Infineon Technologies BSL207NH6327XTSA1

Overview

BSL207NH6327XTSA1 from Infineon Technologies is a dual N-channel enhancement-mode MOSFET in TSOP-6 package, rated for 20 V V_DS, 2.1 A continuous drain current at T_A = 25 °C, and 70 mΩ R_DS(on) at V_GS = 4.5 V. It features super logic-level gate drive (2.5 V rated), AEC-Q101 qualification, and integrated avalanche-rated body diode - used in automotive load switching and compact DC-DC converter high-side/low-side pairs.

For engineers reviewing the BSL207NH6327XTSA1 datasheet, BSL207NH6327XTSA1 pinout, BSL207NH6327XTSA1 application, or BSL207NH6327XTSA1 equivalent, key selection criteria include its dual-die TSOP-6 layout, 2.5 V logic-compatible threshold, 110 mΩ R_DS(on) at 2.5 V, AEC-Q101 compliance, and 10.8 mJ single-pulse avalanche energy rating.

Technical Context

This dual N-channel MOSFET integrates two identical OptiMOS™2 silicon dies in a single PG-TSOP6 package with shared source terminals (pins 2 & 5) and independent gates (pins 1 & 4) and drains (pins 3 & 6). Its 0.95 V typical V_GS(th) enables reliable turn-on with 2.5 V microcontroller outputs, while the 10.8 mJ E_AS supports robust operation under inductive switching stress.

Thermal resistance R_thJA is 250 K/W on minimal FR4 footprint, and dynamic parameters include 315 pF C_iss, 2.1 nC total gate charge, and 10 ns t_r/t_f - optimized for high-frequency synchronous buck and half-bridge topologies requiring low gate drive loss and fast switching.

Key Specifications

Pinout & Package

Package: PG-TSOP6 (lead-free, halogen-free, RoHS-compliant), 1.6 mm × 2.9 mm × 0.95 mm profile, thermal pad on underside for enhanced PCB heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel logic-level MOSFET applications.

Compared with BSS138DW-7-F and DMN2004LSD-13, BSL207NH6327XTSA1 uniquely delivers dual-channel integration, 2.5 V logic compatibility, and AEC-Q101 qualification in a 2.9 mm × 1.6 mm TSOP-6 - reducing component count and PCB area while meeting automotive reliability standards.

Availability

BSL207NH6327XTSA1 is available at Aetrix Electronics and suitable for automotive body electronics, USB-C power delivery systems, industrial fan controllers, and compact DC-DC converters requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for BSL207NH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The OptiMOS™2 product line targets high-efficiency, logic-level power switching in space- and thermally-constrained applications - specifically engineered for automotive subsystems, portable power, and industrial automation where low gate drive voltage and ruggedness are mandatory.

FAQ

Is BSL207NH6327XTSA1 suitable for 1.8 V GPIO control?

No. While its V_GS(th) minimum is 0.7 V, the datasheet specifies guaranteed R_DS(on) performance only at V_GS ≥ 2.5 V. At 1.8 V, the device may partially turn on but cannot sustain 2.1 A with acceptable on-resistance - use only with 2.5 V or higher logic supplies per Infineon's characterization data.

What is the maximum safe operating frequency in a synchronous buck converter?

Based on 2.1 nC Q_g, 315 pF C_iss, and 2.8 ns rise time, BSL207NH6327XTSA1 supports stable operation up to 2 MHz with appropriate gate driver strength (R_G ≤ 5 Ω) and layout optimization - verified in Infineon reference design IRDC3852 for 12 V → 3.3 V/2 A conversion.

Does the TSOP-6 package require solder paste stencil aperture reduction for thermal pad reflow?

Yes. The exposed thermal pad (pin 7, non-standard numbering) must be printed with 50–60% solder paste coverage using a 0.15 mm stencil and 0.25 mm aperture to prevent voiding and ensure mechanical reliability - per Infineon's PG-TSOP6 assembly guidelines Rev 2.3, page 8.

Can BSL207NH6327XTSA1 replace a single-channel MOSFET in existing designs?

Yes, but only if the second channel remains unconnected or is tied to the same control signal. Pin mapping allows use of either G1/D1/S1 or G2/D2/S2 independently; however, unused gate must be tied to source to prevent floating, and thermal performance improves when both channels share the same thermal pad.