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Alpha & Omega Semiconductor Inc. AOM060V65X2

Part No.:
AOM060V65X2
Manufacturer:
Alpha & Omega Semiconductor Inc.
Category:
FETs, MOSFETs
Package:
TO-247-4
Datasheet:
AetrixAOM060V65X2.pdf
Description:
650V SILICON CARBIDE MOSFET
Quantity:
Payment:
Payment
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Inventory:240

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Product details

Overview

AOM060V65X2 from Alpha and Omega Semiconductor is a 650 V, 60 mΩ silicon carbide (αSiC) power MOSFET in TO-247-4L package, rated for 90 A pulsed drain current and featuring ultra-low Qrr (51 nC), Eoss (12 µJ), and fast switching (tD(on) = 4.6 ns). It serves as a high-efficiency primary-side switching device in high-frequency, high-voltage DC-DC converters and solar inverters.

For engineers reviewing the AOM060V65X2 datasheet, pinout, applications, or equivalent options, key selection criteria include its 650 V VDS rating, 60 mΩ RDS(ON) at 15 V VGS, 175 °C maximum junction temperature, TO-247-4L 4-pin source–source–drain–gate configuration, and suitability for hard-switched 100 kHz+ topologies requiring low conduction and switching losses.

Technical Context

This αSiC MOSFET employs a proprietary silicon carbide die with optimized gate oxide and trench structure to deliver stable RDS(ON) over temperature (88 mΩ at 175 °C) and minimal threshold voltage drift (VGS(th) = 1.8–3.5 V). Its low Crss (16 pF) and RG (2.2 Ω) enable robust dV/dt immunity and precise gate control under high-speed operation.

The integrated ultra-fast body diode exhibits trr = 11 ns, Irm = 8 A, and Qrr = 51 nC at 400 V - enabling zero-voltage switching (ZVS) soft-recovery in bridge-leg configurations without external SiC Schottky anti-parallel diodes. Thermal performance is defined by RθJC = 1.20 °C/W and validated 100% UIS testing at 420 mJ.

Key Specifications

Parameter Value and Actual Design Meaning
VDS max 650 V - supports 400 V DC bus designs with 1.6× safety margin for transient overvoltage in EV charging and UPS systems.
RDS(ON) typ 60 mΩ at VGS = 15 V, TJ = 25 °C - enables <1.5 W conduction loss at 6 A continuous, critical for high-density power modules.
Qrr 51 nC - reduces reverse recovery loss and EMI in synchronous rectification and half-bridge LLC resonant converters.
Eoss 12 µJ at 400 V - lowers turn-on energy loss and improves efficiency in high-frequency hard-switched PFC stages.
tD(on) 4.6 ns - allows gate drive design with minimal dead-time overhead while maintaining shoot-through immunity.
RθJC 1.20 °C/W - supports >100 W continuous dissipation with standard heatsink mounting, verified per JEDEC JESD51-14.
IDM 90 A - sustains short-duration surge currents during motor startup or inverter fault conditions without latch-up.

Pinout & Package

TO-247-4L package with isolated source Kelvin connection: 4-terminal configuration optimizes gate drive stability and minimizes source inductance-induced oscillation during high di/dt switching.

Pin/Terminal Circuit Role Design Meaning
(1) D Drain Main high-side power terminal; electrically connected to tab; requires thermal interface to heatsink.
(2) S Power Source High-current source return path; bonded to main source metallization; carries full load current.
(3) K Kelvin Source Dedicated low-inductance source reference for gate driver feedback; decouples gate loop from power loop.
(4) G Gate Control input; designed for +15 V / −5 V operation; low RG (2.2 Ω) enables fast edge rates with minimal overshoot.

Key Features

Feature Design Value
αSiC technology Enables 650 V blocking with 60 mΩ RDS(ON) - 3× lower specific on-resistance than comparable Si MOSFETs, reducing die size and thermal stress.
Low RDS(ON) tempco RDS(ON) increases only 47% from 25 °C to 175 °C (60 → 88 mΩ), ensuring stable current sharing in paralleled configurations.
Optimized VGS(op) +15 V recommended gate drive - balances low RDS(ON), gate oxide reliability, and immunity to Miller-induced false turn-on.
Ultra-low Qrr 51 nC body diode charge - eliminates need for external SiC Schottky diodes in bidirectional switch applications like battery isolation.
100% UIS tested 420 mJ single-pulse avalanche energy - guarantees ruggedness against inductive switching transients without derating.

