My Inquiry
My Account
Infineon Technologies BSD840NH6327XTSA1
- Part No.:
- BSD840NH6327XTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FET, MOSFET Arrays
- Package:
- 6-VSSOP, SC-88, SOT-363
- Datasheet:
-
BSD840NH6327XTSA1.pdf
- Description:
- MOSFET 2N-CH 20V 0.88A SOT363
- Quantity:
- Payment:
- Shipping:
Inventory:50,426
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BSD840NH6327XTSA1 from Infineon Technologies is a dual N-channel enhancement-mode MOSFET in PG-SOT-363 package, rated for 20 V VDS, 0.88 A continuous drain current, and ultra-low 1.8 V logic-level gate drive. It features avalanche rating, AEC-Q101 qualification, and 560 mΩ RDS(on) at VGS = 1.8 V, enabling compact load switching in automotive body electronics and portable power management.
For engineers reviewing the BSD840NH6327XTSA1 datasheet, BSD840NH6327XTSA1 pinout, BSD840NH6327XTSA1 application, or BSD840NH6327XTSA1 equivalent, key selection criteria include logic-level compatibility with 1.8 V microcontrollers, dual-channel integration for space-constrained PCBs, thermal resistance of 250 K/W on minimal FR4 footprint, and AEC-Q101 compliance for automotive-grade reliability.
Technical Context
This dual N-channel MOSFET operates in enhancement mode with independent gate control per channel, supporting discrete load switching without internal cross-coupling. Its ultra-low gate threshold (0.3–0.75 V) and 1.8 V-rated logic interface enable direct drive from low-voltage MCUs and PMICs.
The device integrates an intrinsic body diode with 0.94–1.1 V forward voltage at 0.88 A and 5.3 ns reverse recovery time, suitable for freewheeling and bidirectional current paths in DC-DC converters and LED drivers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 20 V - supports 12 V automotive and 5 V/3.3 V system rails with margin |
| RDS(on) @ VGS=1.8 V | 560 mΩ - enables efficient switching at ultra-low logic levels |
| ID continuous | 0.88 A @ TA=25°C - suitable for individual loads like sensors or LEDs |
| EAS | 1.6 mJ - provides single-pulse avalanche robustness for inductive load transients |
| Qg total | 0.26 nC - ensures fast, low-power gate driving with minimal MCU GPIO loading |
| RthJA | 250 K/W - defines thermal derating on standard 40 mm² FR4 PCB with 1 mm traces |
| trr | 5.3 ns - reduces switching losses and EMI in high-frequency PWM applications |
Pinout & Package
Package: PG-SOT-363 (6-pin, 2.1 × 2.0 × 0.95 mm), surface-mount, lead-free, halogen-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Source 1 | Return path for first N-channel channel; tied to common ground or local return |
| 2 | Gate 1 | Control input for first MOSFET; accepts 1.8 V logic-level signals |
| 3 | Drain 1 | Switched output node for first channel; connects to load anode or rail |
| 4 | Drain 2 | Switched output node for second channel; electrically isolated from Drain 1 |
| 5 | Gate 2 | Control input for second MOSFET; independently driven from Gate 1 |
| 6 | Source 2 | Return path for second N-channel channel; may be tied to Source 1 or kept separate |
Key Features
| Feature | Design Value |
|---|---|
| Dual N-channel integration | Two independent logic-level MOSFETs in one SOT-363 package, reducing board area by ~40% vs. discrete singles |
| AEC-Q101 qualification | Validated for automotive ambient temperatures (−40°C to +150°C) and mechanical stress, enabling use in body control modules |
| Ultra-low VGS(th) | 0.3–0.75 V range ensures reliable turn-on even with weak or aged gate drive sources |
| 100% lead-free & halogen-free | Complies with RoHS Directive 2011/65/EU and IEC61249-2-21, supporting green manufacturing |
| Body diode with low Qrr | 0.82 nC reverse recovery charge minimizes shoot-through risk and conduction loss in synchronous rectification |
Applications
| Automotive Interior Lighting | USB Power Switching |
|---|---|
Use Scenario: Driving multiple LED strings in door panels and footwells using PWM dimming from a 3.3 V MCU. IC Role / Device Role / Timing Role: Dual-channel load switch controlling cathode-side current paths; each channel handles up to 0.5 A LED string. Use Value: 1.8 V gate compatibility eliminates level-shifting; 560 mΩ RDS(on) limits self-heating to <15°C rise at 0.5 A on minimal PCB copper. | Use Scenario: Enabling/disabling VBUS power to USB peripherals in portable infotainment systems. IC Role / Device Role / Timing Role: High-side power switch with controlled inrush; dual configuration allows independent port control. Use Value: 20 V VDS rating accommodates 5.5 V VBUS tolerance; 0.26 nC Qg enables sub-µs turn-on for hot-plug response. |
| Industrial Sensor Interface | Low-Power IoT Actuation |
Use Scenario: Isolating analog sensor supply rails (e.g., pressure, temperature) from shared 3.3 V domain during sleep cycles. IC Role / Device Role / Timing Role: Low-leakage power gate; dual channels manage sensor bias and signal conditioning blocks separately. Use Value: 1 µA IDSS at 25°C and 100 µA at 150°C ensure stable bias shutdown; 250 K/W RthJA permits operation in sealed enclosures. | Use Scenario: Driving small solenoids or buzzers in battery-powered smart locks and asset trackers. IC Role / Device Role / Timing Role: Logic-level actuator driver with integrated body diode for inductive kickback clamping. Use Value: 1.6 mJ EAS withstands repeated 100 mA solenoid de-energization; 5.3 ns trr suppresses voltage spikes above 20 V. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BSS138DW-7-F (Diodes Inc.) | 30 V VDS, 220 mΩ RDS(on) @ 4.5 V, but only 1.5 V min VGS(th); not AEC-Q101 qualified | Lacks automotive qualification and 1.8 V drive capability; higher RDS(on) at low VGS | Select when higher VDS margin is needed and AEC-Q101 is not required |
| DMN2041LSD-13 (Diodes Inc.) | 20 V VDS, 320 mΩ RDS(on) @ 2.5 V, 1.0 V min VGS(th); AEC-Q101 qualified but no 1.8 V rating | Higher gate threshold requires ≥2.5 V drive; slightly better RDS(on) at nominal logic levels | Select when system uses 2.5 V+ GPIOs and needs lower conduction loss at full drive |
Compared with BSS138DW-7-F and DMN2041LSD-13, BSD840NH6327XTSA1 uniquely delivers AEC-Q101 compliance *and* guaranteed 1.8 V operation in a dual-channel SOT-363, making it the only option for space-constrained automotive modules requiring direct 1.8 V MCU interfacing.
