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Infineon Technologies BSC014N04LSTATMA1

Part No.:
BSC014N04LSTATMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-PowerTDFN
Datasheet:
AetrixBSC014N04LSTATMA1.pdf
Description:
MOSFET N-CH 40V 33A/100A TDSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,834

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Product details

Overview

BSC014N04LSTATMA1 from Infineon Technologies is an N-channel logic-level Power-MOSFET optimized for synchronous rectification in high-efficiency DC-DC converters, featuring 40 V VDS, 1.4 mΩ RDS(on) (max @ VGS=10 V), 205 A continuous drain current (TC=25 °C), 175 °C rated junction temperature, and TDSON-8 FL package with enlarged source interconnection.

For engineers reviewing the BSC014N04LSTATMA1 datasheet, BSC014N04LSTATMA1 pinout, BSC014N04LSTATMA1 application, or BSC014N04LSTATMA1 equivalent, key selection criteria include low RDS(on) at 4.5 V gate drive, 100% avalanche tested ruggedness, superior thermal resistance (RthJC = 0.8 K/W), and JEDEC-qualified reliability for industrial and server power supplies.

Technical Context

This OptiMOSTM device employs trench-gate superjunction technology to achieve ultra-low on-resistance while maintaining fast switching performance-Qg = 61 nC (0–10 V), Qgd = 9.8–14 nC, and tf = 7 ns-enabling high-frequency operation in synchronous buck converters and OR-ing circuits.

Its integrated body diode exhibits low VSD = 0.82 V (typ @ IF = 50 A, Tj = 25 °C) and fast reverse recovery (trr = 32–64 ns), supporting efficient zero-voltage switching (ZVS) and minimizing commutation losses in multiphase VRMs.

Key Specifications

ParameterValue and Actual Design Meaning
VDS40 V - Maximum blocking voltage compatible with 12 V/48 V intermediate bus architectures
RDS(on) max1.4 mΩ @ VGS = 10 V - Enables <1 W conduction loss at 200 A in high-current CPU/GPU VRMs
ID cont.205 A @ TC = 25 °C - Supports >300 W per phase in compact, air-cooled server power stages
Qg61 nC @ 0–10 V - Balances gate drive loss and switching speed for 500 kHz–1 MHz operation
RthJC0.8 K/W typ - Delivers high thermal efficiency via bottom-side cooling in thermally enhanced PCB layouts
Tj max175 °C - Allows sustained operation under transient overload conditions in industrial environments
Qoss54 nC - Reduces turn-off energy and improves light-load efficiency in resonant topologies

Pinout & Package

Package: TDSON-8 FL (Thin Dual Small Outline No-lead, Flat Lead), 5.15 mm × 6.15 mm footprint, exposed drain pad on bottom for thermal conduction and enlarged source interconnection to reduce parasitic inductance.

Pin/TerminalCircuit RoleDesign Meaning
D (Pins 1–5)DrainCommon drain connection across 5 pins; electrically tied to exposed thermal pad for low-inductance, high-current path
S (Pins 6–8)SourceThree-source-pin configuration with enlarged copper area minimizes source inductance for stable synchronous FET control
G (Pin 4)GateSingle gate input with 0.9 Ω typical gate resistance-optimized for direct drive from standard PWM controllers without external gate resistor

Key Features

FeatureDesign Value
Optimized for synchronous rectificationLow Qg/Qgd ratio and fast tf enable precise timing control and reduced shoot-through risk in high-side/low-side configurations
100% avalanche testedRated for single-pulse IAS = 50 A and EAS = 170 mJ-ensures robustness against inductive switching transients in unregulated loads
Logic-level gate driveVGS(th) = 1.2–2.0 V enables full enhancement with 3.3 V or 5 V controllers, eliminating need for level shifters
JEDEC-qualified reliabilityComplies with J-STD-020 (reflow) and JESD22-A108 (temperature cycling)-validated for automotive-grade production use
Halogen-free & RoHS compliantMeets IEC61249-2-21 and EU RoHS Directive 2011/65/EU-supports green manufacturing and end-of-life compliance

Applications

Server VRM Phase LegsIndustrial DC-DC Converters

Use Scenario: High-current, multi-phase buck converters supplying CPUs and ASICs in cloud data centers.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier FET operating at 500 kHz–1 MHz with tight dead-time control.

Use Value: 1.4 mΩ RDS(on) reduces conduction loss by >40% vs. legacy 2.5 mΩ devices, enabling >95% efficiency at 200 A output.

Use Scenario: 48 V-to-12 V isolated DC-DC modules in factory automation PLCs and motor drives.

IC Role / Device Role / Timing Role: Primary-side synchronous rectifier in active-clamp forward or LLC secondary-side rectification.

Use Value: 175 °C rating and 100% avalanche test ensure reliable operation during line surges and short-circuit events in harsh industrial environments.

