Alpha & Omega Semiconductor Inc. AOB66914L
- Part No.:
- AOB66914L
- Manufacturer:
- Alpha & Omega Semiconductor Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
AOB66914L.pdf
- Description:
- N
- Quantity:
- Payment:

- Shipping:

Inventory:800
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Product details
Overview
AOB66914L from Alpha & Omega Semiconductor is a 100V N-Channel Trench Power MOSFET using AlphaSGT™ technology, designed as a high-current load switch or DC-DC power stage device. It delivers 120A continuous drain current at VGS=10V, features RDS(ON) < 2.7 mΩ (VGS=10V), supports 175°C maximum junction temperature, and is qualified for telecom hot-swap and industrial power applications.
For engineers reviewing the AOB66914L datasheet, pinout, applications, or equivalent options, key selection criteria include its low RDS(ON) at 10V/6V gate drive, UIS-rated ruggedness, gate charge (Qg=155–220 nC), thermal resistance (RθJC=0.40°C/W), and TO-263 (D2PAK) surface-mount package suitability for high-power density PCB layouts.
Technical Context
The AOB66914L employs AlphaSGT™ trench-gate superjunction structure to achieve ultra-low on-resistance while maintaining fast switching performance. Its gate threshold voltage (2.5–3.5V) enables robust turn-on with standard logic-level or 10V gate drivers, and its body diode exhibits Qrr=335 nC and trr=55 ns under IF=20A conditions.
Rated for 100V VDS, the device sustains pulsed drain currents up to 480A and avalanche energy of 38 mJ (L=0.1 mH). Thermal design is enabled by RθJC=0.40°C/W and RθJA=60°C/W (still air), with SOA validated up to 10 ms at 100V and 120A in the forward-biased region.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - Maximum blocking voltage for DC-DC primary-side switches or hot-swap FETs operating up to 48V input systems with margin. |
| ID (VGS=10V) | 120 A - Continuous conduction capability at TC=25°C, enabling single-device solutions for >1 kW power stages. |
| RDS(ON) (VGS=10V) | < 2.7 mΩ - Minimizes I²R conduction loss in high-current paths; reduces heatsink requirements in 12V/48V bus applications. |
| Qg (10V) | 155–220 nC - Gate drive energy requirement determines driver sizing; impacts switching loss trade-off in 100–500 kHz SMPS designs. |
| RθJC | 0.40 °C/W - Enables direct heatsink mounting; allows ~250 W steady-state dissipation with 100°C case-to-heatsink ΔT. |
| TJ(max) | 175 °C - Supports operation in sealed enclosures or high-ambient industrial environments without derating below full current. |
| EAS | 38 mJ - Confirmed unclamped inductive switching ruggedness ensures reliability during load dump or short-circuit events. |
Pinout & Package
AOB66914L is housed in a TO-263 (D2PAK) surface-mount package with exposed drain pad for thermal and electrical connection. The package uses standard JEDEC MO-211AC footprint and supports reflow soldering per IPC-J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Gate) | Control terminal | Receives gate drive signal; requires ≤2.7 Ω gate resistance to control dV/dt and prevent oscillation during hard switching. |
| D (Drain) | High-side power terminal | Connected to input bus or transformer secondary; electrically and thermally tied to exposed copper pad on bottom of package. |
| S (Source) | Power return / reference node | Serves as local ground reference for gate driver; must be low-inductance path to minimize shoot-through risk in half-bridge configurations. |
Key Features
| Feature | Design Value |
|---|---|
| AlphaSGT™ trench process | Delivers <2.7 mΩ RDS(ON) at 100V rating-enables higher efficiency than planar MOSFETs in same voltage class. |
| 100% UIS tested | Guarantees single-pulse avalanche energy ≥38 mJ-critical for telecom hot-swap and motor drive freewheeling reliability. |
| 100% Rg tested | Ensures gate resistance between 0.8–2.7 Ω-reduces gate drive uncertainty and improves EMI predictability in production systems. |
| RoHS & halogen-free | Complies with IPC-1752A material declaration requirements-supports environmental compliance for industrial and telecom OEMs. |
| 175°C TJ max | Permits full 120A current rating at elevated ambient temperatures (e.g., 85°C enclosure), reducing need for forced air cooling. |
Applications
| Telecom DC-DC Converters | Industrial Load Switching |
|---|---|
Use Scenario: Primary-side synchronous rectifier in 48V-to-12V isolated DC-DC modules for 5G base station power supplies. IC Role / Device Role / Timing Role: High-side power switch controlling bulk power delivery; operates in hard-switched PWM mode at 200–300 kHz. Use Value: Sub-3 mΩ RDS(ON) cuts conduction loss by >40% vs. legacy 100V MOSFETs, improving module efficiency from 93% to 95.2% at full load. |
Use Scenario: Hot-swap controller FET in programmable logic controller (PLC) backplane power distribution. IC Role / Device Role / Timing Role: Inrush-limiting and fault-isolation switch; subjected to repeated 100A surge currents during board insertion. Use Value: 100% UIS qualification and 480A pulsed rating ensure survival across >10,000 hot-plug cycles without parameter drift or failure. |
| Server VRM High-Side Switch | Industrial Motor Drive Half-Bridge |
Use Scenario: High-side switch in multiphase buck converters supplying CPU core voltage (0.8–1.2V @ 200A+). IC Role / Device Role / Timing Role: Fast-switching power transistor with gate charge optimized for 30–50 ns dead-time control. Use Value: Qg=155–220 nC and Qgd/Qgs ratio of ~0.65 enable clean turn-off with minimal Miller-induced shoot-through risk. |
Use Scenario: Low-side switch in 24V BLDC inverter driving conveyor belt motors in factory automation. IC Role / Device Role / Timing Role: PWM-controlled power stage element handling 60A RMS current with body-diode commutation. Use Value: Body diode trr=55 ns and Qrr=335 nC reduce reverse recovery loss and EMI during freewheeling, lowering heatsink size by 30%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IXFN120N10P3 | 100V, 120A, RDS(ON)=2.9 mΩ (VGS=10V), TO-247 package, higher RθJC=0.55°C/W | Through-hole mounting only; unsuitable for automated SMT lines or space-constrained boards | Choose when mechanical robustness and field-service replacement outweigh SMT assembly benefits |
| IRFB4115PBF | 100V, 115A, RDS(ON)=3.2 mΩ (VGS=10V), TO-220 package, no UIS rating specified | Lacks 100% UIS test validation; lower peak current rating (420A vs. 480A) | Select only for cost-sensitive non-critical loads where avalanche stress is absent |
Compared with IXFN120N10P3 and IRFB4115PBF, the AOB66914L offers superior thermal performance via TO-263 packaging, guaranteed UIS ruggedness, and lowest RDS(ON) in its class-making it optimal for high-reliability, high-density, and high-efficiency power conversion where layout area and thermal headroom are constrained.