Availability
BSD840NH6327XTSA1 is available at Aetrix Electronics and suitable for automotive interior lighting, USB power switching, and industrial sensor interface applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for BSD840NH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949.
The BSD840N belongs to Infineon's OptiMOS™2 Small-Signal Transistor family, designed specifically for high-density, low-voltage load switching in automotive body electronics and portable equipment where logic-level drive and AEC-Q101 reliability are mandatory.
FAQ
What is the maximum junction temperature and how does it affect continuous current rating?
The BSD840NH6327XTSA1 has a maximum junction temperature of 150°C. At TA = 70°C, its continuous drain current drops to 0.71 A due to thermal derating governed by RthJA = 250 K/W on minimal FR4. Operation above 125°C junction requires active cooling or reduced ID to maintain reliability.
Can both channels be used simultaneously without thermal interaction?
Yes-both N-channel channels share the same die but have electrically isolated terminals. Thermal coupling exists, so simultaneous 0.88 A operation on both channels requires derating per the SOA curve on page 4 of the datasheet. At TA = 25°C, combined dissipation must stay below 400 mW to avoid exceeding 150°C Tj.
Is the body diode suitable for reverse polarity protection?
No-the intrinsic body diode is optimized for freewheeling, not reverse blocking. Its 1.1 V forward voltage and 0.82 nC Qrr make it unsuitable for reverse polarity schemes requiring low-loss conduction; external Schottky diodes or dedicated protection ICs are recommended instead.
Does the H6327 tape-and-reel designation indicate moisture sensitivity level (MSL)?
Yes-H6327 corresponds to MSL 1 per J-STD-020, meaning the device is not moisture-sensitive and can be stored indefinitely at ≤30°C/60% RH without dry-pack requirements. The "non-dry" marking on the product summary confirms this classification.
BSD840NH6327XTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- 6-VSSOP, SC-88, SOT-363
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 N-Channel (Dual)
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 20V
- Current - Continuous Drain (Id) @ 25°C:
- 880mA
- Rds On (Max) @ Id, Vgs:
- 400mOhm @ 880mA, 2.5V
- Vgs(th) (Max) @ Id:
- 750mV @ 1.6µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.26nC @ 2.5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 78pF @ 10V
- Power - Max:
- 500mW
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT363-PO
BSD840NH6327XTSA1 FAQ
1.How can I place an order for BSD840NH6327XTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSD840NH6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSD840NH6327XTSA1 reliable?
The price and inventory of BSD840NH6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSD840NH6327XTSA1 is usually 5 days.
3.What payment methods are accepted for BSD840NH6327XTSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSD840NH6327XTSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSD840NH6327XTSA1?
BSD840NH6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSD840NH6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSD840NH6327XTSA1?
For technical support, including BSD840NH6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSD840NH6327XTSA1 requirements.
6.How does Aetrix verify that BSD840NH6327XTSA1 is sourced from the original manufacturer or authorized distributors?
All BSD840NH6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSD840NH6327XTSA1 meets industry standards.
7.What is the process for return or replacement of BSD840NH6327XTSA1?
All BSD840NH6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSD840NH6327XTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSD840NH6327XTSA1 part is unused and in its original packaging.
Return procedure for BSD840NH6327XTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BSD840NH6327XTSA1 Tags
-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage
-
2N7002DW-7-F
Diodes Incorporated
-
SSM6L56FE,LM
Toshiba Semiconductor and Storage
-
SSM6N37FU,LF
Toshiba Semiconductor and Storage
-
2N7002DWH6327XTSA1
Infineon Technologies
-
2N7002BKS,115
Nexperia USA Inc.
-
DMG1016UDW-7
Diodes Incorporated
-
UM6K33NTN
Rohm Semiconductor
-
DMG6602SVT-7
Diodes Incorporated
-
EM6K34T2CR
Rohm Semiconductor
-
UM6K34NTCN
Rohm Semiconductor
-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
