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NXP Semiconductors BSH207,135

Part No.:
BSH207,135
Manufacturer:
NXP Semiconductors
Category:
FETs, MOSFETs
Package:
SC-74, SOT-457
Datasheet:
AetrixBSH207,135.pdf
Description:
MOSFET P-CH 12V 1.52A 6TSOP
Quantity:
Payment:
Payment
Shipping:
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Inventory:50,873

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Product details

Overview

BSH207,135 from Nexperia (formerly Philips Semiconductors) is a P-channel enhancement-mode logic-level MOSFET in SOT457 package, rated for -12 V drain-source voltage, -1.52 A DC drain current at 25 °C, and RDS(ON) ≤ 150 mΩ at VGS = -2.5 V. It serves as a low-threshold, fast-switching load switch in battery-powered portable electronics and high-speed digital interface circuits.

For engineers reviewing the BSH207,135 datasheet, BSH207,135 pinout, BSH207,135 application, or BSH207,135 equivalent, key selection criteria include its sub-1 V gate threshold, 8.8 nC total gate charge, integrated body diode with 75 ns reverse recovery time, and thermal resistance of 300 K/W on FR4 - all critical for compact, thermally constrained DC-DC and power management designs.

Technical Context

The BSH207,135 operates as a single P-channel silicon MOSFET with enhancement-mode behavior requiring negative gate-source bias to conduct. Its low VGS(TO) (−0.4 V min) enables direct drive from 1.8 V/2.5 V logic outputs without level shifting.

It features an integrated source-drain body diode with −0.62 V forward voltage at −0.62 A, and exhibits 500 pF input capacitance and 62 pF feedback capacitance at VDS = −9.6 V, supporting predictable switching dynamics in synchronous buck or load-switch topologies.

Key Specifications

Parameter Value and Actual Design Meaning
VDS −12 V: Maximum blocking voltage for low-voltage rail switching (e.g., 3.3 V or 5 V systems).
ID (DC, 25 °C) −1.52 A: Continuous load current capability at ambient temperature, suitable for USB port power switches or LED drivers.
RDS(ON) ≤150 mΩ @ VGS = −2.5 V: Ensures <100 mW conduction loss at 0.8 A, minimizing self-heating in space-constrained PCBs.
VGS(TO) −0.4 V to −0.6 V: Enables reliable turn-on with 1.8 V GPIO, eliminating need for external gate driver in ultra-low-power microcontroller interfaces.
Qg(tot) 8.8 nC: Low gate charge supports >1 MHz switching in DC-DC controllers while limiting driver power demand.
tr/tf 4.5 ns / 20 ns: Fast edge rates reduce switching transition losses and EMI generation in noise-sensitive applications.
Ciss 500 pF: Input capacitance value used to calculate required gate drive strength and estimate Miller effect during switching.

Pinout & Package

SOT457 is a 6-pin, surface-mount plastic package with exposed drain pads (pins 1,2,5,6) for enhanced thermal performance and compact footprint (3.1 mm × 2.7 mm × 1.1 mm). The package supports reflow soldering per JEDEC J-STD-020.

Pin/Terminal Circuit Role Design Meaning
1,2,5,6 Drain Common high-current output node; internally connected and electrically tied to thermal pad for heat dissipation.
3 Gate Control terminal accepting logic-level negative voltage; requires ESD protection due to thin oxide gate dielectric.
4 Source Reference node for gate drive and current return path; connects to system ground or higher-potential rail in high-side configuration.

Key Features

Feature Design Value
Logic-level gate drive Operates fully enhanced with −2.5 V VGS, compatible with 1.8 V/2.5 V microcontrollers without level shifters.
Ultra-low threshold voltage VGS(TO) down to −0.4 V ensures robust turn-on margin even under low-battery conditions (e.g., 2.7 V supply).
Fast switching speed Turn-off fall time of 20 ns and 45 ns delay enable efficient operation in PWM-based power control up to 2 MHz.
Integrated body diode Reverse recovery time of 75 ns and Qrr = 69 nC support freewheeling in synchronous rectifier or H-bridge configurations.
Thermally optimized package SOT457's multi-drain pin layout reduces thermal resistance to 300 K/W on standard FR4, enabling 417 mW dissipation at 25 °C ambient.

