Infineon Technologies BSO110N03MSGXUMA1
- Part No.:
- BSO110N03MSGXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
BSO110N03MSGXUMA1.pdf
- Description:
- MOSFET N-CH 30V 10A 8DSO
- Quantity:
- Payment:

- Shipping:

Inventory:7,253
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BSO110N03MSGXUMA1 from Infineon Technologies is an N-channel Power-MOSFET in PG-DSO-8 package, optimized for 5 V gate drive in notebook and point-of-load (POL) applications. It delivers RDS(on) = 11.1 mΩ @ VGS = 4.5 V, 12.1 A continuous drain current at TA = 25 °C, and 100% avalanche tested robustness for high-reliability DC-DC conversion stages.
For engineers reviewing the BSO110N03MSGXUMA1 datasheet, BSO110N03MSGXUMA1 pinout, BSO110N03MSGXUMA1 application, or BSO110N03MSGXUMA1 equivalent, key selection criteria include its low gate charge × RDS(on) figure-of-merit (FOM), 30 V VDS rating, thermal resistance RthJA = 110 K/W (min footprint), and qualification for consumer-level operation per IEC 61249-2-21 halogen-free compliance.
Technical Context
This OptiMOS™3 M-Series MOSFET uses trench-based silicon technology to achieve enhanced switching efficiency in high-frequency synchronous buck converters. Its gate threshold voltage (VGS(th) = 1–2 V) enables reliable turn-on with 4.5 V logic-level drivers, while low output capacitance (Coss = 390–520 pF) and fast switching times (tr = 4.4 ns, tf = 4.4 ns) support >1 MHz operation.
The device integrates a robust body diode with Qrr = 10 nC and VSD = 0.86–1.1 V @ IF = 12.1 A, enabling efficient freewheeling in POL topologies. Thermal design is supported by RthJS = 35 K/W and validated 6 cm² copper cooling performance under pulsed and steady-state conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - supports input rails up to 24 V nominal with margin for transients in consumer POL systems |
| RDS(on) @ 4.5 V | 11.1 mΩ max - enables <1 W conduction loss at 10 A, critical for thermally constrained notebook VRMs |
| ID cont @ 25 °C | 12.1 A - sufficient for mid-power CPU/GPU core rail delivery with minimal paralleling |
| Qg total | 7.2–10 nC - low gate drive power demand compatible with integrated PWM controller outputs |
| Ciss | 1100–1500 pF - balances EMI control and switching speed in compact high-density layouts |
| RthJA (min footprint) | 110 K/W - defines minimum PCB copper area required to maintain Tj < 150 °C at full load |
| Avalanche energy EAS | Not specified numerically but 100% single-pulse tested - ensures ruggedness against inductive switching faults |
Pinout & Package
BSO110N03MSGXUMA1 is housed in a surface-mount PG-DSO-8 (SOIC-8 variant with exposed drain pad) package, featuring thermal enhancement via the exposed drain tab soldered to PCB copper.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 8 | Drain (D) | Internally connected to exposed thermal pad; primary current path and heat sink interface |
| 6 | Source (S) | Power return node for load current; referenced to gate drive ground |
| 7 | Gate (G) | Control terminal; requires <10 nC charge for full enhancement; sensitive to ESD |
Key Features
| Feature | Design Value |
|---|---|
| Optimized 4.5 V gate drive | Ensures full enhancement with standard logic-level controllers, eliminating level-shifting in POL designs |
| Low FOM (Qg × RDS(on)) | ~80 mΩ·nC - minimizes combined conduction and switching losses in high-frequency SMPS |
| 100% unclamped inductive avalanche tested | Validates reliability under worst-case short-circuit or di/dt overload without external snubbers |
| Pb-free & halogen-free | Complies with RoHS and IEC 61249-2-21 - meets environmental requirements for global consumer electronics |
Applications
| Notebook Voltage Regulator | GPU Core Power Delivery |
|---|---|
Use Scenario: Primary high-side switch in 1–3 phase synchronous buck converter supplying CPU core voltage (0.7–1.4 V). IC Role / Device Role / Timing Role: High-side power switch; commutates at 300 kHz–1.5 MHz with precise dead-time control. Use Value: Low RDS(on) and Qg reduce total power loss by ≥15% vs. legacy 30 V MOSFETs in same footprint, extending battery runtime. | Use Scenario: High-current phase leg in multi-phase VRM for discrete graphics cards requiring dynamic load response. IC Role / Device Role / Timing Role: Synchronous rectifier in interleaved buck stage; handles peak currents >10 A with <1.1 V body diode drop. Use Value: Verified 100% avalanche rating prevents failure during GPU transient current spikes (di/dt > 200 A/µs). |
| USB-C PD Portable Charger | Industrial PLC I/O Module |
