Alpha & Omega Semiconductor Inc. AONT21313C
- Part No.:
- AONT21313C
- Manufacturer:
- Alpha & Omega Semiconductor Inc.
- Category:
- FETs, MOSFETs
- Package:
- 6-UDFN Exposed Pad
- Datasheet:
-
AONT21313C.pdf
- Description:
- MOSFET P-CH 30V 8A 6DFN
- Quantity:
- Payment:

- Shipping:

Inventory:5,183
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Product details
Overview
AONT21313C from Alpha & Omega Semiconductor is a 30V P-Channel MOSFET optimized for notebook AC-in load switching and battery protection circuits, featuring RDS(ON) < 32 mΩ at VGS = −10 V, continuous drain current of −7.4 A, and DFN 2×2B package with thermal resistance RθJA = 80 °C/W.
For engineers reviewing the AONT21313C datasheet, pinout, applications, or equivalent options, key selection criteria include verified low-threshold gate drive compatibility (VGS(th) = −1.2 to −2.2 V), body-diode forward voltage (VSD = −0.8 to −1.0 V), and unclamped inductive switching robustness per AOS test conditions.
Technical Context
This device implements advanced trench-gate technology to achieve high channel density and low conduction loss in a thermally enhanced DFN package. Its negative threshold voltage enables direct interface with standard 3.3 V/5 V logic-level controllers without level-shifting circuitry.
The MOSFET supports bidirectional current flow in battery charge/discharge paths via its intrinsic body diode, with reverse recovery time trr = 12 ns and Qrr = 17 nC under IF = −7.4 A and di/dt = 500 A/ms - critical for minimizing switching losses in synchronous buck or OR-ing configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | −30 V maximum drain-source voltage - defines safe blocking capability in 12–24 V rail applications |
| ID (VGS = −10 V) | −7.4 A continuous drain current - supports high-side load switch designs up to ~2.7 W at TA = 25 °C |
| RDS(ON) (VGS = −10 V) | < 32 mΩ - enables ≤ 1.75 W conduction loss at full rated current |
| VGS(th) | −1.2 to −2.2 V - ensures reliable turn-on with 3.3 V GPIO or dedicated load-switch controllers |
| Qg(10 V) | 22–33 nC - determines gate-drive power and switching speed in 100–500 kHz DC/DC control loops |
| tr/tf | 9 ns / 19 ns - supports fast transition times with minimal overlap loss in hard-switched topologies |
| RθJA | 80 °C/W - requires ≥ 1 in² 2 oz copper pad for sustained 1.7 A operation at TA = 70 °C |
Pinout & Package
Package: DFN 2×2B (2 mm × 2 mm, 0.65 mm height, exposed drain pad on bottom). Pin 1 is marked by notch or dot; top view shows Source (S) at corner, Gate (G) adjacent, Drain (D) occupying remaining three terminals including exposed pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| S (Source) | Reference node for gate drive and current return path | Connected to system ground or battery negative in high-side switch configurations |
| G (Gate) | Control terminal for channel modulation | Requires <2.2 V negative bias relative to source to fully enhance; compatible with 3.3 V logic drivers |
| D (Drain) | Main current-carrying terminal with thermal pad | Exposed pad must be soldered to PCB ground plane for thermal and electrical performance |
Key Features
| Feature | Design Value |
|---|---|
| Advanced trench process | Enables sub-32 mΩ RDS(ON) in 2×2 mm footprint - reduces board area vs. SO-8 equivalents |
| Low gate threshold voltage | VGS(th) down to −1.2 V - eliminates need for external charge pump in USB-C PD or notebook load switches |
| High ESD rating | Class 2 HBM per JESD22-A114 - protects against handling damage during SMT assembly |
| RoHS & halogen-free | Complies with IPC-1752A material declaration requirements for industrial and computing end equipment |
Applications
| Notebook AC-In Load Switch | Battery Protection Circuit |
|---|---|
Use Scenario: Controls power delivery from AC adapter to system rail while isolating battery during charging. IC Role / Device Role / Timing Role: High-side P-Channel MOSFET acting as active OR-ing switch with reverse-current blocking. Use Value: RDS(ON) < 32 mΩ limits voltage drop to <230 mV at 7.4 A, preserving input regulation margin. | Use Scenario: Enables/disables charge and discharge paths between Li-ion cells and system load. IC Role / Device Role / Timing Role: Bidirectional current switch with integrated body diode supporting discharge and charge FET functions. Use Value: VSD = −0.8 to −1.0 V and trr = 12 ns minimize conduction and recovery losses during cell balancing cycles. |
| USB-C Power Delivery Input | Industrial 24 V DC Power Sequencing |
Use Scenario: Provides overvoltage and reverse-polarity protection at USB-C PD input stage before buck converter. IC Role / Device Role / Timing Role: Input protection switch with fast turn-off (tf = 19 ns) to limit fault energy during hot-plug events. Use Value: Qg(4.5 V) = 11–18 nC allows full turn-off within 1 μs using 20 mA gate driver - meets USB PD 3.0 fault response timing. | Use Scenario: Sequences power-up of multiple 24 V subsystems (e.g., PLC I/O, sensors, comms) with controlled inrush. IC Role / Device Role / Timing Role: Soft-start enabled load switch with gate-controlled slew rate via external RG. Use Value: Gate resistance RG = 11–18 Ω supports adjustable dV/dt control to limit peak inrush current to <10 A. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-Channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AON6254 | Same DFN 2×2B package; RDS(ON) = 28 mΩ @ −10 V but higher VGS(th) (−1.5 to −2.5 V); Qg = 25 nC | Marginally lower conduction loss but tighter gate drive tolerance; less suitable for 3.3 V-only systems | Select when prioritizing lowest RDS(ON) over gate drive simplicity |
| Si2301DDS | Smaller SOT-23 package; RDS(ON) = 115 mΩ @ −4.5 V; lower ID = −2.7 A; no exposed thermal pad | Limited to <1 W dissipation; unsuitable for >3 A continuous loads or thermally constrained layouts | Select only for space-constrained, low-power auxiliary rails where thermal performance is secondary |
Compared with AONT21313C, AON6254 offers slightly better conduction efficiency but narrower gate drive margin, while Si2301DDS trades significant RDS(ON) and thermal performance for ultra-compact size - making AONT21313C optimal for balanced 3–7 A load-switch designs requiring both efficiency and robust thermal management.
