Infineon Technologies BSC020N03LSGATMA1
- Part No.:
- BSC020N03LSGATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
BSC020N03LSGATMA1.pdf
- Description:
- MOSFET N-CH 30V 28A/100A TDSON
- Quantity:
- Payment:

- Shipping:

Inventory:17,249
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Product details
Overview
BSC020N03LSGATMA1 from Infineon Technologies is an N-channel logic-level Power-MOSFET in the OptiMOS™ 3 family, rated for 30 V drain-source voltage and delivering 2 mΩ typical RDS(on) at VGS = 10 V. It supports continuous drain current up to 176 A at TC = 25 °C and is optimized for high-efficiency DC/DC converters and synchronous rectification in server VRMs and telecom power supplies.
For engineers reviewing the BSC020N03LSGATMA1 datasheet, BSC020N03LSGATMA1 pinout, BSC020N03LSGATMA1 application, or BSC020N03LSGATMA1 equivalent, key selection criteria include its ultra-low gate charge × RDS(on) figure of merit, avalanche rating, JEDEC-qualified reliability, and SuperSO8 package thermal performance.
Technical Context
This MOSFET employs trench-based silicon technology with optimized cell pitch and reduced parasitic capacitances to achieve fast switching (td(on) = 11 ns, td(off) = 42 ns) and low conduction loss. Its gate threshold voltage (1–2.2 V) ensures robust logic-level drive compatibility with standard 3.3 V and 5 V controllers.
The device integrates a co-packaged body diode with Qrr = 25 nC and VSD = 0.8–1.1 V at IF = 30 A, enabling efficient synchronous FET operation in buck converters and OR-ing circuits without external Schottky diodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum blocking voltage for 12 V and 24 V input rail applications |
| RDS(on), max | 2.3 mΩ at VGS = 4.5 V - Enables <1 W conduction loss at 30 A in compact VRMs |
| ID, cont | 176 A at TC = 25 °C - Supports high-current CPU/GPU power stages with minimal parallel devices |
| Qg | 45 nC at VGS = 0–10 V - Low gate drive power requirement for high-frequency (>1 MHz) operation |
| RthJC | 1.3 K/W - Enables direct heatsink mounting for >90 W power dissipation in SuperSO8 footprint |
| EAS | 180 mJ - Withstands single-pulse inductive energy in hard-switched topologies |
| VGS(th) | 1–2.2 V - Ensures turn-on with standard logic-level PWM controllers (e.g., TI UCCx series) |
Pinout & Package
Package: PG-TDSON-8 (SuperSO8), 5.15 mm × 6.2 mm × 1.27 mm, exposed drain pad on bottom side for thermal and electrical connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, S | Source | Common source node; pins 1–3 and pin S (pin 8) are internally connected to source metallization |
| 4, G | Gate | Control terminal; low input capacitance (Ciss = 7200 pF) enables stable gate drive with 1.6 Ω resistor |
| 5, 6, 7, D | Drain | Main power path; pins 5–7 and bottom thermal pad form low-inductance, high-current drain connection |
| 8, S | Source | Secondary source terminal; electrically identical to pins 1–3, used for Kelvin sensing or layout symmetry |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Operates fully enhanced at VGS ≥ 4.5 V, eliminating need for gate boosters in 5 V control systems |
| Optimized FOM (Qg × RDS(on)) | 90 nC·mΩ - Reduces combined switching + conduction loss in high-frequency SMPS |
| Avalanche-rated | Rated for repetitive unclamped inductive switching (UIS) with EAS = 180 mJ - improves system robustness without snubbers |
| SuperSO8 thermal design | 1.3 K/W junction-to-case (bottom) - allows >96 W continuous power dissipation with proper heatsinking |
| RoHS & halogen-free | Pb-free plating and compliant with IEC61249-2-21 - meets global environmental compliance requirements |
Applications
| Server VRM High-Side Switch | Telecom DC/DC Primary Switch |
|---|---|
Use Scenario: High-current, high-frequency buck converter supplying CPU core voltage in 1U rack servers. IC Role / Device Role / Timing Role: High-side synchronous MOSFET switching at 500 kHz–1 MHz with precise dead-time control. Use Value: 2.3 mΩ RDS(on) and 45 nC Qg reduce total power loss by ~18% vs. legacy 3.5 mΩ alternatives at 150 A load. | Use Scenario: 48 V to 12 V intermediate bus converter in 5G base station power modules. IC Role / Device Role / Timing Role: Primary-side switching element in hard-switched forward or active-clamp topology. Use Value: Avalanche rating and 180 mJ EAS eliminate need for external clamping circuits under transient overloads. |
| OR-ing Controller FET | Industrial Motor Drive Half-Bridge |
Use Scenario: Redundant 12 V power supply backplane with automatic failover using ideal diode control. IC Role / Device Role / Timing Role: Low-VDS synchronous rectifier replacing Schottky diode in bidirectional OR-ing path. Use Value: Body diode VSD = 0.8 V and Qrr = 25 nC minimize reverse recovery loss and thermal stress during switchover. | Use Scenario: 24 V BLDC motor inverter stage for factory automation actuators. IC Role / Device Role / Timing Role: Low-side switch in half-bridge configuration driving 10–20 A phase current. Use Value: 176 A ID rating and 1.3 K/W RthJC support burst-mode operation with peak currents >100 A without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level Power-MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLHS6342TRPBF | RDS(on) = 3.2 mΩ @ 4.5 V; Qg = 24 nC; SO-8 package | Lower current rating (100 A) and higher RDS(on) limit use to ≤60 A loads | Preferred where board space is constrained and thermal budget allows higher conduction loss |