Use Scenario: Output switch in 5–20 V bidirectional buck-boost converter for USB-C Power Delivery negotiation. IC Role / Device Role / Timing Role: Bidirectional power switch; conducts in both directions with low VSD and controlled Qrr. Use Value: Qrr = 10 nC and soft-recovery body diode minimize reverse recovery losses and EMI during mode transitions. | Use Scenario: Load switch for 24 V DC field I/O channels with overcurrent and short-circuit protection. IC Role / Device Role / Timing Role: Protected high-side switch; driven by microcontroller GPIO with integrated current sensing feedback. Use Value: RDS(on) stability over -55 to 150 °C ensures consistent trip thresholds across industrial ambient range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 30 V logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLML6344TRPBF | RDS(on) = 22 mΩ @ 4.5 V; lower ID (4.3 A); SOT-23 package | Lower power density; suitable only for sub-5 A loads | Select when board space is critical and current ≤4 A; not a drop-in replacement due to package and rating mismatch |
| DMN3025LSD-13 | RDS(on) = 2.5 mΩ @ 4.5 V; SO-8 package; higher gate charge (16 nC) | Better conduction loss but slower switching; higher drive power demand | Prefer for ultra-low-loss 5–10 A applications where switching frequency ≤500 kHz |
Compared with IRLML6344TRPBF and DMN3025LSD-13, BSO110N03MSGXUMA1 uniquely balances 12.1 A current capability, 11.1 mΩ on-resistance, and 7.2 nC gate charge in PG-DSO-8 - making it optimal for space-constrained, high-efficiency 1–2 MHz POL converters requiring consumer-grade qualification.
Availability
BSO110N03MSGXUMA1 is available at Aetrix Electronics and suitable for notebook VRMs, GPU power modules, and USB-C PD portable chargers requiring stable component supply and long-term industrial availability.
Supply support for BSO110N03MSGXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
This part belongs to the OptiMOS™3 M-Series - designed specifically for high-efficiency, high-frequency DC-DC conversion in consumer and computing applications where logic-level gate drive and thermal performance are critical.
FAQ
What is the maximum safe operating junction temperature for BSO110N03MSGXUMA1?
The absolute maximum junction temperature is 150 °C, as defined in the datasheet's "Operating and storage temperature" specification. Continuous operation above this limit risks parametric shift and accelerated wear-out; derating is required above 125 °C ambient using the published RthJA curves and thermal footprint guidelines.
Does BSO110N03MSGXUMA1 support synchronous rectification in buck converters?
Yes - its low RDS(on) (11.1 mΩ @ 4.5 V), fast switching (tr/tf = 4.4 ns), and low Qgd (1.6 nC) make it suitable as a synchronous rectifier. The body diode's Qrr = 10 nC and VSD = 0.86 V enable efficient freewheeling with minimal reverse recovery loss.
Is the PG-DSO-8 package lead-free and RoHS compliant?
Yes - the device uses Pb-free plating and complies with RoHS Directive 2011/65/EU. It is also halogen-free per IEC 61249-2-21, with chlorine and bromine content below 900 ppm each, verified by material declaration and testing.
Can BSO110N03MSGXUMA1 be used with 3.3 V gate drive?
No - the gate threshold voltage range is 1–2 V, but full enhancement requires VGS ≥ 4.5 V to achieve rated RDS(on). At 3.3 V, RDS(on) increases significantly (>30 mΩ), causing excessive conduction loss; it is not characterized or guaranteed for 3.3 V operation.
BSO110N03MSGXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 10A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 11mOhm @ 12.1A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 20 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1500 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.56W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-DSO-8
BSO110N03MSGXUMA1 FAQ
1.How can I place an order for BSO110N03MSGXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSO110N03MSGXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSO110N03MSGXUMA1 reliable?
The price and inventory of BSO110N03MSGXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSO110N03MSGXUMA1 is usually 5 days.
3.What payment methods are accepted for BSO110N03MSGXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSO110N03MSGXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSO110N03MSGXUMA1?
BSO110N03MSGXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSO110N03MSGXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSO110N03MSGXUMA1?
For technical support, including BSO110N03MSGXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSO110N03MSGXUMA1 requirements.
6.How does Aetrix verify that BSO110N03MSGXUMA1 is sourced from the original manufacturer or authorized distributors?
All BSO110N03MSGXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSO110N03MSGXUMA1 meets industry standards.
7.What is the process for return or replacement of BSO110N03MSGXUMA1?
All BSO110N03MSGXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSO110N03MSGXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSO110N03MSGXUMA1 part is unused and in its original packaging.
Return procedure for BSO110N03MSGXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BSO110N03MSGXUMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

