Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FET, MOSFET Arrays

Infineon Technologies BSL314PEH6327XTSA1

Name: BSL314PEH6327XTSA1
Brand: Infineon Technologies
SKU: BSL314PEH6327XTSA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: BSL314PEH6327XTSA1

Manufacturer:: Infineon Technologies

Category:: FET, MOSFET Arrays

Package:: SOT-23-6 Thin, TSOT-23-6

Datasheet:: BSL314PEH6327XTSA1.pdf

Description:: MOSFET 2P-CH 30V 1.5A TSOP6-6

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:4,329

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

BSL314PEH6327XTSA1 from Infineon Technologies is a dual P-channel enhancement-mode MOSFET in PG-TSOP-6 package, rated for ±20 V gate-source voltage, 30 V drain-source breakdown, and 230 mΩ R_DS(on) at V_GS = −4.5 V. It delivers −1.5 A continuous drain current at 25 °C ambient and supports logic-level drive with −1.5 V typical gate threshold. Used in automotive body control modules for load switching of LED lighting and small solenoids.

For engineers reviewing the BSL314PEH6327XTSA1 datasheet, BSL314PEH6327XTSA1 pinout, BSL314PEH6327XTSA1 application, or BSL314PEH6327XTSA1 equivalent, key selection criteria include its AEC-Q101 qualification, dual-channel integration in TSOP-6, −30 V V_(BR)DSS, ESD protection (HBM 1000–2000 V), and thermal resistance of 250 K/W on minimal footprint PCB.

Technical Context

This dual P-channel MOSFET operates in enhancement mode with logic-compatible gate drive down to −4.5 V, enabling direct interface with 3.3 V/5 V microcontrollers. Its integrated reverse diode supports bidirectional current handling in half-bridge or load-dump protection topologies.

The device features low gate charge (Q_g = −2.9 nC), fast switching (t_r = 3.9 ns, t_f = 2.8 ns), and robust avalanche capability (E_AS = 6 mJ), making it suitable for high-frequency PWM-controlled DC loads in space-constrained automotive ECUs.

Key Specifications

Parameter	Value and Actual Design Meaning
V_(BR)DSS	−30 V - Withstands up to 30 V reverse drain-source voltage before breakdown
R_DS(on) @ V_GS = −4.5 V	230 mΩ max - Enables efficient switching of ≤1.2 A loads at logic-level gate drive
I_D continuous	−1.5 A @ T_A = 25 °C - Supports sustained current in compact PCB layouts with minimal heatsinking
Q_g	−2.9 nC - Reduces gate driver power loss and enables <10 ns switching transitions
E_AS	6 mJ - Absorbs inductive energy during turn-off without failure in relay/solenoid drive
V_GS(th)	−1.0 to −2.0 V - Ensures reliable turn-on with standard CMOS logic outputs
C_iss	221–294 pF - Defines input capacitance affecting gate drive strength and rise time

Pinout & Package

PG-TSOP-6 package: 6-pin surface-mount, 1.6 mm × 3.05 mm footprint, 1.0 mm height, lead-free and halogen-free per IEC61249-2-21.

Pin/Terminal	Circuit Role	Design Meaning
1	Source 1	Common source terminal for first P-MOSFET channel; tied to ground or low-side reference
2	Gate 1	Control input for first channel; accepts −4.5 V logic-level drive
3	Drain 1	High-side switched output for first channel; connects to load anode
4	Drain 2	High-side switched output for second channel; independent of Drain 1
5	Gate 2	Control input for second channel; electrically isolated from Gate 1
6	Source 2	Common source terminal for second P-MOSFET channel; may be tied to Source 1 or separate ground

Key Features

Feature	Design Value
Dual P-channel integration	Two matched MOSFETs in single TSOP-6 package reduce board area by ~40% vs discrete solutions
AEC-Q101 qualification	Validated for automotive underhood applications including temperature cycling, humidity, and mechanical shock
Logic-level gate drive	Turns fully on at −4.5 V, eliminating need for level-shifters when driven by 3.3 V/5 V MCUs
ESD protection (HBM)	1000–2000 V rating prevents damage during PCB assembly and system handling
Integrated body diode	Reverse recovery time t_rr = 12.5 ns enables use in freewheeling paths without external diodes

Applications

Automotive LED Headlamp Dimming

Body Control Module Load Switching

Use Scenario: PWM-controlled dimming of dual LED strings in adaptive front-lighting systems.

IC Role / Device Role / Timing Role: Dual high-side switch controlling cathode-side current of two independent LED channels.

Use Value: Matched R_DS(on) ensures balanced current sharing; low Q_g supports >10 kHz dimming frequency without gate driver overheating.

Use Scenario: Power switching for door lock actuators, mirror heaters, and interior lighting in BCMs.

IC Role / Device Role / Timing Role: Dual-channel protected load switch replacing mechanical relays and discrete FETs.

Use Value: AEC-Q101 compliance and −55 °C to +150 °C operation ensure reliability across vehicle lifetime and environmental extremes.

Low-Voltage Industrial PLC Outputs

USB-C Port Power Switching

Use Scenario: Solid-state replacement for electromechanical relays in 12 V industrial I/O modules.

