Alpha & Omega Semiconductor Inc. AON1606
- Part No.:
- AON1606
- Manufacturer:
- Alpha & Omega Semiconductor Inc.
- Category:
- FETs, MOSFETs
- Package:
- 3-UFDFN
- Datasheet:
-
AON1606.pdf
- Description:
- MOSFET N-CH 20V 700MA 3DFN
- Quantity:
- Payment:

- Shipping:

Inventory:7,550
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AON1606 from Alpha & Omega Semiconductor is a 20V N-channel enhancement-mode trench MOSFET in a DFN 1.0×0.6 mm package, rated for 0.7A continuous drain current at VGS=4.5V, with RDS(ON) < 275 mΩ at 4.5V and < 390 mΩ at 1.8V, designed for low-voltage load switching in space-constrained portable electronics.
For engineers reviewing the AON1606 datasheet, pinout, applications, or equivalent options, key selection considerations include its ultra-compact DFN footprint, gate-threshold voltage range (0.3–1.0 V), HBM Class 1C ESD rating, body-diode forward voltage of 0.75–1.2 V, and thermal resistance of 80°C/W (RθJA, min pad).
Technical Context
The AON1606 employs advanced trench-gate silicon technology to achieve low on-resistance and fast switching performance in a thermally efficient DFN package. Its gate threshold voltage (0.3–1.0 V) enables direct interfacing with 1.8V logic, while its 2.8A pulsed drain current supports transient load demands.
Thermal design is constrained by RθJA values of 80–110°C/W (min pad) and 140–245°C/W (1-in² FR-4), requiring careful PCB copper layout for power dissipation up to 0.9W at TA=25°C. The device features integrated body diode with VSD=0.75–1.2V and reverse recovery charge not specified.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 20 V - Maximum drain-source blocking voltage; suitable for ≤12V rail switching with margin. |
| ID (VGS=4.5V) | 0.7 A - Continuous DC load current capability at standard logic-level drive; defines steady-state power delivery limit. |
| RDS(ON) (VGS=4.5V) | < 275 mΩ - On-resistance directly determines conduction loss (P = I²R) in load-switch applications. |
| VGS(th) | 0.3–1.0 V - Guaranteed turn-on with 1.8V logic; enables low-voltage control without level-shifting circuitry. |
| Qg | 0.85 nC - Total gate charge value governs required drive strength and switching speed in PWM or enable-controlled circuits. |
| RθJA (min pad) | 80 °C/W - Thermal resistance under minimal PCB copper; used to calculate junction temperature rise (ΔT = P × RθJA). |
| VSD | 0.75–1.2 V - Body-diode forward voltage; impacts reverse-current path loss and flyback energy handling. |
Pinout & Package
Package: DFN 1.0 × 0.6 mm, 3-terminal, bottom-exposed thermal pad (no internal thermal via required but recommended). Pin 1 = Gate, Pin 2 = Drain, Pin 3 = Source - confirmed per top/bottom view diagrams in Rev. 2.1 datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G | Gate | Control terminal; accepts 0–8V logic-level signals; threshold ensures compatibility with 1.8V/2.5V/3.3V microcontrollers. |
| D | Drain | High-side or low-side switched node; connects to input supply or load return; carries full load current and withstands 20V transients. |
| S | Source | Reference node for gate drive and current sensing; tied to system ground or load common; forms body-diode anode. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small DFN 1.0×0.6 mm footprint | Reduces PCB area by >50% vs. SOT-23; enables high-density battery-powered designs such as wearables and TWS earbuds. |
| Low VGS(th) (0.3–1.0 V) | Eliminates need for external gate drivers when controlled by 1.8V I/O; simplifies power sequencing in multi-rail systems. |
| RDS(ON) < 390 mΩ @ VGS=1.8V | Enables efficient operation directly from single-cell Li-ion (2.5–4.2V) or coin-cell sources without boost regulation. |
| HBM ESD rating Class 1C (±1 kV) | Provides robustness against handling-induced discharge during automated assembly and field operation in consumer environments. |
| Thermally enhanced bottom-exposed pad | Supports 0.9W power dissipation with minimal copper; allows reliable operation in sealed enclosures without forced airflow. |
Applications
| Battery Protection Circuit | USB Port Power Switch |
|---|---|
Use Scenario: Isolating main battery from backup rail during fault conditions or deep sleep mode in smart watches. IC Role / Device Role: Low-side load switch controlling battery discharge path; gate driven by fuel gauge IC's enable signal. Use Value: Sub-300 mΩ RDS(ON) minimizes voltage drop across protection FET, preserving battery runtime and enabling accurate voltage monitoring. | Use Scenario: Enabling/disabling 5V USB power delivery to peripherals in portable docking stations. IC Role / Device Role: High-side switch placed between USB VBUS and downstream load; controlled by USB controller GPIO. Use Value: 20V VDS rating provides margin against USB-C transient surges; compact DFN eases routing near USB connectors. |
| Wireless Earbud Charging Case | IoT Sensor Node Power Gating |
Use Scenario: Managing charging current flow from case battery to earbud PCB during magnetic induction charging cycles. IC Role / Device Role: Bidirectional load switch leveraging body diode for reverse current path during trickle-charge phases. Use Value: VSD = 0.75–1.2 V ensures low-loss reverse conduction; small footprint fits within tight 12×12 mm charging cavity. | Use Scenario: Cutting power to BLE radio and environmental sensors during deep-sleep intervals in battery-operated asset trackers. IC Role / Device Role: Low-quiescent-load switch isolating sensor subsystem; gate driven by MCU wake-up timer output. Use Value: VGS(th) ≤ 1.0 V guarantees turn-on with 1.8V MCU I/O; RDS(ON) < 275 mΩ limits leakage-induced voltage sag below 10 mV at 30 µA sleep current. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN1020UCB-7 | RDS(ON) = 200 mΩ @ 4.5V; slightly lower on-resistance but larger 1.2×0.8 mm DFN package. | Higher thermal mass improves pulse current handling but occupies ~33% more board area. | Prefer when peak load currents exceed 0.7A and PCB space permits larger footprint. |
| SI2302DS-T1-BE3 | VGS(th) = 0.4–1.2 V; higher threshold upper bound increases risk of incomplete turn-on at 1.8V. | Requires verification of gate drive margin in 1.8V systems; less robust for marginal logic levels. | Select only if existing 2.5V+ control rails exist and board area is highly constrained. |
Compared with DMN1020UCB-7 and SI2302DS-T1-BE3, the AON1606 delivers optimal balance of ultra-compact size, guaranteed 1.8V logic compatibility, and thermally efficient DFN construction-making it preferred for next-generation wearable and hearable power management where board real estate and low-voltage drive are critical.
