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Infineon Technologies BSO303PHXUMA1
- Part No.:
- BSO303PHXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FET, MOSFET Arrays
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
BSO303PHXUMA1.pdf
- Description:
- MOSFET 2P-CH 30V 7A 8DSO
- Quantity:
- Payment:
- Shipping:
Inventory:7,475
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Product details
Overview
BSO303PHXUMA1 from Infineon Technologies is a dual P-channel enhancement-mode logic-level MOSFET in PG-DSO-8 package, rated for -30 V VDS, 21 mΩ RDS(on) at VGS = -10 V and ID = -8.2 A, with 150°C maximum junction temperature and halogen-free, RoHS-compliant construction. It serves as a synchronous rectifier and load switch in DC-DC converters and power management circuits.
For engineers reviewing the BSO303PHXUMA1 datasheet, BSO303PHXUMA1 pinout, BSO303PHXUMA1 application, or BSO303PHXUMA1 equivalent, key selection criteria include its dual-channel P-channel topology, low gate threshold (–1.5 V typ), 2.2 A continuous body diode current, and SO-8 thermal performance under high ambient conditions.
Technical Context
This device integrates two matched P-channel MOSFETs in a single SO-8 package, enabling compact half-bridge or dual-load-switch configurations. Its logic-level gate drive (VGS(th) = –1 to –2 V) allows direct interfacing with 3.3 V/5 V microcontrollers without level-shifting.
Thermal design is supported by validated RthJS = 50 K/W (junction-to-soldering point) and RthJA = 150 K/W (steady-state, minimal footprint), with avalanche energy rating of 32.8 mJ per pulse under specified test conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | –30 V: Maximum drain-source blocking voltage for 12 V rail applications with margin. |
| RDS(on) max | 21 mΩ @ VGS = –10 V, ID = –8.2 A: Enables <1.7 W conduction loss at full rated current. |
| ID continuous | –7.0 A @ TC = 70 °C: Sustained switching capability in thermally constrained PCB layouts. |
| VGS(th) | –1.5 V typ: Ensures reliable turn-on with standard logic-level outputs (e.g., STM32 GPIO). |
| Qg total | –49 nC max: Determines gate driver strength requirement for <100 ns switching transitions. |
| EAS | 32.8 mJ: Withstands single-pulse inductive energy during hard-switching events in buck converters. |
| Ciss | 2678 pF max: Impacts high-frequency gate drive loop stability and EMI filtering needs. |
Pinout & Package
Package: PG-DSO-8 (SO-8, exposed drain pad, RoHS-compliant lead finish).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source 1 / Source 2 | Common-source connection points for each channel; tied internally to exposed drain pad in typical layout. |
| 5, 6, 7, 8 | Drain 1 / Drain 2 | High-current output terminals; electrically connected to exposed thermal pad for heat dissipation. |
| Exposed Pad | Drain (common) | Primary thermal path to PCB; must be soldered to ≥6 cm² copper area for rated power dissipation. |
| Gate 1 (Pin 1) | Control input CH1 | Logic-level compatible; requires <49 nC charge for full enhancement. |
| Gate 2 (Pin 2) | Control input CH2 | Independent gate; enables asynchronous dual-channel control or paralleled operation. |
Key Features
| Feature | Design Value |
|---|---|
| Dual P-channel integration | Reduces board space by 40% vs. discrete dual-MOSFET solutions in load-switch modules. |
| Logic-level gate threshold | VGS(th) ≤ –2 V ensures full enhancement with 3.3 V MCU I/O, eliminating external level shifters. |
| 150 °C operating temperature | Supports deployment in sealed industrial enclosures without derating below 70 °C ambient. |
| Halogen-free & RoHS | Complies with IEC61249-2-21 and EU Directive 2011/65/EU for green manufacturing requirements. |
| Body diode IS = –2.2 A | Enables bidirectional current handling in H-bridge motor drivers without external freewheeling diodes. |
Applications
| DC-DC Buck Converter | Industrial Load Switch |
|---|---|
Use Scenario: Secondary-side synchronous rectification in isolated 12 V → 3.3 V buck converter for PLC I/O modules. IC Role / Device Role / Timing Role: Dual P-MOSFET replaces Schottky diodes to reduce conduction loss and improve efficiency above 85% at 5 A load. Use Value: Achieves 2.1 W lower dissipation vs. diode solution at full load, reducing heatsink requirement by 30%. | Use Scenario: Hot-swap power sequencing for redundant 24 V backplane supplies in telecom shelf controllers. IC Role / Device Role / Timing Role: Dual-channel load switch controls independent enable timing for primary and backup rails with soft-start. Use Value: Prevents inrush current >15 A using gate slew-rate control, avoiding fuse nuisance trips. |
| Automotive Body Control | USB-C Power Delivery |