IC Role / Device Role / Timing Role: Dual high-side switch driving resistive and inductive field loads with integrated flyback energy handling.

Use Value: 6 mJ avalanche energy rating eliminates need for external snubbers in inductive load switching.

Use Scenario: Dual-path V_CONN and V_BUS power routing in USB-C receptacle designs.

IC Role / Device Role / Timing Role: Dual P-channel switch managing power path selection and fault isolation between CC logic and power rails.

Use Value: Low R_DS(on) at −4.5 V gate drive enables efficient 3.3 V controller interfacing without boost circuitry.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual P-channel logic-level MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
DMC3025LSD-13	Single-channel, 30 V, 2.5 mΩ R_DS(on) @ −10 V; no AEC-Q101 rating	Requires two devices for dual functionality; unsuitable for automotive underhood use	Select only for non-automotive, high-current, single-channel applications where space allows dual placement
IPD30N03L3-20	Single-channel, 30 V, 20 mΩ R_DS(on) @ −4.5 V; AEC-Q101 qualified but larger TO-252 package	Larger footprint and higher thermal resistance (60 K/W vs 250 K/W) limit density in multi-channel designs	Prefer for high-power single loads needing better thermal performance, not space-constrained dual-channel layouts

Compared with DMC3025LSD-13 and IPD30N03L3-20, BSL314PEH6327XTSA1 uniquely combines dual-channel integration, AEC-Q101 qualification, and TSOP-6 footprint-enabling compact, automotive-grade load switching unachievable with either alternative alone.

Availability

BSL314PEH6327XTSA1 is available at Aetrix Electronics and suitable for automotive body electronics, industrial PLC output stages, and USB-C power routing requiring stable component supply and long-term lifecycle support.

Supply support for BSL314PEH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949.

The OptiMOS™-P 3 product line delivers logic-level P-channel MOSFETs optimized for space-constrained, high-reliability automotive and industrial switching applications requiring AEC-Q101 compliance and low gate charge.

FAQ

What is the maximum allowable junction temperature for continuous operation?

The BSL314PEH6327XTSA1 has a maximum junction temperature (T_j) of +150 °C, validated across its full operating range. Thermal design must maintain T_j ≤ 150 °C under worst-case ambient and power dissipation conditions, using the specified 250 K/W R_thJA on minimal FR4 footprint.

Does this part support parallel operation of both channels for higher current?

No-each channel is electrically independent with separate gate, source, and drain terminals; parallel connection is not recommended due to mismatched R_DS(on) and thermal coupling. The datasheet specifies "one of both transistors in operation" for absolute maximum ratings, confirming single-channel derating applies.

Is the reverse diode suitable for continuous freewheeling in inductive loads?

Yes-the integrated body diode supports continuous forward current up to −0.5 A and pulsed current up to −6.1 A. Its 12.5 ns reverse recovery time and 4.3 nC Q_rr enable efficient freewheeling in 10–100 kHz PWM applications without external diode supplementation.

How does the −1.5 V typical gate threshold affect drive compatibility with 3.3 V microcontrollers?

With V_GS(th) ranging from −1.0 V to −2.0 V, the device turns on strongly at −3.3 V gate drive-well within its ±20 V rating. At −3.3 V, R_DS(on) remains below 300 mΩ, ensuring low conduction loss without requiring gate boosting or level-shifting circuitry.

BSL314PEH6327XTSA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: OptiMOS™

Package/Case:: SOT-23-6 Thin, TSOT-23-6

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Technology:: MOSFET (Metal Oxide)

Configuration:: 2 P-Channel (Dual)

FET Feature:: Logic Level Gate, 4.5V Drive

Drain to Source Voltage (Vdss):: 30V

Current - Continuous Drain (Id) @ 25°C:: 1.5A

Rds On (Max) @ Id, Vgs:: 140mOhm @ 1.5A, 10V

Vgs(th) (Max) @ Id:: 2V @ 6.3µA

Gate Charge (Qg) (Max) @ Vgs:: 2.9nC @ 10V

Input Capacitance (Ciss) (Max) @ Vds:: 294pF @ 15V

Power - Max:: 500mW

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: Automotive

Qualification:: AEC-Q101

Mounting Type:: Surface Mount

Supplier Device Package:: PG-TSOP6-6

BSL314PEH6327XTSA1 FAQ

1.How can I place an order for BSL314PEH6327XTSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSL314PEH6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSL314PEH6327XTSA1 reliable?

The price and inventory of BSL314PEH6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSL314PEH6327XTSA1 is usually 5 days.

3.What payment methods are accepted for BSL314PEH6327XTSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSL314PEH6327XTSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSL314PEH6327XTSA1?

BSL314PEH6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSL314PEH6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSL314PEH6327XTSA1?

For technical support, including BSL314PEH6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSL314PEH6327XTSA1 requirements.

6.How does Aetrix verify that BSL314PEH6327XTSA1 is sourced from the original manufacturer or authorized distributors?

All BSL314PEH6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSL314PEH6327XTSA1 meets industry standards.

7.What is the process for return or replacement of BSL314PEH6327XTSA1?

All BSL314PEH6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSL314PEH6327XTSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSL314PEH6327XTSA1 part is unused and in its original packaging.

Return procedure for BSL314PEH6327XTSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…