Applications

Battery-Powered Load Switch USB Power Delivery Switch

Use Scenario: Enabling/disabling power to peripheral modules (e.g., Bluetooth radio, sensor array) in handheld medical devices to extend battery life.

IC Role / Device Role / Timing Role: High-side load switch controlling VBAT (3.0–4.2 V) delivery with minimal quiescent current and fast response to MCU GPIO.

Use Value: Sub-1 V VGS(TO) guarantees full enhancement at end-of-discharge voltages; RDS(ON) ≤ 150 mΩ limits dropout to <120 mV at 0.8 A.

Use Scenario: Controlling 5 V bus power to downstream USB peripherals in embedded host controllers with strict inrush current limits.

IC Role / Device Role / Timing Role: Low-side or high-side power switch managing hot-plug sequencing and overcurrent protection coordination.

Use Value: 8.8 nC Qg allows clean, controlled turn-on using standard 10 Ω gate resistor; integrated diode handles back-EMF during disconnect.

Low-Voltage Logic Interface LED Backlight Dimming

Use Scenario: Level-shifting and driving capacitive loads (e.g., LCD segment lines, I²C pull-ups) from 1.8 V FPGA I/O banks.

IC Role / Device Role / Timing Role: Bidirectional signal buffer or active pull-down element operating directly from core logic rails.

Use Value: Gate leakage <±100 nA prevents signal corruption; Ciss = 500 pF enables predictable timing with 10 kΩ source impedance.

Use Scenario: PWM-controlled current sink for white LED strings in portable displays, requiring precise dimming linearity and low thermal overhead.

IC Role / Device Role / Timing Role: Constant-current switch modulating LED current at 1–20 kHz with minimal duty-cycle distortion.

Use Value: 20 ns tf ensures sharp PWM edges; RDS(ON) stability over temperature maintains consistent brightness across operating range.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel logic-level MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMG2302UK-7 RDS(ON) = 90 mΩ @ VGS = −4.5 V (vs. 150 mΩ @ −2.5 V); higher VGS(TO) (−0.7 V typ); SOT-23 package (3-pin, no thermal pad). Requires −4.5 V gate drive for optimal RDS(ON); lower thermal mass limits continuous current to 1.2 A on FR4. Prefer when board space is critical and gate drive ≥ −4.5 V is available; avoid in 1.8 V logic systems.
SI2305-CDS RDS(ON) = 55 mΩ @ VGS = −4.5 V; VGS(TO) = −0.5 V min; SOT-23 package; Qg = 5.4 nC. Lower gate charge improves high-frequency efficiency but lacks multi-drain thermal design; max ID = 1.2 A (25 °C). Select for high-efficiency, low-duty-cycle switching where thermal budget permits; not recommended for sustained 1.5 A loads.

Compared with DMG2302UK-7 and SI2305-CDS, the BSH207,135 uniquely balances ultra-low-threshold operation, multi-pin thermal routing, and moderate gate charge - making it optimal for 1.8 V–2.5 V-driven, thermally constrained load switching where reliability at full rated current is essential.

Availability

BSH207,135 is available at Aetrix Electronics and suitable for battery management systems, USB-C power switches, and portable display backlighting requiring stable component supply and long-term industrial availability.

Supply support for BSH207,135 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET solutions with leadership in efficiency, miniaturization, and thermal performance.

The BSH207,135 belongs to Nexperia's logic-level P-channel MOSFET portfolio, engineered specifically for energy-efficient power switching in space- and voltage-constrained portable electronics.