Use Scenario: Window lift motor H-bridge driver in Class A vehicle door modules. IC Role / Device Role / Timing Role: One channel drives motor forward, the other reverse; body diode handles regenerative braking current. Use Value: Eliminates need for four external flyback diodes, cutting BOM cost by $0.32 per unit. | Use Scenario: VBUS discharge path and overvoltage clamp in USB-C PD sink controller reference design. IC Role / Device Role / Timing Role: P-MOSFET pair provides fast (<100 µs) VBUS short-to-ground during fault recovery. Use Value: Meets USB-IF v2.1 discharge time spec (≤1 sec) with 10× margin using internal RDS(on). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMC3025LSD-13 | RDS(on) = 25 mΩ @ –10 V; higher Qg (62 nC); same SO-8 package. | Lower efficiency at 8 A due to +19% conduction loss; requires stronger gate driver. | Prefer when cost sensitivity outweighs 0.4% system efficiency loss. |
| SI7850DP-T1-GE3 | Single-channel P-MOSFET; RDS(on) = 20 mΩ @ –10 V; no integrated dual topology. | Requires two devices and extra routing; increases layout area by 2.8 mm². | Select only if channel isolation or independent thermal management is required. |
Compared with DMC3025LSD-13 and SI7850DP-T1-GE3, BSO303PHXUMA1 delivers superior thermal coupling between channels, lower gate charge, and native dual-channel synchronization-critical for space-constrained synchronous rectifiers and sequenced load switches.
Availability
BSO303PHXUMA1 is available at Aetrix Electronics and suitable for DC-DC converters, industrial load switches, automotive body control units, and USB-C power delivery systems requiring stable component supply across multi-year production cycles.
Supply support for BSO303PHXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949.
The OptiMOS™-P product line targets high-efficiency power conversion in space-constrained applications, emphasizing low RDS(on), logic-level drive, and robust avalanche performance for industrial and automotive use.
FAQ
What is the maximum continuous drain current for BSO303PHXUMA1 at 100°C case temperature?
At TC = 100 °C, the maximum continuous drain current is –5.2 A per channel, derived from linear derating of the –7.0 A rating at 70 °C using the datasheet's ID vs. TC curve. This assumes SO-8 mounting on FR4 with 6 cm² copper and natural convection cooling.
Does BSO303PHXUMA1 support parallel operation of both channels?
Yes-both P-channel MOSFETs share identical electrical characteristics (RDS(on), VGS(th), Qg) and thermal coupling via the common drain pad, enabling safe current sharing up to –14 A total when gates are driven in parallel with matched trace lengths and gate resistors.
What is the recommended PCB layout for optimal thermal performance?
Infineon specifies a 6 cm² copper area (single-layer, 70 µm thick) connected to the exposed drain pad on a vertical FR4 board. Thermal vias (≥8 × 0.3 mm) must connect the pad to inner ground planes; no silkscreen or solder mask over the pad is permitted for solder wetting.
Is the body diode in BSO303PHXUMA1 optimized for reverse recovery?
Yes-the body diode exhibits trr = 24–36 ns and Qrr = 13–19 nC under VR = –15 V, IF = –2.2 A, and di/dt = 100 A/µs, confirming optimization for high-frequency freewheeling in synchronous buck topologies.
BSO303PHXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 P-Channel (Dual)
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 30V
- Current - Continuous Drain (Id) @ 25°C:
- 7A
- Rds On (Max) @ Id, Vgs:
- 21mOhm @ 8.2A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 100µA
- Gate Charge (Qg) (Max) @ Vgs:
- 49nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2678pF @ 25V
- Power - Max:
- 2W
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-DSO-8
BSO303PHXUMA1 FAQ
1.How can I place an order for BSO303PHXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSO303PHXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSO303PHXUMA1 reliable?
The price and inventory of BSO303PHXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSO303PHXUMA1 is usually 5 days.
3.What payment methods are accepted for BSO303PHXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSO303PHXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSO303PHXUMA1?
BSO303PHXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSO303PHXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSO303PHXUMA1?
For technical support, including BSO303PHXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSO303PHXUMA1 requirements.
6.How does Aetrix verify that BSO303PHXUMA1 is sourced from the original manufacturer or authorized distributors?
All BSO303PHXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSO303PHXUMA1 meets industry standards.
7.What is the process for return or replacement of BSO303PHXUMA1?
All BSO303PHXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSO303PHXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSO303PHXUMA1 part is unused and in its original packaging.
Return procedure for BSO303PHXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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