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Infineon Technologies BSL308PEH6327XTSA1
- Part No.:
- BSL308PEH6327XTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FET, MOSFET Arrays
- Package:
- SOT-23-6 Thin, TSOT-23-6
- Datasheet:
-
BSL308PEH6327XTSA1.pdf
- Description:
- MOSFET 2P-CH 30V 2A TSOP6-6
- Quantity:
- Payment:
- Shipping:
Inventory:14,492
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Product details
Overview
BSL308PEH6327XTSA1 from Infineon Technologies is a dual P-channel enhancement-mode MOSFET optimized for logic-level gate drive (4.5 V), rated for -30 V VDS, 130 mΩ RDS(on) at VGS = -4.5 V, and -2.0 A continuous drain current; used in automotive body control modules for load switching of lamps and solenoids.
For engineers reviewing the BSL308PEH6327XTSA1 datasheet, BSL308PEH6327XTSA1 pinout, BSL308PEH6327XTSA1 application, or BSL308PEH6327XTSA1 equivalent, key selection criteria include AEC-Q101 qualification, ESD protection (HBM Class 2), thermal resistance (250 K/W), and dual-channel integration for space-constrained PCB layouts.
Technical Context
This dual P-channel MOSFET operates in enhancement mode with gate threshold voltage ranging from -2.0 V to -1.0 V, enabling reliable turn-on with standard logic-level signals. Its integrated reverse diode supports bidirectional current handling in H-bridge or half-bridge configurations.
Dynamic parameters include 376 pF input capacitance, 196 pF output capacitance, and 5.6 ns turn-on delay-optimized for fast-switching DC-DC converter synchronous rectification and low-side load switching in 12 V automotive systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS Rating | -30 V - supports operation across full automotive battery range including load dump transients |
| RDS(on) @ VGS = -4.5 V | 130 mΩ max - enables efficient 2 A switching at logic-level drive without external level shifting |
| ID Continuous | -2.0 A @ TA = 25 °C - suitable for driving automotive LED clusters and small relays |
| EAS | 10.7 mJ - provides single-pulse avalanche robustness during inductive load turn-off |
| Ciss | 376 pF typ - balances switching speed and gate drive power requirements |
| Thermal Resistance RthJA | 250 K/W - defined on 40 mm² FR4 PCB with 1 mm wide, 70 µm thick copper traces |
| ESD Rating | HBM Class 2 (2–4 kV) - protects against electrostatic discharge during board assembly and handling |
Pinout & Package
BSL308PEH6327XTSA1 is housed in a PG-TSOP-6 surface-mount package (3.05 mm × 1.5 mm × 0.95 mm), optimized for automated placement and high-density routing on automotive PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Source 1 | Common source connection for first P-channel channel; tied to local ground reference in high-side switch configuration |
| 2 | Gate 1 | Control terminal for first channel; requires logic-compatible negative gate drive relative to Source 1 |
| 3 | Drain 1 | Power output node for first channel; connects to load anode in high-side switching applications |
| 4 | Drain 2 | Power output node for second channel; electrically isolated from Drain 1 for independent load control |
| 5 | Gate 2 | Control terminal for second channel; decoupled from Gate 1 to enable asynchronous switching |
| 6 | Source 2 | Common source connection for second P-channel channel; may be tied to same ground or separate rail |
Key Features
| Feature | Design Value |
|---|---|
| Dual P-channel integration | Two matched MOSFETs in one TSOP-6 footprint - reduces component count and layout area by ~40% vs discrete solutions |
| Logic-level gate drive | Full enhancement at VGS = -4.5 V - eliminates need for gate driver ICs in 5 V/3.3 V microcontroller interfaces |
| AEC-Q101 qualification | Validated for automotive temperature range (-55 °C to +150 °C) and mechanical stress - meets OEM reliability requirements |
| Integrated reverse diode | Body diode with 14 ns trr and 5.9 nC Qrr - supports freewheeling in inductive loads without external diodes |
| Halogen-free & RoHS | Compliant with IEC61249-2-21 and EU RoHS Directive - supports green manufacturing and end-of-life recycling |
Applications
| Automotive Body Control Unit (BCU) | LED Lighting Driver |
|---|---|
Use Scenario: Switching 12 V incandescent and LED lamps in door modules and trunk lighting. IC Role / Device Role / Timing Role: Dual high-side load switch controlling two independent lamp circuits with PWM dimming capability. Use Value: Enables compact, thermally efficient design with integrated ESD protection and AEC-Q101 compliance for under-hood deployment. | Use Scenario: Driving multi-segment automotive LED arrays requiring independent current control per segment. IC Role / Device Role / Timing Role: Dual-channel constant-current sink switch supporting sequential or parallel LED activation. Use Value: Reduces bill-of-materials by eliminating discrete MOSFETs and gate resistors while maintaining <130 mΩ on-resistance at logic-level drive. |
| Engine Control Module (ECM) Auxiliary Load | Smart Fuse Replacement |
Use Scenario: Controlling solenoid valves and fuel pump relays in engine management subsystems. IC Role / Device Role / Timing Role: High-reliability P-channel switch with built-in avalanche energy rating (10.7 mJ) for inductive kickback suppression. Use Value: Eliminates need for external flyback diodes and improves system-level fault tolerance during rapid valve deactivation. | Use Scenario: Replacing electromechanical fuses in 12 V power distribution units for programmable overcurrent protection. IC Role / Device Role / Timing Role: Current-sensing enabled load switch with thermal shutdown and short-circuit detection via external sense resistor. Use Value: Provides precise trip thresholds and reset-on-cool functionality using only RDS(on) drift and ambient temperature monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual P-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMC3028LSD-13 | RDS(on) = 110 mΩ @ -4.5 V; SO-8 package; higher thermal resistance (120 K/W) | Requires larger PCB area; better suited for non-automotive industrial use due to lack of AEC-Q101 | Select when higher current capability is needed and automotive qualification is not required |
| IPB80P03P4L-04 | Single-channel TO-263; RDS(on) = 3.2 mΩ @ -10 V; no logic-level drive support | Needs gate driver for 3.3 V MCU interface; unsuitable for space-constrained dual-load designs | Choose only for high-power single-load applications where gate drive voltage ≥10 V is available |
Compared with DMC3028LSD-13 and IPB80P03P4L-04, BSL308PEH6327XTSA1 uniquely combines AEC-Q101 qualification, dual-channel integration in TSOP-6, and true logic-level operation-making it optimal for automotive body electronics where size, reliability, and 4.5 V compatibility are mandatory.