Availability
AOB66914L is available at Aetrix Electronics and suitable for telecom DC-DC converters, industrial load switching, and server VRM applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for AOB66914L includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Alpha & Omega Semiconductor (AOS) is a fabless power semiconductor company specializing in high-performance MOSFETs, IGBTs, and power ICs for computing, consumer, industrial, and telecom markets.
The AOB66914L belongs to AOS's AlphaSGT™ N-channel MOSFET product line, engineered specifically for high-current, high-efficiency power conversion where low conduction loss, rugged switching, and thermal reliability are critical.
FAQ
What is the maximum continuous drain current rating for AOB66914L at 100°C case temperature?
The AOB66914L supports 70A continuous drain current at TC=100°C, as confirmed by its absolute maximum ratings table and Figure 13 (Current De-rating). This derating reflects thermal limits of the TO-263 package and ensures safe operation within the 175°C maximum junction temperature specification. Designers must verify PCB copper area and heatsinking to maintain TC ≤100°C under full-load conditions. The AOB66914L datasheet specifies this value explicitly for thermal design validation.
Does AOB66914L have a specified gate threshold voltage range, and how does it affect drive compatibility?
Yes, the AOB66914L has a gate threshold voltage (VGS(th)) range of 2.5–3.5V at TJ=25°C and 2.7–4.5V at TJ=125°C. This ensures reliable turn-on with standard 5V or 10V gate drivers while avoiding unintended conduction near 0V. The AOB66914L's relatively tight VGS(th) distribution supports consistent timing in parallel configurations and simplifies driver selection for telecom and industrial applications.
Is AOB66914L suitable for use in synchronous rectification topologies, and what parameters support that use?
Yes, the AOB66914L is well-suited for synchronous rectification due to its low RDS(ON) (<2.7 mΩ), fast switching parameters (tD(on)=36 ns, tf=40 ns), and low Qgd/Qgs ratio (~0.65). These characteristics minimize conduction and switching losses in secondary-side rectifiers of isolated DC-DC converters. The AOB66914L's body diode performance (VSD=0.7–1.0 V, trr=55 ns) further supports robust freewheeling during dead-time intervals.
What is the total gate charge (Qg) specification for AOB66914L, and how does it impact gate driver selection?
The AOB66914L specifies total gate charge Qg as 155–220 nC at VGS=10V, per its electrical characteristics table. This range informs gate driver peak current requirements: for 50 ns turn-on time, a minimum 3–4.4 A peak driver is needed. The AOB66914L's Qg value directly affects switching loss and EMI behavior, making it essential for selecting drivers like the UCC27531 or MIC4606 in high-frequency power stages.
How is thermal performance characterized for AOB66914L, and what are the practical implications for PCB layout?
The AOB66914L has RθJC=0.40°C/W and RθJA=60°C/W (still air). For reliable operation, the PCB must provide ≥400 mm² of 2-oz copper connected to the exposed drain pad, with thermal vias to inner ground planes. The AOB66914L's low RθJC enables efficient heat transfer to an external heatsink, while its RθJA value sets the upper bound for natural-convection-only designs-requiring careful copper area allocation to avoid exceeding 175°C junction temperature.
AOB66914L Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Alpha & Omega Semiconductor Inc.
- Series:
- AlphaSGT™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 45A (Ta), 120A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 6V, 10V
- Rds On (Max) @ Id, Vgs:
- 3.5mOhm @ 20A, 6V
- Vgs(th) (Max) @ Id:
- 3.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 220 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 12500 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 10W (Ta), 375W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263 (D2PAK)
AOB66914L FAQ
1.How can I place an order for AOB66914L through Aetrix?
Please submit a Request for Quotation (RFQ) for AOB66914L on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AOB66914L reliable?
The price and inventory of AOB66914L are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AOB66914L is usually 5 days.
3.What payment methods are accepted for AOB66914L?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AOB66914L transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AOB66914L?
AOB66914L orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AOB66914L order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AOB66914L?
For technical support, including AOB66914L datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AOB66914L requirements.
6.How does Aetrix verify that AOB66914L is sourced from the original manufacturer or authorized distributors?
All AOB66914L products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AOB66914L meets industry standards.
7.What is the process for return or replacement of AOB66914L?
All AOB66914L units undergo pre-shipment inspection (PSI). If there is an issue with AOB66914L, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AOB66914L part is unused and in its original packaging.
Return procedure for AOB66914L:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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