| DMTH3016LPS-13 | RDS(on) = 1.6 mΩ @ 4.5 V; Qg = 52 nC; PowerDI5060 package | Higher gate charge increases driver loss; no avalanche rating specified | Selected when lowest possible RDS(on) dominates over switching loss and ruggedness requirements |
Compared with IRLHS6342TRPBF and DMTH3016LPS-13, BSC020N03LSGATMA1 uniquely balances ultra-low RDS(on), moderate Qg, full avalanche capability, and JEDEC qualification-making it optimal for mission-critical 12–24 V industrial and telecom power stages.
Availability
BSC020N03LSGATMA1 is available at Aetrix Electronics and suitable for server VRMs, telecom DC/DC converters, and industrial motor drives requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for BSC020N03LSGATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and industrial control ICs, with over 30 years of MOSFET innovation.
This part belongs to the OptiMOS™ 3 generation-designed specifically for high-efficiency, high-density DC/DC conversion in datacenter, telecom, and industrial power systems where thermal performance and switching speed are critical.
FAQ
What is the maximum recommended gate drive voltage for BSC020N03LSGATMA1?
The absolute maximum gate-source voltage is ±20 V, but the device is characterized and optimized for operation at VGS = 4.5 V (logic level) and 10 V (standard enhancement). Driving above 12 V provides negligible RDS(on) improvement while increasing gate oxide stress and ESD risk; 10 V is the recommended maximum for reliable long-term operation.
Can BSC020N03LSGATMA1 be used in parallel configurations?
Yes-its positive temperature coefficient of RDS(on) (increasing with junction temperature) enables inherently stable current sharing. Layout must ensure matched gate drive paths and symmetrical drain/source routing; thermal coupling via shared heatsink further improves balance. Derating to 80% of total rated current per device is advised for >3-device parallel arrays.
Is the body diode suitable for synchronous rectification?
Yes-the integrated body diode has VSD = 0.8–1.1 V at 30 A and Qrr = 25 nC, making it viable for synchronous rectification in buck converters up to 1 MHz. However, for highest efficiency, external Schottky or GaN FETs may be preferred in ultra-low-voltage (<1 V) outputs due to lower forward drop.
Does BSC020N03LSGATMA1 require a gate resistor for stability?
A gate resistor (typically 1.6 Ω) is recommended to dampen ringing caused by gate loop inductance and Miller capacitance interaction. The datasheet specifies switching times (td(on), tr, etc.) with RG = 1.6 Ω; omitting it risks shoot-through in half-bridge configurations and excessive dv/dt-induced false triggering.
BSC020N03LSGATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 28A (Ta), 100A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 2mOhm @ 30A, 10V
- Vgs(th) (Max) @ Id:
- 2.2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 93 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 7200 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta), 96W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TDSON-8-1
BSC020N03LSGATMA1 FAQ
1.How can I place an order for BSC020N03LSGATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSC020N03LSGATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSC020N03LSGATMA1 reliable?
The price and inventory of BSC020N03LSGATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSC020N03LSGATMA1 is usually 5 days.
3.What payment methods are accepted for BSC020N03LSGATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSC020N03LSGATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSC020N03LSGATMA1?
BSC020N03LSGATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSC020N03LSGATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSC020N03LSGATMA1?
For technical support, including BSC020N03LSGATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSC020N03LSGATMA1 requirements.
6.How does Aetrix verify that BSC020N03LSGATMA1 is sourced from the original manufacturer or authorized distributors?
All BSC020N03LSGATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSC020N03LSGATMA1 meets industry standards.
7.What is the process for return or replacement of BSC020N03LSGATMA1?
All BSC020N03LSGATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSC020N03LSGATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSC020N03LSGATMA1 part is unused and in its original packaging.
Return procedure for BSC020N03LSGATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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