derates linearly above 25°C case temperature. |
Pinout & Package
Package: TO-263 (MP-25ZP), surface-mount with exposed drain tab (Pin 2 & 4) for low-thermal-resistance heatsinking. Dimensions: 15.25 × 10.0 × 4.45 mm (L × W × H), lead-free per RoHS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control terminal | Receives gate drive signal; requires ≤20 V absolute max; sensitive to ESD-must be protected during handling and PCB routing. |
| 2 (Drain) | Main current path (high-side) | Connected to exposed metal tab; electrically tied to Pin 4; must be thermally bonded to heatsink with electrical isolation if needed. |
| 3 (Source) | Reference node / return path | Serves as local ground reference for gate drive; carries full load current; layout must minimize inductance to reduce switching overshoot. |
| 4 (Fin/Drain) | Thermal & electrical drain extension | Same potential as Pin 2; provides additional solderable area for thermal conduction; not electrically isolated from Pin 2. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) | 1.4–1.8 mΩ enables <0.5 W conduction loss at 30 A, reducing heatsink size in compact 48 V telecom PSUs. |
| High UIS ruggedness | Single avalanche energy of 518 mJ allows reliable operation in inductive load switching without external snubbers. |
| Fast body diode | 60 ns reverse recovery time and 80 nC Qrr reduce cross-conduction loss in half-bridge configurations. |
| TO-263 thermal design | 0.587°C/W channel-to-case resistance supports >150 W continuous dissipation with proper heatsinking. |
Applications
| Motor Drive Inverter Stage | Industrial DC Power Supply Output Switch |
|---|---|
Use Scenario: High-current H-bridge driving 3-phase BLDC motors in factory automation actuators. IC Role / Device Role / Timing Role: Low-side switching element handling bidirectional 110 A peak current with fast turn-off to minimize shoot-through risk. Use Value: 1.8 mΩ RDS(on) reduces conduction loss by >40% vs. comparable 3 mΩ MOSFETs, improving thermal margin at 10 kHz PWM. | Use Scenario: Primary-side synchronous rectifier in 2 kW server PSU with 48 V output. IC Role / Device Role / Timing Role: High-current, low-VF body diode replaces Schottky in non-synchronous flyback, enabling cost-effective efficiency boost. Use Value: 60 ns trr limits diode recovery loss to <3% of total switching loss at 100 kHz, avoiding need for active clamp. |
| Uninterruptible Power Supply (UPS) Bypass Switch | Electric Vehicle Onboard Charger (OBC) Input Stage |
Use Scenario: Solid-state bypass switch in line-interactive UPS transferring 5 kVA load between utility and inverter paths. IC Role / Device Role / Timing Role: Bidirectional 110 A DC switch activated within 10 ms to maintain zero-interruption power continuity. Use Value: ±110 A DC rating and 440 A pulse capability ensure no derating required during 200 ms overload events per IEC 62040-3. | Use Scenario: AC/DC PFC boost switch in 6.6 kW OBC handling 32 A RMS input current at 25 kHz. IC Role / Device Role / Timing Role: Main switching transistor in continuous conduction mode (CCM) boost converter with 40 V VDSS headroom. Use Value: 260 nC QG enables use of low-cost gate drivers (e.g., IR2110) without external buffer, simplifying BOM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IXTP110N04T2 | RDS(on) = 3.2 mΩ (higher), QG = 120 nC (lower), TO-220 package | Limited to lower-current designs (<75 A DC); lacks avalanche rating documentation | Prefer where gate drive power is constrained but thermal budget allows higher RDS(on). |
| STP110NF04L | RDS(on) = 3.4 mΩ, QG = 140 nC, TO-220FP package | No specified EAS; lower ID(pulse) = 330 A; not qualified for repetitive avalanche | Acceptable for non-inductive switching where cost is primary; avoid in motor drive or relay drive. |
Compared with IXTP110N04T2 and STP110NF04L, the 2SK3811-ZP-E1-AY offers superior conduction efficiency and documented UIS ruggedness, making it preferred for high-reliability industrial switching where thermal and transient stress coexist.
Availability
2SK3811-ZP-E1-AY is available at Aetrix Electronics and suitable for industrial motor drives, high-power DC-DC converters, and uninterruptible power supplies requiring stable component supply and long-term lifecycle support.
Supply support for 2SK3811-ZP-E1-AY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.
The 2SK3811-ZP-E1-AY belongs to Renesas' legacy high-current discrete MOSFET product line, engineered specifically for ruggedized industrial power conversion where low RDS(on), high pulse current, and avalanche survivability are mandatory.