Availability
AONT21313C is available at Aetrix Electronics and suitable for notebook AC-in load switching, battery protection charge/discharge, USB-C power delivery input protection, and industrial 24 V DC power sequencing requiring stable component supply and long-term lifecycle support.
Supply support for AONT21313C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Alpha & Omega Semiconductor (AOS) is a fabless power semiconductor company specializing in high-efficiency MOSFETs, IGBTs, and power modules for computing, consumer, and industrial markets.
The AONT21313C belongs to AOS's advanced trench P-Channel MOSFET product line, engineered specifically for high-current, low-voltage load switching applications demanding minimal gate drive complexity and superior thermal performance in compact packages.
FAQ
What is the maximum continuous drain current rating for AONT21313C at 70°C ambient temperature?
The AONT21313C supports −1.7 A continuous drain current at TA = 70°C with standard PCB layout (1 in² 2 oz copper). This derating reflects thermal limits imposed by its RθJA = 80 °C/W and TJ(MAX) = 150°C. At TA = 25°C, the rating increases to −7.4 A. Designers must verify actual board thermal performance using the normalized transient impedance curve (Figure 11) for pulsed operation.
Does AONT21313C support logic-level gate drive from a 3.3 V microcontroller?
Yes, AONT21313C supports direct 3.3 V logic-level gate drive due to its VGS(th) range of −1.2 to −2.2 V. At VGS = −3.3 V, RDS(ON) remains below 55 mΩ (per Figure 5), enabling usable conduction. However, full −7.4 A capability requires VGS ≤ −4.5 V; for robust 3.3 V-only operation, confirm system-level margin using the transfer characteristics in Figure 2.
What is the body diode forward voltage specification for AONT21313C?
The AONT21313C body diode forward voltage VSD is specified as −0.8 V (typical) to −1.0 V (maximum) at IS = −1 A and TJ = 25°C (per Electrical Characteristics table). This low VSD minimizes conduction loss during reverse-current conditions in battery protection and OR-ing applications, and is validated across temperature in Figure 6.
Can AONT21313C be used in unclamped inductive switching (UIS) applications?
Yes, AONT21313C is characterized for unclamped inductive switching per AOS test methodology (Page 5 schematic). Its BVDSS = −30 V and energy rating support single-pulse UIS events up to EAS ≈ 35 mJ (derived from Figure 9 SOA and BVDSS). Designers must limit peak current and pulse width per the Safe Operating Area curve to avoid junction overheating during fault conditions.
Is the DFN 2×2B package of AONT21313C lead-free and RoHS compliant?
Yes, the AONT21313C DFN 2×2B package is fully RoHS compliant and halogen-free per IPC-1752A requirements, as confirmed in the Product Summary and Absolute Maximum Ratings section. The device uses matte tin (Sn) lead finish and meets JEDEC J-STD-020 moisture sensitivity level 1 (MSL-1), allowing unlimited floor life at ≤ 30°C/60% RH.
AONT21313C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Alpha & Omega Semiconductor Inc.
- Series:
- -
- Package/Case:
- 6-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 8A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 32mOhm @ 8A, 10V
- Vgs(th) (Max) @ Id:
- 2.3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 14.5 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 530 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.8W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-DFN (2x2)
AONT21313C FAQ
1.How can I place an order for AONT21313C through Aetrix?
Please submit a Request for Quotation (RFQ) for AONT21313C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AONT21313C reliable?
The price and inventory of AONT21313C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AONT21313C is usually 5 days.
3.What payment methods are accepted for AONT21313C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AONT21313C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AONT21313C?
AONT21313C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AONT21313C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AONT21313C?
For technical support, including AONT21313C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AONT21313C requirements.
6.How does Aetrix verify that AONT21313C is sourced from the original manufacturer or authorized distributors?
All AONT21313C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AONT21313C meets industry standards.
7.What is the process for return or replacement of AONT21313C?
All AONT21313C units undergo pre-shipment inspection (PSI). If there is an issue with AONT21313C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AONT21313C part is unused and in its original packaging.
Return procedure for AONT21313C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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