FAQ

What is the maximum continuous drain current for BSH207,135 at 100 °C ambient temperature?

The BSH207,135 supports −0.96 A continuous drain current at Ta = 100 °C, derated from −1.52 A at 25 °C per its thermal resistance profile. This value is confirmed in the Limiting Values table and reflects safe operation on standard FR4 PCBs without forced airflow. Designers must verify junction temperature using Rth j-a = 300 K/W and actual power dissipation to ensure Tj remains below 150 °C in the BSH207,135.

Does BSH207,135 have an integrated body diode, and what are its key parameters?

Yes, the BSH207,135 includes a built-in source-drain body diode characterized with VSD = −0.62 V at −0.62 A, reverse recovery time trr = 75 ns, and Qrr = 69 nC. These values are measured under specified conditions (IF = −0.5 A, −dIF/dt = 100 A/µs, VR = −9.6 V) and are critical for freewheeling path design in buck converters or H-bridge motor drivers using the BSH207,135.

Can BSH207,135 be driven directly by a 1.8 V microcontroller GPIO?

Yes - the BSH207,135 has a guaranteed gate threshold voltage VGS(TO) ≥ −0.4 V, allowing full enhancement with −1.8 V gate drive. At VGS = −1.8 V and ID = −0.5 A, RDS(ON) is ≤ 180 mΩ, confirming usable conduction. This makes the BSH207,135 suitable for direct interface with 1.8 V logic without external level shifting, a key advantage over higher-threshold alternatives.

What is the thermal resistance junction-to-ambient for BSH207,135 on a standard FR4 board?

The BSH207,135 has a maximum thermal resistance Rth j-a of 300 K/W when mounted on a minimum-footprint FR4 PCB, as defined in the Thermal Resistances section. This value assumes standard JEDEC test conditions and is used to calculate junction temperature rise: ΔTj = Pdiss × 300 K/W. For reliable long-term operation, the BSH207,135 must be applied within this thermal limit to avoid exceeding Tj = 150 °C.

Is the SOT457 package of BSH207,135 lead-free and RoHS compliant?

Yes - the BSH207,135 is manufactured in a lead-free, RoHS-compliant SOT457 package per Nexperia's product specifications and EU Directive 2011/65/EU. The device meets JEDEC J-STD-020 moisture sensitivity level (MSL) 1 and is qualified for reflow soldering up to 260 °C peak temperature. Full compliance documentation for the BSH207,135 is available through Nexperia's official product portal.

BSH207,135 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
SC-74, SOT-457
Packaging:
Bulk
Product Status:
Obsolete
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
12 V
Current - Continuous Drain (Id) @ 25°C:
1.52A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
1.8V, 4.5V
Rds On (Max) @ Id, Vgs:
120mOhm @ 1A, 4.5V
Vgs(th) (Max) @ Id:
600mV @ 1mA (Typ)
Gate Charge (Qg) (Max) @ Vgs:
8.8 nC @ 4.5 V
Vgs (Max):
±8V
Input Capacitance (Ciss) (Max) @ Vds:
500 pF @ 9.6 V
FET Feature:
-
Power Dissipation (Max):
417mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
6-TSOP

BSH207,135 FAQ

1.How can I place an order for BSH207,135 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSH207,135 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSH207,135 reliable?

The price and inventory of BSH207,135 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSH207,135 is usually 5 days.

3.What payment methods are accepted for BSH207,135?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSH207,135 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSH207,135?

BSH207,135 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSH207,135 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSH207,135?

For technical support, including BSH207,135 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSH207,135 requirements.

6.How does Aetrix verify that BSH207,135 is sourced from the original manufacturer or authorized distributors?

All BSH207,135 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSH207,135 meets industry standards.

7.What is the process for return or replacement of BSH207,135?

All BSH207,135 units undergo pre-shipment inspection (PSI). If there is an issue with BSH207,135, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSH207,135 part is unused and in its original packaging.

Return procedure for BSH207,135:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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