Nexperia USA Inc. BSH111,235
- Part No.:
- BSH111,235
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-236-3, SC-59, SOT-23-3
- Datasheet:
-
BSH111,235.pdf
- Description:
- MOSFET N-CH 55V 335MA TO236AB
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
BSH111 from NXP Semiconductors (formerly Philips Semiconductors) is an N-channel enhancement-mode TrenchMOS™ power MOSFET in SOT23 package, rated for 55 V VDS, 335 mA continuous drain current at 25 °C, and 2.3 Ω RDS(on) at VGS = 4.5 V. It serves as a low-voltage logic-level switch in battery-powered load control circuits.
For engineers reviewing the BSH111 datasheet, BSH111 pinout, BSH111 application, or BSH111 equivalent, this device is selected for sub-1 VGS(th) operation, fast switching (ton = 4 ns), and compact SOT23 footprint in space-constrained portable electronics.
Technical Context
This MOSFET uses TrenchMOS™ technology to achieve low gate charge (Qg(tot) = 1.0 nC) and high transconductance (gfs = 380 mS typ), enabling efficient switching with minimal drive requirements. Its 0.4–1.3 V gate-source threshold voltage supports direct interfacing with 1.8 V and 2.5 V logic families.
The device integrates a source-drain diode with 0.95 V forward drop at 300 mA and 30 ns reverse recovery time, suitable for synchronous rectification and flyback snubbing. Thermal resistance from junction to solder point is 150 K/W on metal-clad substrate, supporting moderate-power pulsed operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 55 V maximum - supports 3.3 V to 24 V rail switching without avalanche stress |
| RDS(on) | 2.3 Ω max at VGS = 4.5 V / ID = 500 mA - enables <100 mW conduction loss at 300 mA |
| VGS(th) | 0.4–1.3 V - ensures turn-on with 1.8 V GPIO or low-voltage microcontroller outputs |
| ton/toff | 4 ns / 11 ns - supports >10 MHz PWM in DC-DC converter control paths |
| Qg(tot) | 1.0 nC - reduces gate driver power demand and minimizes switching losses |
| Ciss | 17 pF typ - limits capacitive loading on driving logic and improves EMI profile |
Pinout & Package
SOT23 plastic surface-mount package (JEDEC TO-236AB); 3-pin, single-row outline with 1.9 mm × 1.3 mm footprint and 1.1 mm height. Designed for reflow soldering on standard PCBs with minimum thermal pad area.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate (G) | High-impedance control input; requires ≤10 V drive; sensitive to ESD (±10 V absolute max) |
| 2 | Source (S) | Reference node for gate drive; connects to ground or low-side return path; carries full load current |
| 3 | Drain (D) | Switched output terminal; connects to load or supply rail; hosts body diode cathode |
Key Features
| Feature | Design Value |
|---|---|
| TrenchMOS™ process | Enables lower RDS(on) per die area vs planar MOSFETs, critical for SOT23 size constraint |
| Sub-1 VGS(th) | Guarantees reliable turn-on from 1.8 V logic without level-shifting circuitry |
| Fast switching (ton = 4 ns) | Reduces transition losses in high-frequency DC-DC converters and LED dimming drivers |
| Low Qg (1.0 nC) | Permits use of low-current GPIO pins as direct gate drivers in ultra-low-power systems |
| Integrated source-drain diode | Supports bidirectional current handling in H-bridge half-bridges and reverse-polarity protection |
Applications
| Battery Protection Circuit | Logic-Level Translation Interface |
|---|---|
|
Use Scenario: Reverse-current blocking and over-discharge cutoff in single-cell Li-ion packs. IC Role / Device Role / Timing Role: Low-side load switch controlled by battery management IC's enable signal. Use Value: 0.4 VGS(th) allows activation from BMS LDO output; 2.3 Ω RDS(on) limits voltage drop to <0.8 V at 300 mA. |
Use Scenario: Level-shifting between 1.8 V microcontroller I/O and 3.3 V peripheral enable lines. IC Role / Device Role / Timing Role: Voltage-controlled pass element translating logic states without active buffering. Use Value: Sub-threshold conduction ensures clean high/low transitions; 4 ns ton preserves signal integrity up to 25 MHz. |
| Portable Load Switch | High-Speed Signal Routing |
|
Use Scenario: Power gating of Bluetooth/Wi-Fi modules in wearables to extend standby time. IC Role / Device Role / Timing Role: Controlled power rail disconnect switch activated by system PMIC. Use Value: 335 mA rating covers typical RF module peak draw; SOT23 footprint saves board space in tight layouts. |