OR-ing ControllersTelecom Rectifier Modules

Use Scenario: Redundant 48 V power feeds in telecom base stations and edge computing nodes.

IC Role / Device Role / Timing Role: Back-to-back configured N-channel MOSFET for hot-swap and reverse-current blocking.

Use Value: Ultra-low RDS(on) minimizes voltage drop (<30 mV @ 100 A), preserving system voltage margin and reducing heat sink size.

Use Scenario: High-density 48 V rectifier modules delivering >1 kW in centralized telecom power systems.

IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier in full-bridge or center-tapped transformer designs.

Use Value: Enlarged source interconnection lowers layout-induced ringing, improving EMI performance and enabling smaller input filter components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IPB017N04LGATMA1RDS(on) = 1.7 mΩ (max), Qg = 52 nC, same TDSON-8 FL packageSlightly higher conduction loss but lower gate charge-better for very high-frequency (>1 MHz) soft-switching designsSelect when prioritizing gate drive efficiency over absolute lowest RDS(on) in resonant topologies
STL220N4F7AGRDS(on) = 1.35 mΩ (max), Qg = 72 nC, PowerFLAT 5×6 package with different pinoutLower RDS(on) but higher Qg and non-drop-in footprint-requires PCB redesign and gate driver re-evaluationChoose only if board revision allows package change and thermal design accommodates higher switching loss

Compared with IPB017N04LGATMA1 and STL220N4F7AG, BSC014N04LSTATMA1 delivers the best balance of ultra-low RDS(on) and moderate Qg, making it optimal for high-current, medium-frequency VRMs where conduction loss dominates total power loss.

Availability

BSC014N04LSTATMA1 is available at Aetrix Electronics and suitable for server VRMs, industrial DC-DC converters, and telecom rectifier modules requiring stable component supply, long-term lifecycle support, and traceable sourcing for high-volume production.

Supply support for BSC014N04LSTATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global R&D and wafer fabrication infrastructure.

This part belongs to the OptiMOSTM 40 V logic-level Power-MOSFET product line, engineered specifically for high-efficiency synchronous rectification in next-generation server, telecom, and industrial power supplies.

FAQ

What is the maximum continuous drain current at 100 °C case temperature?

The BSC014N04LSTATMA1 supports 145 A continuous drain current at TC = 100 °C with VGS = 10 V, as specified in Table 2 of the datasheet. This derating reflects thermal limits under real-world heatsink conditions and must be verified against actual PCB thermal design using RthJC = 0.8 K/W.

Is this MOSFET suitable for 3.3 V gate drive applications?

Yes-its logic-level VGS(th) range of 1.2–2.0 V ensures full enhancement at 3.3 V gate drive, and RDS(on) remains low at 1.9 mΩ (max) with VGS = 4.5 V. However, conduction loss increases ~35% versus 10 V drive, so thermal validation is required at full load.

Does the TDSON-8 FL package require solder paste stencil adjustments?

Yes-the enlarged source interconnection and exposed drain pad demand a custom stencil aperture design: 80–90% area ratio for the thermal pad and separate, optimized openings for source/drain terminals to ensure void-free solder joints and mechanical reliability per IPC-7095 guidelines.

How does its body diode performance compare to discrete Schottky alternatives?

The integrated body diode has VSD = 0.82 V (typ) and trr = 32–64 ns-higher forward drop than Schottky diodes but eliminates external component count and layout complexity. It is optimized for synchronous operation, not freewheeling, and should not be used as a standalone rectifier.

BSC014N04LSTATMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
8-PowerTDFN
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
40 V
Current - Continuous Drain (Id) @ 25°C:
33A (Ta), 100A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
1.4mOhm @ 50A, 10V
Vgs(th) (Max) @ Id:
2V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
85 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
6020 pF @ 20 V
FET Feature:
-
Power Dissipation (Max):
3W (Ta), 115W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TDSON-8 FL

BSC014N04LSTATMA1 FAQ

1.How can I place an order for BSC014N04LSTATMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSC014N04LSTATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSC014N04LSTATMA1 reliable?

The price and inventory of BSC014N04LSTATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSC014N04LSTATMA1 is usually 5 days.

3.What payment methods are accepted for BSC014N04LSTATMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSC014N04LSTATMA1 transactions.

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4.How is shipping managed for BSC014N04LSTATMA1?

BSC014N04LSTATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSC014N04LSTATMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSC014N04LSTATMA1?

For technical support, including BSC014N04LSTATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSC014N04LSTATMA1 requirements.

6.How does Aetrix verify that BSC014N04LSTATMA1 is sourced from the original manufacturer or authorized distributors?

All BSC014N04LSTATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSC014N04LSTATMA1 meets industry standards.

7.What is the process for return or replacement of BSC014N04LSTATMA1?

All BSC014N04LSTATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSC014N04LSTATMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSC014N04LSTATMA1 part is unused and in its original packaging.

Return procedure for BSC014N04LSTATMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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