FAQ
What is the maximum continuous drain current rating for the 2SK3811-ZP-E1-AY?
The 2SK3811-ZP-E1-AY has a rated DC drain current (ID(DC)) of ±110 A at TC = 25°C. This rating assumes direct heatsinking to maintain case temperature at or below 25°C; actual usable current must be derated per the datasheet's PT vs. TC curve, dropping to ~70 A at TC = 100°C. The 2SK3811-ZP-E1-AY is not rated for 110 A at ambient temperature without forced cooling.
Does the 2SK3811-ZP-E1-AY have a specified avalanche energy rating?
Yes, the 2SK3811-ZP-E1-AY is fully characterized for unclamped inductive switching with a single-pulse avalanche energy (EAS) of 518 mJ and repetitive avalanche current (IAR) of 72 A. These values were measured under defined test conditions (VDD = 20 V, RG = 25 Ω, starting Tch = 25°C) and are guaranteed per the D16737EJ1V0DS datasheet. The 2SK3811-ZP-E1-AY is suitable for designs requiring intrinsic avalanche ruggedness without external protection.
What is the gate threshold voltage range for the 2SK3811-ZP-E1-AY?
The gate threshold voltage (VGS(off)) for the 2SK3811-ZP-E1-AY is specified as 2.0–4.0 V at VDS = 10 V and ID = 1 mA. This range ensures consistent turn-on behavior across process variation and temperature, supporting reliable operation with standard 10 V gate drivers. The 2SK3811-ZP-E1-AY does not require negative gate bias for full depletion and remains fully enhanced above 4.0 V.
Can the 2SK3811-ZP-E1-AY be used in synchronous rectification applications?
The 2SK3811-ZP-E1-AY includes an integrated body diode with VF(S-D) = 0.87–1.5 V at 110 A and trr = 60 ns, making it suitable for non-synchronous rectification. However, its relatively high QG (260 nC) and lack of dedicated synchronous control timing specs mean it is not optimized for high-frequency synchronous rectifier use. For such roles, dedicated low-QG, logic-level MOSFETs are preferred. The 2SK3811-ZP-E1-AY excels instead in main switching positions.
What package type does the 2SK3811-ZP-E1-AY use, and how is thermal management implemented?
The 2SK3811-ZP-E1-AY uses the TO-263 (MP-25ZP) surface-mount package with an exposed drain tab (Pins 2 and 4) serving as both electrical drain connection and primary thermal path. Effective thermal management requires soldering this tab directly to a copper pour or heatsink with thermal interface material. The channel-to-case thermal resistance is 0.587°C/W, so maintaining TC ≤ 100°C demands ≤120 W power dissipation with adequate heatsinking. The 2SK3811-ZP-E1-AY cannot rely on PCB traces alone for heat removal.
2SK3811-ZP-E1-AY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 110A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 1.8mOhm @ 55A, 10V
- Vgs(th) (Max) @ Id:
- -
- Gate Charge (Qg) (Max) @ Vgs:
- 260 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 17700 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.5W (Ta), 213W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263
2SK3811-ZP-E1-AY FAQ
1.How can I place an order for 2SK3811-ZP-E1-AY through Aetrix?
Please submit a Request for Quotation (RFQ) for 2SK3811-ZP-E1-AY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 2SK3811-ZP-E1-AY reliable?
The price and inventory of 2SK3811-ZP-E1-AY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 2SK3811-ZP-E1-AY is usually 5 days.
3.What payment methods are accepted for 2SK3811-ZP-E1-AY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 2SK3811-ZP-E1-AY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 2SK3811-ZP-E1-AY?
2SK3811-ZP-E1-AY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 2SK3811-ZP-E1-AY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 2SK3811-ZP-E1-AY?
For technical support, including 2SK3811-ZP-E1-AY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 2SK3811-ZP-E1-AY requirements.
6.How does Aetrix verify that 2SK3811-ZP-E1-AY is sourced from the original manufacturer or authorized distributors?
All 2SK3811-ZP-E1-AY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 2SK3811-ZP-E1-AY meets industry standards.
7.What is the process for return or replacement of 2SK3811-ZP-E1-AY?
All 2SK3811-ZP-E1-AY units undergo pre-shipment inspection (PSI). If there is an issue with 2SK3811-ZP-E1-AY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 2SK3811-ZP-E1-AY part is unused and in its original packaging.
Return procedure for 2SK3811-ZP-E1-AY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
2SK3811-ZP-E1-AY Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