Availability
AON1606 is available at Aetrix Electronics and suitable for battery protection circuits, USB power switches, wireless earbud charging cases, and IoT sensor node power gating requiring stable component supply and long-term lifecycle support.
Supply support for AON1606 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Alpha & Omega Semiconductor (AOS) is a fabless power semiconductor company specializing in high-efficiency MOSFETs, IGBTs, and power ICs for computing, consumer, and industrial markets.
The AON1606 belongs to AOS's low-voltage logic-level trench MOSFET product line, engineered specifically for space- and power-constrained portable electronics requiring minimal gate drive voltage and ultra-small packaging.
FAQ
What is the maximum continuous drain current rating for the AON1606?
The AON1606 is rated for 0.7 A continuous drain current at TA = 25°C with VGS = 4.5V. At TA = 70°C, the rating drops to 0.55 A due to thermal derating. This value is limited by package construction-not silicon capability-and assumes adequate PCB copper for heat dissipation. Always verify junction temperature using PD = ID² × RDS(ON) and ΔT = PD × RθJA in your layout when designing with the AON1606.
Can the AON1606 be driven directly by a 1.8V GPIO?
Yes, the AON1606 can be reliably driven by a 1.8V GPIO because its gate threshold voltage VGS(th) is specified from 0.3 V to 1.0 V, ensuring full enhancement at 1.8V. At VGS = 1.8V, RDS(ON) remains below 390 mΩ (typical 300 mΩ), supporting usable load current. No level shifter is needed-this is a core design feature of the AON1606 and is validated across process corners and temperature.
Does the AON1606 have built-in ESD protection?
Yes, the AON1606 includes on-chip ESD protection rated to Human Body Model (HBM) Class 1C, equivalent to ±1 kV. This protection is sufficient for standard handling and automated assembly in consumer electronics manufacturing. It does not meet higher-class requirements (e.g., Class 2 or 3) and should be supplemented with external TVS diodes in harsh ESD environments per IEC 61000-4-2 Level 4.
What is the thermal resistance RθJA of the AON1606 under typical PCB conditions?
The AON1606 has two RθJA specifications: 80–110°C/W for minimum-pad mounting (JEDEC-standard test board), and 140–245°C/W for 1-in² FR-4 with 2 oz copper. For most production designs, use 110°C/W as a conservative estimate with modest copper pour. The actual value depends entirely on your PCB layout-adding thermal vias under the exposed pad reduces RθJA by 15–30%. Always calculate TJ = TA + PD × RθJA using measured or simulated RθJA for the AON1606 in your specific board.
Is the AON1606 suitable for high-side switching applications?
Yes, the AON1606 is commonly used in high-side configurations-for example, as a USB VBUS switch-provided the gate is driven above the source potential (e.g., using a charge pump or bootstrap circuit). Its 20V VDS rating and low RDS(ON) make it well-suited for this role. However, since it is an N-channel device, it cannot be directly driven from ground-referenced logic in high-side position without level translation; the AON1606 itself does not integrate gate drive circuitry.
AON1606 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Alpha & Omega Semiconductor Inc.
- Series:
- -
- Package/Case:
- 3-UFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 700mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.5V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 275mOhm @ 400mA, 4.5V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.85 nC @ 4.5 V
- Vgs (Max):
- ±8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 62.5 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 900mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 3-DFN (1.0 x 0.60)
AON1606 FAQ
1.How can I place an order for AON1606 through Aetrix?
Please submit a Request for Quotation (RFQ) for AON1606 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AON1606 reliable?
The price and inventory of AON1606 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AON1606 is usually 5 days.
3.What payment methods are accepted for AON1606?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AON1606 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AON1606?
AON1606 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AON1606 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AON1606?
For technical support, including AON1606 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AON1606 requirements.
6.How does Aetrix verify that AON1606 is sourced from the original manufacturer or authorized distributors?
All AON1606 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AON1606 meets industry standards.
7.What is the process for return or replacement of AON1606?
All AON1606 units undergo pre-shipment inspection (PSI). If there is an issue with AON1606, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AON1606 part is unused and in its original packaging.
Return procedure for AON1606:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AON1606 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