Use Scenario: Selective routing of clock or data signals between two SoC domains operating at different voltages. IC Role / Device Role / Timing Role: Bidirectional analog switch enabled by gate bias, leveraging intrinsic body diode symmetry. Use Value: 30 ns trr and low Ciss minimize signal distortion; 150 °C Tj rating supports thermally dense SoC proximity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN2004LK-7 | RDS(on) = 1.9 Ω @ VGS = 4.5 V; VGS(th) = 0.5–1.2 V; same SOT23-3 package | Lower RDS(on) improves efficiency in higher-current loads (>250 mA), but slightly higher gate charge (1.2 nC) | Preferred when conduction loss dominates over switching loss in battery runtime-critical designs |
| AO3400 | RDS(on) = 2.7 Ω @ VGS = 4.5 V; VGS(th) = 0.7–1.4 V; SOT23-3, higher thermal resistance (Rth(j-a) = 375 K/W) | Higher VGS(th) risks marginal turn-on with 1.8 V logic; less suitable for ultra-low-voltage interfaces | Select only if cost sensitivity outweighs performance margin and thermal constraints |
Compared with DMN2004LK-7 and AO3400, the BSH111 offers the lowest VGS(th) and best balance of RDS(on), Qg, and thermal performance in SOT23, making it optimal for 1.8 V–2.5 V logic-driven switching where gate drive headroom is limited.
Availability
BSH111 is available at Aetrix Electronics and suitable for battery management, logic-level translation, and portable load switching requiring stable component supply across industrial and consumer production programs.
Supply support for BSH111 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Philips' semiconductor division.
The BSH111 belongs to NXP's legacy TrenchMOS™ logic-level MOSFET product line, engineered specifically for low-voltage, high-efficiency switching in space-constrained portable electronics and battery-powered systems.
FAQ
Is the BSH111 suitable for 1.8 V GPIO direct drive?
Yes. With a guaranteed VGS(th) as low as 0.4 V and typical turn-on at 1.0 V, the BSH111 fully enhances under 1.8 V drive, delivering 335 mA drain current with RDS(on) ≤ 5.0 Ω at VGS = 1.8 V and ID = 75 mA. No level shifter is required.
What is the maximum continuous drain current at 100 °C ambient?
At Tsp = 100 °C and VGS = 4.5 V, the BSH111 supports 212 mA continuous drain current, per Figure 2 in the datasheet. Derating is linear from 335 mA at 25 °C to zero at 150 °C junction temperature.
Can the BSH111 replace a BSS138 in existing designs?
Yes, with functional improvement: BSH111 offers lower RDS(on) (2.3 Ω vs 3.5 Ω), faster switching (4 ns vs 10 ns ton), and lower VGS(th) (0.4–1.3 V vs 0.8–1.5 V), while maintaining identical SOT23-3 pinout and voltage ratings. Layout reuse is direct.
Does the BSH111 include ESD protection on the gate?
No. The BSH111 has no integrated gate protection diodes. Absolute maximum VGS is ±10 V, and gate-source leakage is specified at 10–100 nA at ±8 V. External 10 kΩ series resistor and/or TVS clamp recommended for board-level ESD robustness.
BSH111,235 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- TO-236-3, SC-59, SOT-23-3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 55 V
- Current - Continuous Drain (Id) @ 25°C:
- 335mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 4Ohm @ 500mA, 4.5V
- Vgs(th) (Max) @ Id:
- 1.3V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 1 nC @ 8 V
- Vgs (Max):
- ±10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 40 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 830mW (Tc)
- Operating Temperature:
- -65°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-236AB
BSH111,235 FAQ
1.How can I place an order for BSH111,235 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSH111,235 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSH111,235 reliable?
The price and inventory of BSH111,235 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSH111,235 is usually 5 days.
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Once your BSH111,235 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSH111,235?
For technical support, including BSH111,235 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSH111,235 requirements.
6.How does Aetrix verify that BSH111,235 is sourced from the original manufacturer or authorized distributors?
All BSH111,235 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSH111,235 meets industry standards.
7.What is the process for return or replacement of BSH111,235?
All BSH111,235 units undergo pre-shipment inspection (PSI). If there is an issue with BSH111,235, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSH111,235 part is unused and in its original packaging.
Return procedure for BSH111,235:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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