Availability
BSL308PEH6327XTSA1 is available at Aetrix Electronics and suitable for automotive body control units, LED lighting drivers, engine control auxiliary loads, and smart fuse replacements requiring stable component supply and long-term lifecycle support.
Supply support for BSL308PEH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification aligned to ISO/TS 16949.
BSL308PEH6327XTSA1 belongs to the OptiMOS™ P3 Small-Signal Transistor product line, engineered specifically for high-efficiency, space-constrained automotive load switching applications demanding logic-level compatibility and AEC-Q101 reliability.
FAQ
Is BSL308PEH6327XTSA1 qualified for automotive use?
Yes. It is fully qualified to AEC-Q101 standards, tested across -55 °C to +150 °C junction temperature range, and certified for use in automotive body electronics, lighting, and engine control modules. Its construction includes halogen-free materials and 100% lead-free RoHS-compliant packaging.
What is the maximum safe operating voltage for the gate-source terminals?
The absolute maximum gate-source voltage is ±20 V. Operation beyond ±12 V is not recommended in production designs. For logic-level drive, the device achieves full enhancement at VGS = -4.5 V, with typical threshold between -2.0 V and -1.0 V, ensuring robust noise immunity in automotive environments.
Can both channels be used simultaneously without thermal derating?
Yes, but with derating: at TA = 70 °C, continuous drain current per channel drops to -1.6 A. The 250 K/W RthJA assumes minimal footprint (40 mm² FR4), so simultaneous full-load operation requires careful thermal layout-such as internal copper planes or thermal vias-to maintain Tj ≤ 150 °C.
Does the integrated body diode support reverse recovery in PWM applications?
Yes. The body diode has trr = 14 ns and Qrr = 5.9 nC at IF = -2 A, making it suitable for freewheeling in low-frequency PWM (≤20 kHz) LED dimming and relay driving. For >50 kHz operation, external Schottky clamping is recommended to minimize switching losses.
BSL308PEH6327XTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- SOT-23-6 Thin, TSOT-23-6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 P-Channel (Dual)
- FET Feature:
- Logic Level Gate, 4.5V Drive
- Drain to Source Voltage (Vdss):
- 30V
- Current - Continuous Drain (Id) @ 25°C:
- 2A
- Rds On (Max) @ Id, Vgs:
- 80mOhm @ 2A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 11µA
- Gate Charge (Qg) (Max) @ Vgs:
- 5nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 500pF @ 15V
- Power - Max:
- 500mW
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TSOP6-6
BSL308PEH6327XTSA1 FAQ
1.How can I place an order for BSL308PEH6327XTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSL308PEH6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSL308PEH6327XTSA1 reliable?
The price and inventory of BSL308PEH6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSL308PEH6327XTSA1 is usually 5 days.
3.What payment methods are accepted for BSL308PEH6327XTSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSL308PEH6327XTSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSL308PEH6327XTSA1?
BSL308PEH6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSL308PEH6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSL308PEH6327XTSA1?
For technical support, including BSL308PEH6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSL308PEH6327XTSA1 requirements.
6.How does Aetrix verify that BSL308PEH6327XTSA1 is sourced from the original manufacturer or authorized distributors?
All BSL308PEH6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSL308PEH6327XTSA1 meets industry standards.
7.What is the process for return or replacement of BSL308PEH6327XTSA1?
All BSL308PEH6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSL308PEH6327XTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSL308PEH6327XTSA1 part is unused and in its original packaging.
Return procedure for BSL308PEH6327XTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BSL308PEH6327XTSA1 Tags
-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage
-
2N7002DW-7-F
Diodes Incorporated
-
SSM6L56FE,LM
Toshiba Semiconductor and Storage
-
SSM6N37FU,LF
Toshiba Semiconductor and Storage
-
2N7002DWH6327XTSA1
Infineon Technologies
-
2N7002BKS,115
Nexperia USA Inc.
-
DMG1016UDW-7
Diodes Incorporated
-
UM6K33NTN
Rohm Semiconductor
-
DMG6602SVT-7
Diodes Incorporated
-
EM6K34T2CR
Rohm Semiconductor
-
UM6K34NTCN
Rohm Semiconductor
-
DMG6601LVT-7
Diodes Incorporated
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