Applications

Solar Inverters EV DC Fast Charging

Use Scenario: High-efficiency 3-phase string inverters operating at 100–200 kHz with 1000 V DC input.

IC Role / Device Role / Timing Role: Primary-side SiC MOSFET in T-type NPC or three-level ANPC topology performing high-frequency hard switching.

Use Value: 60 mΩ RDS(ON) and 12 µJ Eoss reduce conduction and turn-on losses by >35% vs. 650 V Si IGBTs, enabling >99% peak efficiency.

Use Scenario: 15–350 kW modular AC/DC converter modules with active front-end rectifiers and isolated DC/DC stages.

IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier in 1 MHz+ LLC resonant DC/DC stage handling 400–1000 V output.

Use Value: 51 nC Qrr and 11 ns trr minimize reverse recovery loss and allow ZVS across full load range, improving thermal margin at 98% efficiency.

Industrial UPS Systems Energy Storage Bidirectional Converters

Use Scenario: Online double-conversion UPS with 400 V DC link and 50/60 Hz output, requiring high reliability and overload tolerance.

IC Role / Device Role / Timing Role: Inverter leg switch in three-phase IGBT/SiC hybrid H-bridge delivering clean sinusoidal output under nonlinear loads.

Use Value: 90 A IDM and 420 mJ UIS rating sustain 150% overload for 10 s without failure, meeting UL 1778 hold-time requirements.

Use Scenario: Grid-tied battery energy storage system (BESS) with 750 V nominal DC bus and bidirectional power flow (charge/discharge).

IC Role / Device Role / Timing Role: Bidirectional switch in dual-active-bridge (DAB) or cascaded H-bridge topology managing regenerative braking and grid export.

Use Value: Symmetrical 650 V VDS rating and low Qrr enable efficient reverse conduction during discharge cycles without body diode penalty.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage SiC MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
C3M0065065K 650 V, 65 mΩ, TO-247-4L, Qrr = 42 nC, RθJC = 1.3 °C/W Lower Qrr but higher RDS(ON); slightly reduced thermal performance Preferred where reverse recovery dominates loss budget, e.g., high-frequency PFC with light-load ZVS.
STW65N65DM6 650 V, 65 mΩ, TO-247-4L, Qrr = 58 nC, RθJC = 1.15 °C/W, 175 °C TJ max Higher Qrr but better thermal resistance; same gate drive compatibility Selected when thermal interface is constrained and junction temperature margin is prioritized over switching loss.

Compared with C3M0065065K and STW65N65DM6, the AOM060V65X2 delivers the lowest RDS(ON) among 650 V SiC MOSFETs in TO-247-4L, making it optimal for conduction-loss-limited designs such as high-current solar string inverters and industrial motor drives operating above 75 °C case temperature.

Availability

AOM060V65X2 is available at Aetrix Electronics and suitable for solar inverters, EV DC fast charging stations, and industrial UPS systems requiring stable component supply, long-term lifecycle support, and traceable sourcing from qualified wafer lots.

Supply support for AOM060V65X2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Alpha and Omega Semiconductor (AOS) is a fabless power semiconductor company specializing in high-performance MOSFETs, IGBTs, and SiC devices for power conversion and motor control.

The AOM060V65X2 belongs to AOS' αSiC family - engineered specifically for high-efficiency, high-reliability 650 V applications in renewable energy, EV infrastructure, and industrial power systems where thermal stability and switching speed are critical.

FAQ

What is the maximum recommended gate-source voltage for continuous operation of the AOM060V65X2?

The AOM060V65X2 has a recommended operating gate-source voltage range of −5 V to +15 V. This ensures reliable turn-off while minimizing gate oxide stress and preventing unintended turn-on due to Miller coupling. Exceeding +15 V risks long-term gate oxide degradation, and operation below −5 V may compromise noise immunity in high-dV/dt environments. The AOM060V65X2 datasheet specifies VGS,OP = −5/+15 V as the safe continuous operating window.

