Infineon Technologies BSC072N04LDATMA1

Overview

BSC072N04LDATMA1 from Infineon Technologies is a dual N-channel logic-level MOSFET in PG-TDSON-8-4 package, rated for 40 V V_DS, 7.2 mΩ R_DS(on) at V_GS = 10 V, and 20 A continuous drain current. It is optimized for synchronous rectification and fast-switching SMPS topologies in industrial power supplies and DC-DC converters.

For engineers reviewing the BSC072N04LDATMA1 datasheet, BSC072N04LDATMA1 pinout, BSC072N04LDATMA1 application, or BSC072N04LDATMA1 equivalent, key selection criteria include its dual-channel layout, low gate charge (Q_g = 39–52 nC), avalanche-rated ruggedness (E_AS = 87 mJ), and thermal resistance (R_thJC = 2.3 °C/W).

Technical Context

This dual MOSFET integrates two independent N-channel silicon devices on a single die with shared source terminals configured as S1/G1/S2/G2/D1/D1/D2/D2 in TDSON-8-4. Its OptiMOSTM-T2 process delivers enhanced switching speed via low C_iss (3070–3990 pF) and C_rss (36–72 pF), enabling high-frequency operation up to several hundred kHz in resonant and hard-switched topologies.

The device supports logic-level drive (V_GS(th) = 1.2–2.2 V) and exhibits stable R_DS(on) over temperature (normalized to 1.5× at 175 °C). Its integrated body diode features low V_SD (0.85–1.1 V at 17 A) and fast reverse recovery (t_rr = 35 ns, Q_rr = 35 nC), critical for synchronous rectifier efficiency.

Key Specifications

Pinout & Package

Package: PG-TDSON-8-4 (exposed drain pad, 5 mm × 6 mm footprint, 0.95 mm height), thermally enhanced surface-mount package with bottom-side thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel MOSFET applications.

Compared with IPB80N04S4-02 and IRF7341PBF, BSC072N04LDATMA1 uniquely balances dual-channel integration, 7.2 mΩ conduction loss, and 2.3 °C/W thermal resistance-making it optimal for space- and efficiency-critical 20 A industrial SMPS where single-device replacement would increase layout complexity or thermal risk.

Availability

BSC072N04LDATMA1 is available at Aetrix Electronics and suitable for server VRMs, industrial DC-DC converters, PoE++ PSEs, and BLDC motor drives requiring stable component supply and JEDEC-qualified industrial reliability.

Supply support for BSC072N04LDATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and qualification infrastructure.

BSC072N04LDATMA1 belongs to the OptiMOSTM-T2 power transistor family, engineered specifically for high-efficiency, high-frequency switching in industrial and telecom power conversion systems where thermal density and avalanche robustness are critical.

FAQ

What is the maximum operating junction temperature for BSC072N04LDATMA1?

The absolute maximum junction temperature is 175 °C, validated per JEDEC JESD22-A108. Continuous operation at this limit requires strict thermal design: PCB copper area ≥6 cm², ambient ≤75 °C, and case temperature maintained ≤100 °C using thermal vias and ground-plane coupling.

Does BSC072N04LDATMA1 support 3.3 V logic-level gate drive?

Yes-its gate threshold voltage ranges from 1.2 V to 2.2 V, ensuring full enhancement at V_GS = 3.3 V. At 10 A drain current, R_DS(on) is 8.0 mΩ (max) at V_GS = 4.5 V and 7.2 mΩ at V_GS = 10 V, confirming reliable switching with standard 3.3 V microcontrollers.

How is the dual-channel configuration wired in a half-bridge?

In half-bridge mode, G1 and S1 form the high-side switch (D1 connected to input rail), while G2 and S2 form the low-side switch (S2 tied to ground). D1 and D2 are separate drain terminals; the output node connects between S1 and S2. No internal connection exists between the two channels' sources or drains.

Is the exposed drain pad electrically connected to all drain pins?

Yes-the exposed thermal pad on the underside of the PG-TDSON-8-4 package is internally connected to both D1 and D2 terminals. It must be soldered to a large PCB copper pour tied to the system drain net to achieve specified R_thJC = 2.3 °C/W and ensure mechanical reliability.