Does the AOM060V65X2 include an integrated body diode, and how does it perform in reverse conduction?

Yes, the AOM060V65X2 features an integrated ultra-fast SiC body diode with trr = 11 ns, Irm = 8 A, and Qrr = 51 nC at 400 V. Unlike silicon diodes, this body diode exhibits negligible reverse recovery tail and low forward voltage (VSD = 4–5 V at IS = 6 A), enabling efficient bidirectional conduction in bridge-leg and DAB topologies without external diodes. The AOM060V65X2 body diode is fully characterized and 100% tested per production lot.

What thermal resistance values define the AOM060V65X2's junction-to-case and junction-to-ambient performance?

The AOM060V65X2 has a maximum junction-to-case thermal resistance (RθJC) of 1.20 °C/W, measured under JEDEC-standard mounting conditions with a large heatsink. Its maximum junction-to-ambient resistance (RθJA) is 40 °C/W in still air - but this value is highly layout-dependent and intended only for comparative evaluation. For thermal design, engineers must use RθJC = 1.20 °C/W with actual heatsink thermal resistance to calculate real-world TJ rise. The AOM060V65X2 thermal data is validated per Note I in the datasheet.

Can the AOM060V65X2 be used in parallel configurations, and what design considerations apply?

Yes, the AOM060V65X2 supports paralleling due to its positive RDS(ON) temperature coefficient (60 → 88 mΩ from 25 °C to 175 °C) and low VGS(th) variation (1.8–3.5 V). To ensure current sharing, designers must match gate loop inductance, use individual gate resistors (RG,ON ≈ 2–5 Ω), and implement Kelvin source routing. Layout symmetry and thermal coupling are critical - the AOM060V65X2 datasheet provides layout guidelines for multi-device assemblies on Page 7.

Is the AOM060V65X2 suitable for unclamped inductive switching (UIS) applications, and what is its rated energy capability?

Yes, the AOM060V65X2 is 100% tested for unclamped inductive switching (UIS) with a single-pulse avalanche energy rating of 420 mJ under standardized test conditions (L = 5 mH, IAS = 13 A, RG = 10 Ω, TJ starting at 25 °C). This ruggedness enables reliable operation in flyback, forward, and LLC converters where inductive energy must be safely absorbed during fault or transient events. The AOM060V65X2 UIS performance is guaranteed per datasheet Section "Absolute Maximum Ratings".

AOM060V65X2 Specifications

Product attributes
Attribute value
Manufacturer:
Alpha & Omega Semiconductor Inc.
Series:
-
Package/Case:
TO-247-4
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
SiCFET (Silicon Carbide)
Drain to Source Voltage (Vdss):
650 V
Current - Continuous Drain (Id) @ 25°C:
29A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
15V
Rds On (Max) @ Id, Vgs:
80mOhm @ 6A, 15V
Vgs(th) (Max) @ Id:
3.5V @ 6mA
Gate Charge (Qg) (Max) @ Vgs:
39.4 nC @ 15 V
Vgs (Max):
+15V, -5V
Input Capacitance (Ciss) (Max) @ Vds:
1165 pF @ 400 V
FET Feature:
-
Power Dissipation (Max):
103W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-247-4L

AOM060V65X2 FAQ

1.How can I place an order for AOM060V65X2 through Aetrix?

Please submit a Request for Quotation (RFQ) for AOM060V65X2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AOM060V65X2 reliable?

The price and inventory of AOM060V65X2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AOM060V65X2 is usually 5 days.

3.What payment methods are accepted for AOM060V65X2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AOM060V65X2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AOM060V65X2?

AOM060V65X2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AOM060V65X2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AOM060V65X2?

For technical support, including AOM060V65X2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AOM060V65X2 requirements.

6.How does Aetrix verify that AOM060V65X2 is sourced from the original manufacturer or authorized distributors?

All AOM060V65X2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AOM060V65X2 meets industry standards.

7.What is the process for return or replacement of AOM060V65X2?

All AOM060V65X2 units undergo pre-shipment inspection (PSI). If there is an issue with AOM060V65X2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AOM060V65X2 part is unused and in its original packaging.

Return procedure for AOM060V65X2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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